JP2014209590A - 積層インダクタ - Google Patents
積層インダクタ Download PDFInfo
- Publication number
- JP2014209590A JP2014209590A JP2014052854A JP2014052854A JP2014209590A JP 2014209590 A JP2014209590 A JP 2014209590A JP 2014052854 A JP2014052854 A JP 2014052854A JP 2014052854 A JP2014052854 A JP 2014052854A JP 2014209590 A JP2014209590 A JP 2014209590A
- Authority
- JP
- Japan
- Prior art keywords
- electrode layer
- layer
- electrode
- thickness
- multilayer inductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims abstract description 14
- 238000003475 lamination Methods 0.000 claims description 2
- 239000010949 copper Substances 0.000 description 30
- 229910000679 solder Inorganic materials 0.000 description 19
- 238000007747 plating Methods 0.000 description 17
- 230000000052 comparative effect Effects 0.000 description 12
- 229910045601 alloy Inorganic materials 0.000 description 11
- 239000000956 alloy Substances 0.000 description 11
- 239000012212 insulator Substances 0.000 description 6
- 229910016347 CuSn Inorganic materials 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 230000003628 erosive effect Effects 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical class [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000012266 salt solution Substances 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Coils Or Transformers For Communication (AREA)
- Microelectronics & Electronic Packaging (AREA)
Abstract
Description
本発明の積層インダクタは積層体と積層体の外面に位置する外部電極とを備える。積層体は、非磁性層からなる絶縁部と、絶縁部に挟まれるように位置する導体からなるコイル部と、を有する。外部電極はコイル部の端部と電気的に結合している。外部電極はAgを主成分とする第一電極層と、積層体からみて第一電極層の外側に位置するCuを主成分とする第二電極層と、を有する。第二電極層は4μm以上の厚さをもち、第一電極層と第二電極層との厚みの合計は5μm以上であり、好ましくは10μm以下である。積層インダクタ(チップ)の長さは好ましくは0.6mm以下であり、幅は好ましくは0.3mm以下である。
このようにして、実施例、比較例の積層インダクタを得た。
比較例1:第一電極層(Ag層、1.1μm)、第二電極層(Ni層、3.9μm)、厚み比率(0.28)
比較例2:第一電極層(Ag層、1.1μm)、第二電極層(Ni層、5.8μm)、厚み比率(0.19)
比較例3:第一電極層(Ag層、5.0μm)、第二電極層(Cu層、3.0μm)、厚み比率(1.67)
実施例1:第一電極層(Ag層、1.0μm)、第二電極層(Cu層、4.0μm)、厚み比率(0.25)
実施例2:第一電極層(Ag層、2.0μm)、第二電極層(Cu層、5.0μm)、厚み比率(0.40)
実施例3:第一電極層(Ag層、2.0μm)、第二電極層(Cu層、8.0μm)、厚み比率(0.25)
実施例4:第一電極層(Ag層、4.0μm)、第二電極層(Cu層、7.0μm)、厚み比率(0.57)
実施例5:第一電極層(AgPd合金層、2.0μm)、第二電極層(Cu層、5.0μm)、厚み比率(0.40)
実施例6:第一電極層(Ag層、0.9μm)、第二電極層(Cu+CuSn合金層、9.0μm)、厚み比率(0.10)
実施例7:第一電極層(Ag層、1.1μm)、第二電極層(Cu層、4.0μm)、厚み比率(0.28)
実施例8:第一電極層(Ag層、3.0μm)、第二電極層(Cu層、4.0μm)、厚み比率(0.75)
実施例9:第一電極層(Ag層、1.1μm)、第二電極層(Cu層、4.0μm)、厚み比率(0.28)
実施例10:第一電極層(Ag層、2.5μm)、第二電極層(Cu層、4.0μm)、厚み比率(0.63)
比較例1:R値(262.1mΩ)、Q値(54.2)、半田良否(○)
比較例2:R値(261.0mΩ)、Q値(55.1)、半田良否(○)
比較例3:R値(190.4mΩ)、Q値(68.0)、半田良否(×)
実施例1:R値(212.2mΩ)、Q値(77.9)、半田良否(○)
実施例2:R値(195.2mΩ)、Q値(78.1)、半田良否(○)
実施例3:R値(186.8mΩ)、Q値(74.3)、半田良否(○)
実施例4:R値(183.1mΩ)、Q値(66.8)、半田良否(○)
実施例5:R値(201.2mΩ)、Q値(75.1)、半田良否(○)
実施例6:R値(208.1mΩ)、Q値(72.6)、半田良否(○)
