JP2014195059A5 - - Google Patents
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- Publication number
- JP2014195059A5 JP2014195059A5 JP2014034648A JP2014034648A JP2014195059A5 JP 2014195059 A5 JP2014195059 A5 JP 2014195059A5 JP 2014034648 A JP2014034648 A JP 2014034648A JP 2014034648 A JP2014034648 A JP 2014034648A JP 2014195059 A5 JP2014195059 A5 JP 2014195059A5
- Authority
- JP
- Japan
- Prior art keywords
- magnetic thin
- thin film
- electronic components
- electronic device
- magnetic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010409 thin film Substances 0.000 claims description 31
- 239000000203 mixture Substances 0.000 claims description 11
- 239000010408 film Substances 0.000 claims description 9
- 230000035699 permeability Effects 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014034648A JP2014195059A (ja) | 2013-02-27 | 2014-02-25 | 電子装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013037549 | 2013-02-27 | ||
| JP2013037549 | 2013-02-27 | ||
| JP2014034648A JP2014195059A (ja) | 2013-02-27 | 2014-02-25 | 電子装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2014195059A JP2014195059A (ja) | 2014-10-09 |
| JP2014195059A5 true JP2014195059A5 (enExample) | 2017-01-19 |
Family
ID=51387923
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014034648A Pending JP2014195059A (ja) | 2013-02-27 | 2014-02-25 | 電子装置 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US9510490B2 (enExample) |
| JP (1) | JP2014195059A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5988004B1 (ja) * | 2016-04-12 | 2016-09-07 | Tdk株式会社 | 電子回路パッケージ |
| US12696389B2 (en) * | 2023-08-17 | 2026-07-28 | Nxp Usa, Inc. | Reusable modular substrate |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6218739A (ja) * | 1985-07-18 | 1987-01-27 | Sumitomo Electric Ind Ltd | 混成集積回路 |
| JP2001297905A (ja) * | 2000-04-17 | 2001-10-26 | Tokin Corp | 高周波電流抑制体 |
| EP1667227A4 (en) * | 2004-01-28 | 2011-08-03 | Panasonic Corp | MODULE AND ATTACHMENT STRUCTURE THEREWITH |
| JP2005235983A (ja) * | 2004-02-19 | 2005-09-02 | Sony Chem Corp | センサー部品 |
| JP4417377B2 (ja) | 2004-02-24 | 2010-02-17 | 信越ポリマー株式会社 | 電磁波ノイズ抑制体、電磁波ノイズ抑制機能付構造体、およびそれらの製造方法 |
| JP4773254B2 (ja) * | 2006-03-15 | 2011-09-14 | 太陽誘電株式会社 | 高周波磁性薄膜及び高周波電子デバイス |
| JP2008010859A (ja) * | 2006-06-02 | 2008-01-17 | Renesas Technology Corp | 半導体装置 |
| JP2008085089A (ja) * | 2006-09-28 | 2008-04-10 | Matsushita Electric Ind Co Ltd | 樹脂配線基板および半導体装置 |
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2014
- 2014-02-25 JP JP2014034648A patent/JP2014195059A/ja active Pending
- 2014-02-26 US US14/190,640 patent/US9510490B2/en active Active