JP2018074566A5 - - Google Patents
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- Publication number
- JP2018074566A5 JP2018074566A5 JP2017156311A JP2017156311A JP2018074566A5 JP 2018074566 A5 JP2018074566 A5 JP 2018074566A5 JP 2017156311 A JP2017156311 A JP 2017156311A JP 2017156311 A JP2017156311 A JP 2017156311A JP 2018074566 A5 JP2018074566 A5 JP 2018074566A5
- Authority
- JP
- Japan
- Prior art keywords
- elastic wave
- filter device
- wave filter
- dielectric layer
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims 42
- 239000012790 adhesive layer Substances 0.000 claims 18
- 239000000853 adhesive Substances 0.000 claims 15
- 230000001070 adhesive effect Effects 0.000 claims 15
- 239000002184 metal Substances 0.000 claims 11
- 229910052751 metal Inorganic materials 0.000 claims 11
- 238000000034 method Methods 0.000 claims 11
- 239000000463 material Substances 0.000 claims 5
- 239000011159 matrix material Substances 0.000 claims 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 238000000059 patterning Methods 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 238000010897 surface acoustic wave method Methods 0.000 claims 2
- 239000003989 dielectric material Substances 0.000 claims 1
- 238000010292 electrical insulation Methods 0.000 claims 1
- 239000008393 encapsulating agent Substances 0.000 claims 1
- 238000005530 etching Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000007769 metal material Substances 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000004544 sputter deposition Methods 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/246,671 | 2016-08-25 | ||
| US15/246,671 US10333493B2 (en) | 2016-08-25 | 2016-08-25 | Embedded RF filter package structure and method of manufacturing thereof |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018074566A JP2018074566A (ja) | 2018-05-10 |
| JP2018074566A5 true JP2018074566A5 (enExample) | 2020-09-24 |
| JP6867914B2 JP6867914B2 (ja) | 2021-05-12 |
Family
ID=59699480
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017156311A Active JP6867914B2 (ja) | 2016-08-25 | 2017-08-14 | 埋め込みｒｆフィルタパッケージ構造およびその製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10333493B2 (enExample) |
| EP (1) | EP3288184B1 (enExample) |
| JP (1) | JP6867914B2 (enExample) |
| KR (1) | KR102436686B1 (enExample) |
| CN (1) | CN107786183B (enExample) |
| TW (1) | TWI720239B (enExample) |
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| US10483248B2 (en) * | 2017-03-23 | 2019-11-19 | Skyworks Solutions, Inc. | Wafer level chip scale filter packaging using semiconductor wafers with through wafer vias |
| US10819309B1 (en) * | 2019-04-05 | 2020-10-27 | Resonant Inc. | Transversely-excited film bulk acoustic resonator package and method |
| US11502067B2 (en) * | 2018-07-26 | 2022-11-15 | Advanced Semiconductor Engineering, Inc. | Package structure and method for manufacturing the same |
| CN108711570B (zh) * | 2018-08-10 | 2024-03-29 | 浙江熔城半导体有限公司 | 集成芯片封装结构的多芯片封装结构及其制作方法 |
