JP2014195059A - 電子装置 - Google Patents

電子装置 Download PDF

Info

Publication number
JP2014195059A
JP2014195059A JP2014034648A JP2014034648A JP2014195059A JP 2014195059 A JP2014195059 A JP 2014195059A JP 2014034648 A JP2014034648 A JP 2014034648A JP 2014034648 A JP2014034648 A JP 2014034648A JP 2014195059 A JP2014195059 A JP 2014195059A
Authority
JP
Japan
Prior art keywords
magnetic thin
film
thin film
thin films
circuit unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014034648A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014195059A5 (enExample
Inventor
Tomoki Kobayashi
智樹 小林
Tomoji Fujii
朋治 藤井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2014034648A priority Critical patent/JP2014195059A/ja
Publication of JP2014195059A publication Critical patent/JP2014195059A/ja
Publication of JP2014195059A5 publication Critical patent/JP2014195059A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0075—Magnetic shielding materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233—Filters, inductors or a magnetic substance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP2014034648A 2013-02-27 2014-02-25 電子装置 Pending JP2014195059A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014034648A JP2014195059A (ja) 2013-02-27 2014-02-25 電子装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013037549 2013-02-27
JP2013037549 2013-02-27
JP2014034648A JP2014195059A (ja) 2013-02-27 2014-02-25 電子装置

Publications (2)

Publication Number Publication Date
JP2014195059A true JP2014195059A (ja) 2014-10-09
JP2014195059A5 JP2014195059A5 (enExample) 2017-01-19

Family

ID=51387923

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014034648A Pending JP2014195059A (ja) 2013-02-27 2014-02-25 電子装置

Country Status (2)

Country Link
US (1) US9510490B2 (enExample)
JP (1) JP2014195059A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5988004B1 (ja) * 2016-04-12 2016-09-07 Tdk株式会社 電子回路パッケージ
US12696389B2 (en) * 2023-08-17 2026-07-28 Nxp Usa, Inc. Reusable modular substrate

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6218739A (ja) * 1985-07-18 1987-01-27 Sumitomo Electric Ind Ltd 混成集積回路
WO2005074029A1 (ja) * 2004-01-28 2005-08-11 Matsushita Electric Industrial Co., Ltd. モジュール及びこれを用いた実装構造体
JP2005235983A (ja) * 2004-02-19 2005-09-02 Sony Chem Corp センサー部品
JP2008010859A (ja) * 2006-06-02 2008-01-17 Renesas Technology Corp 半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001297905A (ja) * 2000-04-17 2001-10-26 Tokin Corp 高周波電流抑制体
JP4417377B2 (ja) 2004-02-24 2010-02-17 信越ポリマー株式会社 電磁波ノイズ抑制体、電磁波ノイズ抑制機能付構造体、およびそれらの製造方法
JP4773254B2 (ja) * 2006-03-15 2011-09-14 太陽誘電株式会社 高周波磁性薄膜及び高周波電子デバイス
JP2008085089A (ja) * 2006-09-28 2008-04-10 Matsushita Electric Ind Co Ltd 樹脂配線基板および半導体装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6218739A (ja) * 1985-07-18 1987-01-27 Sumitomo Electric Ind Ltd 混成集積回路
WO2005074029A1 (ja) * 2004-01-28 2005-08-11 Matsushita Electric Industrial Co., Ltd. モジュール及びこれを用いた実装構造体
JP2005235983A (ja) * 2004-02-19 2005-09-02 Sony Chem Corp センサー部品
JP2008010859A (ja) * 2006-06-02 2008-01-17 Renesas Technology Corp 半導体装置

Also Published As

Publication number Publication date
US9510490B2 (en) 2016-11-29
US20140240936A1 (en) 2014-08-28

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