実施例7:R値(205.3mΩ)、Q値(78.5)、半田良否(○)
実施例8:R値(203.7mΩ)、Q値(74.3)、半田良否(○)
実施例9:R値(378.7mΩ)、Q値(38.8)、半田良否(○)
実施例10:R値(369.1mΩ)、Q値(30.0)、半田良否(○)
10:外部電極
11:第一電極層
12:第二電極層
13:第三電極層
A21〜A29:絶縁体層
B21〜B26:導体パターン
C21〜C25:ビアホール導体
Claims (3)
- 非磁性層からなる絶縁部と、前記絶縁部に挟まれるように位置する導体からなるコイル部と、を有する積層体、ならびに、前記コイル部の端部と電気的に結合し前記積層体の外面に位置する外部電極を備え、前記外部電極はAgを主成分とする第一電極層と、前記積層体からみて前記第一電極層の外側に位置するCuを主成分とする4μm以上の厚さをもつ第二電極層と、を有し、第一電極層と第二電極層との厚みの合計が5μm以上である、積層インダクタ。
- 第一電極層と第二電極層との厚みの合計が10μm以下である請求項1に記載の積層インダクタ。
- 積層方向に垂直な断面が0.6mm以下の長辺および0.3mm以下の短辺をもつ方形状を呈する請求項1又は2に記載の積層インダクタ。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014052854A JP6407540B2 (ja) | 2013-03-29 | 2014-03-15 | 積層インダクタ |
KR1020140031424A KR101540007B1 (ko) | 2013-03-29 | 2014-03-18 | 적층 인덕터 |
US14/228,878 US9129737B2 (en) | 2013-03-29 | 2014-03-28 | Laminated inductor |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013074885 | 2013-03-29 | ||
JP2013074885 | 2013-03-29 | ||
JP2014052854A JP6407540B2 (ja) | 2013-03-29 | 2014-03-15 | 積層インダクタ |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018175314A Division JP6525392B2 (ja) | 2013-03-29 | 2018-09-19 | 積層インダクタ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014209590A true JP2014209590A (ja) | 2014-11-06 |
JP6407540B2 JP6407540B2 (ja) | 2018-10-17 |
Family
ID=51620213
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014052854A Active JP6407540B2 (ja) | 2013-03-29 | 2014-03-15 | 積層インダクタ |
Country Status (3)
Country | Link |
---|---|
US (1) | US9129737B2 (ja) |
JP (1) | JP6407540B2 (ja) |
KR (1) | KR101540007B1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6996486B2 (ja) | 2018-12-17 | 2022-01-17 | 株式会社村田製作所 | 巻線型インダクタ部品 |
US11538618B2 (en) * | 2019-01-09 | 2022-12-27 | Samsung Electro-Mechanics Co., Ltd. | Coil component |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5999122B2 (ja) * | 2014-02-20 | 2016-09-28 | 株式会社村田製作所 | インダクタの製造方法 |
KR20170097882A (ko) * | 2016-02-19 | 2017-08-29 | 삼성전기주식회사 | 코일 부품 |
KR101994755B1 (ko) * | 2017-09-22 | 2019-09-24 | 삼성전기주식회사 | 전자부품 |
KR102538911B1 (ko) * | 2018-02-08 | 2023-06-01 | 삼성전기주식회사 | 인덕터 |
KR102584974B1 (ko) * | 2018-10-17 | 2023-10-05 | 삼성전기주식회사 | 적층 세라믹 전자부품 및 그에 포함된 인터포저 |
JP7081547B2 (ja) * | 2019-03-27 | 2022-06-07 | 株式会社村田製作所 | 多層金属膜およびインダクタ部品 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006024712A (ja) * | 2004-07-07 | 2006-01-26 | Tdk Corp | 表面実装型電子部品 |
JP2012079870A (ja) * | 2010-09-30 | 2012-04-19 | Tdk Corp | 電子部品 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05326318A (ja) * | 1992-05-20 | 1993-12-10 | Tdk Corp | セラミック電子部品 |
JPH0629144A (ja) * | 1992-07-08 | 1994-02-04 | Tdk Corp | セラミック電子部品 |
CN102113069B (zh) * | 2008-07-30 | 2013-03-27 | 太阳诱电株式会社 | 叠层电感器、其制造方法和叠层扼流线圈 |
JP5897247B2 (ja) * | 2009-10-22 | 2016-03-30 | Tdk株式会社 | 電子部品及び電子部品の製造方法 |