| CN112913142A (zh) * | 2018-08-31 | 2021-06-04 | 天工方案公司 | 与嵌入滤波器有关的装置和方法 |
| CN109390127B (zh) * | 2018-11-12 | 2024-01-30 | 矽力杰半导体技术(杭州)有限公司 | 可支撑式封装器件和封装组件 |
| CN109217841B (zh) * | 2018-11-27 | 2024-03-01 | 杭州左蓝微电子技术有限公司 | 一种基于声表面波和空腔型薄膜体声波组合谐振器 |
| CN111371429B (zh) * | 2018-12-26 | 2022-07-12 | 中芯集成电路（宁波）有限公司上海分公司 | 控制电路与声波滤波器的集成方法和集成结构 |
| CN111371428A (zh) * | 2018-12-26 | 2020-07-03 | 中芯集成电路（宁波）有限公司上海分公司 | 控制电路与表面声波滤波器的集成方法和集成结构 |
| CN111371424A (zh) * | 2018-12-26 | 2020-07-03 | 中芯集成电路（宁波）有限公司上海分公司 | 控制电路与体声波滤波器的集成方法和集成结构 |
| CN109802031B (zh) * | 2018-12-29 | 2022-07-08 | 华进半导体封装先导技术研发中心有限公司 | 一种声表面波器件的封装方法及结构 |
| IT201900006736A1 (it) * | 2019-05-10 | 2020-11-10 | Applied Materials Inc | Procedimenti di fabbricazione di package |
| JP7297329B2 (ja) | 2019-05-16 | 2023-06-26 | 中芯集成電路（寧波）有限公司上海分公司 | エアギャップ型半導体デバイスのパッケージング構造及びその製作方法 |
| CN111952199A (zh) * | 2019-05-16 | 2020-11-17 | 中芯集成电路（宁波）有限公司 | 空气隙型半导体器件封装结构及其制作方法 |
| KR20200138529A (ko) | 2019-05-30 | 2020-12-10 | 삼성디스플레이 주식회사 | 표시 장치 |
| US11323097B2 (en) * | 2019-07-24 | 2022-05-03 | Skyworks Solutions, Inc. | Bulk acoustic wave filters on shared die |
| US11646760B2 (en) | 2019-09-23 | 2023-05-09 | Ticona Llc | RF filter for use at 5G frequencies |
| US11862546B2 (en) | 2019-11-27 | 2024-01-02 | Applied Materials, Inc. | Package core assembly and fabrication methods |
| CN111130489A (zh) * | 2019-12-04 | 2020-05-08 | 天津大学 | 芯片封装模块及封装方法及具有该模块的电子装置 |
| US11316497B2 (en) * | 2019-12-09 | 2022-04-26 | Intel Corporation | Multi-filter die |
| WO2021114140A1 (zh) * | 2019-12-11 | 2021-06-17 | 广东省半导体产业技术研究院 | 滤波芯片封装方法及封装结构 |
| US11257790B2 (en) | 2020-03-10 | 2022-02-22 | Applied Materials, Inc. | High connectivity device stacking |
| CN111884613B (zh) * | 2020-06-19 | 2021-03-23 | 珠海越亚半导体股份有限公司 | 一种具有空气谐振腔的嵌埋封装结构的制造方法 |
| US12334903B2 (en) | 2020-08-31 | 2025-06-17 | Qualcomm Incorporated | Substrate comprising acoustic resonators configured as at least one acoustic filter |
| JPWO2022220289A1 (enExample) * | 2021-04-15 | 2022-10-20 | ||
| US12470201B2 (en) * | 2021-08-27 | 2025-11-11 | Skyworks Solutions, Inc. | Packaged multilayer piezoelectric surface acoustic wave device with conductive pillar |
| US12494367B2 (en) * | 2021-10-21 | 2025-12-09 | X-Celeprint Limited | Printing components to substrate posts with gaps |
| CN113938109B (zh) * | 2021-12-16 | 2022-04-01 | 深圳新声半导体有限公司 | 一种声表面滤波器封装结构 |
| CN114823651B (zh) * | 2022-04-06 | 2023-04-07 | 杭州道铭微电子有限公司 | 一种带有滤波器的射频系统模块封装结构及方法 |
| US12082334B2 (en) * | 2022-04-14 | 2024-09-03 | Hamilton Sundstrand Corporation | Devices and methods to improve thermal conduction from SMT and chip on board components to chassis heat sinking |
| TWI847124B (zh) * | 2022-04-19 | 2024-07-01 | 瑞峰半導體股份有限公司 | 聲波元件 |
| KR20250088420A (ko) * | 2022-10-13 | 2025-06-17 | 세키스이가가쿠 고교가부시키가이샤 | 전자 부품의 제조 방법 및 전자 부품 |
| US20240222877A1 (en) * | 2023-01-03 | 2024-07-04 | Apple Inc. | Integration of radio frequency front-end for size reduction and improved performance |
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| DE69718693T2 (de) | 1996-03-08 | 2003-11-27 | Matsushita Electric Industrial Co., Ltd. | Elektronisches Bauteil und Herstellungsverfahren |
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| US7307331B2 (en) | 2004-03-31 | 2007-12-11 | Intel Corporation | Integrated radio front-end module with embedded circuit elements |
| US7307369B2 (en) * | 2004-08-26 | 2007-12-11 | Kyocera Corporation | Surface acoustic wave device, surface acoustic wave apparatus, and communications equipment |
| WO2006106831A1 (ja) * | 2005-04-01 | 2006-10-12 | Matsushita Electric Industrial Co., Ltd. | 弾性表面波デバイスおよびその製造方法 |
| EP1892831B1 (en) | 2005-06-16 | 2012-08-29 | Murata Manufacturing Co., Ltd. | Piezoelectric device and manufacturing method thereof |
| JP2007005948A (ja) * | 2005-06-22 | 2007-01-11 | Alps Electric Co Ltd | 電子部品及びその製造方法 |
| US20080217708A1 (en) | 2007-03-09 | 2008-09-11 | Skyworks Solutions, Inc. | Integrated passive cap in a system-in-package |
| US8900931B2 (en) | 2007-12-26 | 2014-12-02 | Skyworks Solutions, Inc. | In-situ cavity integrated circuit package |
| US7952187B2 (en) | 2008-03-31 | 2011-05-31 | General Electric Company | System and method of forming a wafer scale package |
| US8358000B2 (en) | 2009-03-13 | 2013-01-22 | General Electric Company | Double side cooled power module with power overlay |
| JP2012049758A (ja) * | 2010-08-26 | 2012-03-08 | Taiyo Yuden Co Ltd | フィルタ及びデュープレクサ |
| US8114712B1 (en) | 2010-12-22 | 2012-02-14 | General Electric Company | Method for fabricating a semiconductor device package |
| JP2012248916A (ja) * | 2011-05-25 | 2012-12-13 | Taiyo Yuden Co Ltd | 弾性波デバイスの製造方法 |
| US8653635B2 (en) | 2011-08-16 | 2014-02-18 | General Electric Company | Power overlay structure with leadframe connections |
| WO2013114978A1 (ja) * | 2012-02-01 | 2013-08-08 | 株式会社村田製作所 | 無線通信モジュール、及びそれを用いた通信端末装置 |
| US8872328B2 (en) | 2012-12-19 | 2014-10-28 | General Electric Company | Integrated power module package |
| JP2014155132A (ja) * | 2013-02-13 | 2014-08-25 | Murata Mfg Co Ltd | 回路基板およびその製造方法 |
| JP6179593B2 (ja) | 2013-05-27 | 2017-08-16 | 株式会社村田製作所 | 弾性表面波装置 |
| JP6469572B2 (ja) * | 2013-07-29 | 2019-02-13 | 株式会社村田製作所 | アンテナ一体型無線モジュールおよびこのモジュールの製造方法 |
| JP6288111B2 (ja) * | 2013-12-25 | 2018-03-07 | 株式会社村田製作所 | 弾性波フィルタデバイス |
| CN105811917A (zh) * | 2016-04-01 | 2016-07-27 | 江苏长电科技股份有限公司 | 金属圆片级表面声滤波芯片封装结构及其制造方法 |
-
2016
- 2016-08-25 US US15/246,671 patent/US10333493B2/en active Active
-
2017
- 2017-08-09 EP EP17185594.3A patent/EP3288184B1/en active Active
- 2017-08-14 JP JP2017156311A patent/JP6867914B2/ja active Active
- 2017-08-14 TW TW106127491A patent/TWI720239B/zh active
- 2017-08-21 KR KR1020170105640A patent/KR102436686B1/ko active Active
- 2017-08-25 CN CN201710741497.6A patent/CN107786183B/zh active Active
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