JP2014218732A - マスク - Google Patents
マスク Download PDFInfo
- Publication number
- JP2014218732A JP2014218732A JP2014003152A JP2014003152A JP2014218732A JP 2014218732 A JP2014218732 A JP 2014218732A JP 2014003152 A JP2014003152 A JP 2014003152A JP 2014003152 A JP2014003152 A JP 2014003152A JP 2014218732 A JP2014218732 A JP 2014218732A
- Authority
- JP
- Japan
- Prior art keywords
- mask
- main body
- mask according
- bent
- bent portions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 229920000642 polymer Polymers 0.000 claims description 4
- 229910052718 tin Inorganic materials 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 150000002739 metals Chemical class 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 21
- 238000005019 vapor deposition process Methods 0.000 abstract description 8
- 238000003466 welding Methods 0.000 abstract description 8
- 238000004140 cleaning Methods 0.000 abstract description 4
- 229910001111 Fine metal Inorganic materials 0.000 description 13
- 238000004519 manufacturing process Methods 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 239000011651 chromium Substances 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 239000011135 tin Substances 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 230000009466 transformation Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000005323 electroforming Methods 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C17/00—Hand tools or apparatus using hand held tools, for applying liquids or other fluent materials to, for spreading applied liquids or other fluent materials on, or for partially removing applied liquids or other fluent materials from, surfaces
- B05C17/06—Stencils
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C21/00—Accessories or implements for use in connection with applying liquids or other fluent materials to surfaces, not provided for in groups B05C1/00 - B05C19/00
- B05C21/005—Masking devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/32—Processes for applying liquids or other fluent materials using means for protecting parts of a surface not to be coated, e.g. using stencils, resists
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
Abstract
Description
110:本体部
111a、111b:開口部
120、220、320、420、520:変形部
121:第1屈曲部
222:第2屈曲部
323:第3屈曲部
Claims (18)
- 開口部が形成された板状の本体部と、
前記本体部から第1方向に突出するように形成され、第2方向に沿って延長形成される少なくとも1つの第1屈曲部を含む変形部とを含むことを特徴とするマスク。 - 前記少なくとも1つの第1屈曲部が、複数の第1屈曲部のうちの1つであり、
前記複数の第1屈曲部が、互いに一定間隔で離隔するように形成され、
前記複数の第1屈曲部それぞれの間に前記開口部が位置することを特徴とする請求項1に記載のマスク。 - 前記少なくとも1つの第1屈曲部が、前記本体部の1つ以上の特定領域に形成されたことを特徴とする請求項1に記載のマスク。
- 前記1つ以上の特定領域が、前記本体部の中央領域に形成されたことを特徴とする請求項3に記載のマスク。
- 前記1つ以上の特定領域が、前記本体部の1つ以上の角に隣接して形成されたことを特徴とする請求項3に記載のマスク。
- 前記第1屈曲部の垂直断面の形状が、半円形、半楕円形および多角形の中から選択されたいずれか1つであることを特徴とする請求項1から5のいずれか一項に記載のマスク。
- 前記変形部が、
前記本体部から前記第1方向に突出するように形成され、前記第2方向と直交する第3方向に延長形成された少なくとも1つの第2屈曲部をさらに含むことを特徴とする請求項1から6のいずれか一項に記載のマスク。 - 前記少なくとも1つの第2屈曲部が、複数の第2屈曲部のうちの1つであり、
前記複数の第2屈曲部が、互いに一定間隔で離隔するように形成され、
前記複数の第2屈曲部それぞれの間に前記開口部が位置することを特徴とする請求項7に記載のマスク。 - 前記複数の第2屈曲部が、前記本体部の1つ以上の特定領域に形成されたことを特徴とする請求項7または8に記載のマスク。
- 前記1つ以上の特定領域が、前記本体部の中央領域に形成されたことを特徴とする請求項9に記載のマスク。