JP2012182379A (ja) * | 2011-03-02 | 2012-09-20 | Murata Mfg Co Ltd | 多層チップ部品およびその製造方法 |
KR101228752B1 (ko) * | 2011-11-04 | 2013-01-31 | 삼성전기주식회사 | 적층 세라믹 전자 부품 및 그 제조 방법 |
-
2014
- 2014-03-15 JP JP2014052854A patent/JP6407540B2/ja active Active
- 2014-03-18 KR KR1020140031424A patent/KR101540007B1/ko active IP Right Grant
- 2014-03-28 US US14/228,878 patent/US9129737B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006024712A (ja) * | 2004-07-07 | 2006-01-26 | Tdk Corp | 表面実装型電子部品 |
JP2012079870A (ja) * | 2010-09-30 | 2012-04-19 | Tdk Corp | 電子部品 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6996486B2 (ja) | 2018-12-17 | 2022-01-17 | 株式会社村田製作所 | 巻線型インダクタ部品 |
US11462353B2 (en) | 2018-12-17 | 2022-10-04 | Murata Manufacturing Co., Ltd. | Winding inductor component |
US11538618B2 (en) * | 2019-01-09 | 2022-12-27 | Samsung Electro-Mechanics Co., Ltd. | Coil component |
Also Published As
Publication number | Publication date |
---|---|
US9129737B2 (en) | 2015-09-08 |
KR20140118779A (ko) | 2014-10-08 |
KR101540007B1 (ko) | 2015-07-28 |
JP6407540B2 (ja) | 2018-10-17 |
US20140292470A1 (en) | 2014-10-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6407540B2 (ja) | 積層インダクタ | |
KR101670184B1 (ko) | 적층 전자부품 및 그 제조방법 | |
KR102138887B1 (ko) | 칩 전자부품 및 그 제조방법 | |
KR102127811B1 (ko) | 적층 전자부품 및 그 제조방법 | |
KR102004787B1 (ko) | 적층형 전자부품 및 그 제조방법 | |
US11688555B2 (en) | Chip electronic component | |
KR102642913B1 (ko) | 적층 전자부품 및 그 제조방법 | |
US20150109088A1 (en) | Chip electronic component and manufacturing method thereof | |
US9779867B2 (en) | Electronic component and board having the same | |
TWI647720B (zh) | Coil part | |
KR20170032057A (ko) | 적층 전자부품 | |
JP6750776B2 (ja) | コイル電子部品及びその製造方法 | |
US20160099100A1 (en) | Chip component and manufacturing method thereof | |
KR101532172B1 (ko) | 칩 전자부품 및 그 실장기판 | |
KR20160000612A (ko) | 칩형 코일 부품 및 그 제조방법 | |
KR102130672B1 (ko) | 적층 전자부품 및 그 제조방법 | |
KR20160057785A (ko) | 칩 전자부품 및 그 제조방법 | |
KR20150089279A (ko) | 칩형 코일 부품 | |
JP2014154839A (ja) | 積層コイル部品 | |
KR20150134858A (ko) | 칩 전자부품 및 그 실장기판 | |
JP6525392B2 (ja) | 積層インダクタ | |
JP4216856B2 (ja) | 積層型電子部品 | |
JP2005252141A (ja) | 電子部品及びその製造方法 | |
JP2023102541A (ja) | コイル部品及びコイル部品の製造方法 | |
JP2017045777A (ja) | 積層コイル部品 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20170127 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20180112 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180119 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180319 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20180824 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20180919 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6407540 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |