JP2014179473A - セラミック基板の製造方法および導体材料 - Google Patents
セラミック基板の製造方法および導体材料 Download PDFInfo
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- JP2014179473A JP2014179473A JP2013052630A JP2013052630A JP2014179473A JP 2014179473 A JP2014179473 A JP 2014179473A JP 2013052630 A JP2013052630 A JP 2013052630A JP 2013052630 A JP2013052630 A JP 2013052630A JP 2014179473 A JP2014179473 A JP 2014179473A
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- Prior art keywords
- silver
- conductor
- manufacturing
- substrate
- ceramic
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- 239000004020 conductor Substances 0.000 title claims abstract description 114
- 239000000758 substrate Substances 0.000 title claims abstract description 76
- 239000000463 material Substances 0.000 title claims abstract description 63
- 239000000919 ceramic Substances 0.000 title claims abstract description 60
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 47
- 238000000034 method Methods 0.000 title abstract description 22
- 229910052709 silver Inorganic materials 0.000 claims abstract description 84
- 239000004332 silver Substances 0.000 claims abstract description 84
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 83
- 229910052723 transition metal Inorganic materials 0.000 claims abstract description 28
- 150000003624 transition metals Chemical class 0.000 claims abstract description 28
- 239000007769 metal material Substances 0.000 claims abstract description 27
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 19
- 238000010304 firing Methods 0.000 claims description 50
- 239000011521 glass Substances 0.000 claims description 20
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 229910001252 Pd alloy Inorganic materials 0.000 claims description 5
- 229910052763 palladium Inorganic materials 0.000 claims description 5
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 claims description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 238000010030 laminating Methods 0.000 abstract description 2
- 238000009792 diffusion process Methods 0.000 description 31
- 239000000203 mixture Substances 0.000 description 13
- 239000000843 powder Substances 0.000 description 13
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 9
- 229910010293 ceramic material Inorganic materials 0.000 description 8
- 239000001257 hydrogen Substances 0.000 description 8
- 229910052739 hydrogen Inorganic materials 0.000 description 8
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 230000008859 change Effects 0.000 description 6
- 230000008602 contraction Effects 0.000 description 6
- 238000000280 densification Methods 0.000 description 6
- 239000002241 glass-ceramic Substances 0.000 description 6
- 239000012298 atmosphere Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 230000007547 defect Effects 0.000 description 5
- 238000002845 discoloration Methods 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- 238000001878 scanning electron micrograph Methods 0.000 description 5
- 239000011800 void material Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 229910010413 TiO 2 Inorganic materials 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 150000004678 hydrides Chemical class 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 3
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- -1 silver ions Chemical class 0.000 description 3
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 150000001339 alkali metal compounds Chemical class 0.000 description 2
- 150000001340 alkali metals Chemical class 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 239000005388 borosilicate glass Substances 0.000 description 2
- 238000004590 computer program Methods 0.000 description 2
- 238000007606 doctor blade method Methods 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229910000048 titanium hydride Inorganic materials 0.000 description 2
- 150000003623 transition metal compounds Chemical class 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 229920005822 acrylic binder Polymers 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 150000001845 chromium compounds Chemical class 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000004320 controlled atmosphere Methods 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000006112 glass ceramic composition Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000013507 mapping Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- COEYXIBLSAIEKV-UHFFFAOYSA-N titanium dihydride Chemical compound [TiH2] COEYXIBLSAIEKV-UHFFFAOYSA-N 0.000 description 1
- QSGNKXDSTRDWKA-UHFFFAOYSA-N zirconium dihydride Chemical compound [ZrH2] QSGNKXDSTRDWKA-UHFFFAOYSA-N 0.000 description 1
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013052630A JP2014179473A (ja) | 2013-03-15 | 2013-03-15 | セラミック基板の製造方法および導体材料 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013052630A JP2014179473A (ja) | 2013-03-15 | 2013-03-15 | セラミック基板の製造方法および導体材料 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2014179473A true JP2014179473A (ja) | 2014-09-25 |
| JP2014179473A5 JP2014179473A5 (enrdf_load_stackoverflow) | 2016-03-03 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013052630A Pending JP2014179473A (ja) | 2013-03-15 | 2013-03-15 | セラミック基板の製造方法および導体材料 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2014179473A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110047611A (zh) * | 2019-04-18 | 2019-07-23 | 北京元六鸿远电子科技股份有限公司 | 一种低温烧结ltcc用导电银浆 |
| US10375837B2 (en) | 2015-01-13 | 2019-08-06 | Ngk Spark Plug Co., Ltd. | Method of manufacturing a ceramic substrate |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0289387A (ja) * | 1988-09-27 | 1990-03-29 | Asahi Glass Co Ltd | 銅導体ペーストと多層セラミックス基板 |
| JP2006156522A (ja) * | 2004-11-26 | 2006-06-15 | Kyocera Corp | 配線基板およびその製造方法 |
| JP2007081324A (ja) * | 2005-09-16 | 2007-03-29 | Tdk Corp | 多層セラミックス基板及びその製造方法 |
| JP2008263129A (ja) * | 2007-04-13 | 2008-10-30 | Asahi Glass Co Ltd | プリント配線板の製造方法 |
-
2013
- 2013-03-15 JP JP2013052630A patent/JP2014179473A/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0289387A (ja) * | 1988-09-27 | 1990-03-29 | Asahi Glass Co Ltd | 銅導体ペーストと多層セラミックス基板 |
| JP2006156522A (ja) * | 2004-11-26 | 2006-06-15 | Kyocera Corp | 配線基板およびその製造方法 |
| JP2007081324A (ja) * | 2005-09-16 | 2007-03-29 | Tdk Corp | 多層セラミックス基板及びその製造方法 |
| JP2008263129A (ja) * | 2007-04-13 | 2008-10-30 | Asahi Glass Co Ltd | プリント配線板の製造方法 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10375837B2 (en) | 2015-01-13 | 2019-08-06 | Ngk Spark Plug Co., Ltd. | Method of manufacturing a ceramic substrate |
| US10524365B2 (en) | 2015-01-13 | 2019-12-31 | Ngk Spark Plug Co., Ltd. | Ceramic substrate |
| US10785879B2 (en) | 2015-01-13 | 2020-09-22 | Ngk Spark Plug Co., Ltd. | Circuit board and production method therefor |
| CN110047611A (zh) * | 2019-04-18 | 2019-07-23 | 北京元六鸿远电子科技股份有限公司 | 一种低温烧结ltcc用导电银浆 |
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