- 前記1つ以上の特定領域が、前記本体部の1つ以上の角に隣接して形成されたことを特徴とする請求項9に記載のマスク。
- 前記第2屈曲部の垂直断面の形状が、半円形、半楕円形および多角形の中から選択されたいずれか1つであることを特徴とする請求項7から11のいずれか一項に記載のマスク。
- 前記第1方向が、前記本体部を基準として上方または下方に延長されることを特徴とする請求項1から12のいずれか一項に記載のマスク。
- 前記変形部が、少なくとも2つの第1屈曲部を含み、
前記少なくとも2つの第1屈曲部のうちの少なくとも1つは、前記第1方向に突出し、
前記少なくとも2つの第1屈曲部のうちの少なくとも他の1つは、前記第1方向と反対方向に突出することを特徴とする請求項1から13のいずれか一項に記載のマスク。 - 前記変形部が、Cr、Cu、Ni、Fe、Sn、TiおよびAlのうちのいずれか1つ以上の金属を含むことを特徴とする請求項1から14のいずれか一項に記載のマスク。
- 前記変形部は、ポリマーからなることを特徴とする請求項1から14のいずれか一項に記載のマスク。
- 前記変形部が、前記本体部と同一または異なる素材からなることを特徴とする請求項1から16のいずれか一項に記載のマスク。
- 前記本体部の厚さが一定に維持され、前記本体部の異なる寸法のうちの少なくとも1つが増加するように、前記変形部が前記本体部に加えられる引張力によって展開されながら変形するように構成されていることを特徴とする請求項1から17のいずれか一項に記載のマスク。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2013-0053238 | 2013-05-10 | ||
KR1020130053238A KR102160695B1 (ko) | 2013-05-10 | 2013-05-10 | 마스크 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014218732A true JP2014218732A (ja) | 2014-11-20 |
JP6286210B2 JP6286210B2 (ja) | 2018-02-28 |
Family
ID=51850438
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014003152A Active JP6286210B2 (ja) | 2013-05-10 | 2014-01-10 | マスク |
Country Status (5)
Country | Link |
---|---|
US (1) | US9435019B2 (ja) |
JP (1) | JP6286210B2 (ja) |
KR (1) | KR102160695B1 (ja) |
CN (1) | CN104141106B (ja) |
TW (1) | TWI645245B (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20180209027A1 (en) * | 2017-01-23 | 2018-07-26 | Boe Technology Group Co., Ltd. | Mask for sputtering film formation and sputtering device |
CN111373070A (zh) * | 2017-11-21 | 2020-07-03 | Lg伊诺特有限公司 | 金属板和使用其的沉积掩模 |
JP7166689B1 (ja) * | 2022-03-25 | 2022-11-08 | 株式会社プロセス・ラボ・ミクロン | メタルマスク |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102250047B1 (ko) * | 2014-10-31 | 2021-05-11 | 삼성디스플레이 주식회사 | 마스크 프레임 조립체, 그 제조 방법 및 유기 발광 표시 장치의 제조 방법 |
US9695522B2 (en) * | 2014-11-21 | 2017-07-04 | Samsung Display Co., Ltd. | Deposition mask, method of manufacturing deposition mask, and method of manufacturing display apparatus |
KR102352280B1 (ko) * | 2015-04-28 | 2022-01-18 | 삼성디스플레이 주식회사 | 마스크 프레임 조립체 제조 장치 및 이를 이용한 마스크 프레임 조립체 제조 방법 |
KR102586048B1 (ko) * | 2016-01-12 | 2023-10-10 | 삼성디스플레이 주식회사 | 마스크 조립체, 이의 제조방법 및 이를 포함한 표시 장치의 제조장치 |
WO2018111822A1 (en) * | 2016-12-15 | 2018-06-21 | Cummins Filtration Ip, Inc. | Tetrahedral filter media |
CN106591775B (zh) * | 2016-12-26 | 2019-06-07 | 京东方科技集团股份有限公司 | 掩膜板本体、掩膜板及其制作方法 |
KR102657827B1 (ko) | 2017-01-17 | 2024-04-17 | 다이니폰 인사츠 가부시키가이샤 | 중간 제품 |
JP6428903B2 (ja) | 2017-01-17 | 2018-11-28 | 大日本印刷株式会社 | 蒸着マスク及び蒸着マスクの製造方法 |
TWI618447B (zh) * | 2017-05-09 | 2018-03-11 | 友達光電股份有限公司 | 遮罩 |
CN108198958B (zh) * | 2018-01-30 | 2020-06-30 | 京东方科技集团股份有限公司 | 显示基板及其制作方法、制作设备、显示装置 |
KR102149060B1 (ko) * | 2018-03-30 | 2020-08-28 | 경기대학교 산학협력단 | 유기발광다이오드 패널 제조용 파인 메탈 마스크 |
CN108796435B (zh) * | 2018-05-28 | 2020-06-16 | 昆山国显光电有限公司 | 掩模版及其制作方法 |
CN109207920B (zh) * | 2018-11-12 | 2021-02-09 | 京东方科技集团股份有限公司 | 掩模版 |
CN109852926B (zh) * | 2019-04-01 | 2020-11-24 | 京东方科技集团股份有限公司 | 一种掩膜版和蒸镀装置 |
US11885005B2 (en) | 2019-10-16 | 2024-01-30 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Mask and manufacturing method therefor, and manufacturing method for display substrate |
US20230255055A1 (en) * | 2021-01-28 | 2023-08-10 | Boe Technology Group Co., Ltd. | Mask, Manufacturing Method Thereof and Mask Assembly |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4626737A (en) * | 1981-02-25 | 1986-12-02 | Tokyo Shibaura Denki Kabushiki Kaisha | Mask focusing color picture tube |
KR20030077370A (ko) * | 2002-03-26 | 2003-10-01 | 엘지.필립스 엘시디 주식회사 | 새도우 마스크와 이를 이용한 유기전계발광 디스플레이소자 제조방법 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3829983A (en) * | 1971-10-27 | 1974-08-20 | Phillips Petroleum Co | Grid plate |
US3944867A (en) * | 1974-03-15 | 1976-03-16 | Zenith Radio Corporation | Shadow mask having ribs bounding rectangular apertures |
US5790283A (en) * | 1995-09-29 | 1998-08-04 | Litel Instruments | Optimization of overlapping holographic lens array for creating via matrix |
US6372647B1 (en) * | 1999-12-14 | 2002-04-16 | International Business Machines Corporation | Via masked line first dual damascene |
US6926840B2 (en) * | 2002-12-31 | 2005-08-09 | Eastman Kodak Company | Flexible frame for mounting a deposition mask |
FR2858694B1 (fr) * | 2003-08-07 | 2006-08-18 | Commissariat Energie Atomique | Procede de realisation de motifs a flancs inclines par photolithographie |
KR100561705B1 (ko) | 2004-06-18 | 2006-03-15 | 전자부품연구원 | 니켈 전주도금법을 이용한 금속마스크 제작방법 및 이를이용한 금속 마스크 |
KR100603402B1 (ko) | 2004-11-24 | 2006-07-20 | 삼성에스디아이 주식회사 | 박막 증착용 마스크 프레임 어셈블리 |
KR101139323B1 (ko) | 2005-06-30 | 2012-04-26 | 엘지디스플레이 주식회사 | 유기전계 발광소자 제조 용 쉐도우 마스크 제조 방법 |
KR101156442B1 (ko) * | 2010-04-29 | 2012-06-18 | 삼성모바일디스플레이주식회사 | 마스크 프레임 조립체 |
KR101693578B1 (ko) * | 2011-03-24 | 2017-01-10 | 삼성디스플레이 주식회사 | 증착 마스크 |
-
2013
- 2013-05-10 KR KR1020130053238A patent/KR102160695B1/ko active IP Right Grant
- 2013-09-03 US US14/017,057 patent/US9435019B2/en active Active
-
2014
- 2014-01-10 JP JP2014003152A patent/JP6286210B2/ja active Active
- 2014-01-14 CN CN201410015576.5A patent/CN104141106B/zh active Active
- 2014-01-28 TW TW103103130A patent/TWI645245B/zh active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4626737A (en) * | 1981-02-25 | 1986-12-02 | Tokyo Shibaura Denki Kabushiki Kaisha | Mask focusing color picture tube |
KR20030077370A (ko) * | 2002-03-26 | 2003-10-01 | 엘지.필립스 엘시디 주식회사 | 새도우 마스크와 이를 이용한 유기전계발광 디스플레이소자 제조방법 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20180209027A1 (en) * | 2017-01-23 | 2018-07-26 | Boe Technology Group Co., Ltd. | Mask for sputtering film formation and sputtering device |
CN111373070A (zh) * | 2017-11-21 | 2020-07-03 | Lg伊诺特有限公司 | 金属板和使用其的沉积掩模 |
JP7166689B1 (ja) * | 2022-03-25 | 2022-11-08 | 株式会社プロセス・ラボ・ミクロン | メタルマスク |
Also Published As
Publication number | Publication date |
---|---|
CN104141106A (zh) | 2014-11-12 |
JP6286210B2 (ja) | 2018-02-28 |
US9435019B2 (en) | 2016-09-06 |
US20140331925A1 (en) | 2014-11-13 |
KR102160695B1 (ko) | 2020-09-29 |
CN104141106B (zh) | 2018-08-24 |
TW201443547A (zh) | 2014-11-16 |
KR20140133277A (ko) | 2014-11-19 |
TWI645245B (zh) | 2018-12-21 |
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