JP2014170973A - パターンの製造方法 - Google Patents
パターンの製造方法 Download PDFInfo
- Publication number
- JP2014170973A JP2014170973A JP2014129895A JP2014129895A JP2014170973A JP 2014170973 A JP2014170973 A JP 2014170973A JP 2014129895 A JP2014129895 A JP 2014129895A JP 2014129895 A JP2014129895 A JP 2014129895A JP 2014170973 A JP2014170973 A JP 2014170973A
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- JP
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- Prior art keywords
- pattern
- metal organic
- laser
- ink
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
- H01L21/0275—Photolithographic processes using lasers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
- G03F7/2016—Contact mask being integral part of the photosensitive element and subject to destructive removal during post-exposure processing
- G03F7/2018—Masking pattern obtained by selective application of an ink or a toner, e.g. ink jet printing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
- H01L21/2683—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation using X-ray lasers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0257—Nanoparticles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/121—Metallo-organic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
Abstract
【解決手段】パターンの製造方法は、基板上に金属有機インク層(20)を形成する第1の段階;前記金属有機インク層(20)を半固体状態に硬化させる第2の段階;前記半固体状態の金属有機インク層(20)にレーザー光を照射し、照射された部分が固体状態に硬化されてパターンが形成される第3の段階、および、前記半固体状態の金属有機インク層(20)を除去して、前記パターンだけを残す第4の段階を含む。
【選択図】図8
Description
20:インク層
21:パターン
23:固体金属粒子
30:洗浄液
Claims (3)
- 基板上に透明な金属有機インク層(20)を形成する第1の段階、
前記金属有機インク層(20)が形成された基板を加熱用ランプを用いて加熱して、透明な前記金属有機インク層(20)を、完全に硬化した固体よりも流動性が高く液体よりは流動性が少ない半固体状態に硬化させる第2の段階、
前記半固体状態の金属有機インク層(20)にレーザー光を照射し、照射された部分が固体状態に硬化されてパターンが形成される第3の段階、および
前記半固体状態の金属有機インク層(20)を除去して、前記パターンだけを残す第4の段階
を含むパターンの製造方法。 - 前記第4の段階において、前記基板を洗浄液に浸すか、超音波洗浄をするか、又は、洗浄液を噴射することで、前記半固体状態の金属有機インク層(20)を除去する段階をさらに含む、請求項1に記載のパターンの製造方法。
- 前記第4の段階において、前記パターンが形成された基板を加熱する段階をさらに含む、請求項2に記載のパターンの製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2010-0068120 | 2010-07-14 | ||
KR1020100068120A KR101114256B1 (ko) | 2010-07-14 | 2010-07-14 | 패턴 제조 방법 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011156147A Division JP2012023380A (ja) | 2010-07-14 | 2011-07-14 | パターンの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014170973A true JP2014170973A (ja) | 2014-09-18 |
JP2014170973A5 JP2014170973A5 (ja) | 2014-10-30 |
Family
ID=44786598
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011156147A Pending JP2012023380A (ja) | 2010-07-14 | 2011-07-14 | パターンの製造方法 |
JP2014129895A Pending JP2014170973A (ja) | 2010-07-14 | 2014-06-25 | パターンの製造方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011156147A Pending JP2012023380A (ja) | 2010-07-14 | 2011-07-14 | パターンの製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20120015112A1 (ja) |
EP (1) | EP2408283A1 (ja) |
JP (2) | JP2012023380A (ja) |
KR (1) | KR101114256B1 (ja) |
CN (1) | CN102338983B (ja) |
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KR20130106676A (ko) * | 2012-03-20 | 2013-09-30 | 한국과학기술원 | 미세금속전극 제조방법 |
KR101394968B1 (ko) * | 2012-10-12 | 2014-05-15 | 한국과학기술원 | 금속패턴 형성방법 |
US10315275B2 (en) * | 2013-01-24 | 2019-06-11 | Wisconsin Alumni Research Foundation | Reducing surface asperities |
US10622244B2 (en) | 2013-02-18 | 2020-04-14 | Orbotech Ltd. | Pulsed-mode direct-write laser metallization |
CN105009695B (zh) * | 2013-02-18 | 2018-09-18 | 奥博泰克有限公司 | 两步直接刻写激光金属化 |
CN104185378A (zh) * | 2013-05-21 | 2014-12-03 | 群创光电股份有限公司 | 导电线路的制备方法、以及具有导电线路的装置 |
US10537027B2 (en) | 2013-08-02 | 2020-01-14 | Orbotech Ltd. | Method producing a conductive path on a substrate |
US20150123851A1 (en) * | 2013-11-01 | 2015-05-07 | Tyco Electronics Corporation | Three-Dimensional Article Having Spray-Applied Ink |
EP3140853A4 (en) * | 2014-04-10 | 2018-01-17 | Orbotech Ltd. | Pulsed-mode direct-write laser metallization |
WO2016063270A1 (en) | 2014-10-19 | 2016-04-28 | Orbotech Ltd. | Llift printing of conductive traces onto a semiconductor substrate |
US11086797B2 (en) * | 2014-10-31 | 2021-08-10 | Hewlett Packard Enterprise Development Lp | Systems and methods for restricting write access to non-volatile memory |
JP6105727B2 (ja) * | 2014-11-13 | 2017-06-28 | エス・オー・シー株式会社 | チップヒューズの製造方法及びチップヒューズ |
US10633758B2 (en) | 2015-01-19 | 2020-04-28 | Orbotech Ltd. | Printing of three-dimensional metal structures with a sacrificial support |
GB2541412B (en) | 2015-08-18 | 2018-08-01 | M Solv Ltd | Method and Apparatus for Forming a Conductive Track |
JP6784350B2 (ja) | 2015-11-22 | 2020-11-11 | オルボテック リミテッド | プリントされた3次元構造物の表面特性の制御 |
KR101813531B1 (ko) * | 2016-07-04 | 2018-01-02 | 주식회사 비에스피 | 투명전극과 이것의 제조방법 |
JP2018085437A (ja) * | 2016-11-24 | 2018-05-31 | 株式会社村田製作所 | 電子部品の製造方法及び電子部品 |
US10811334B2 (en) * | 2016-11-26 | 2020-10-20 | Texas Instruments Incorporated | Integrated circuit nanoparticle thermal routing structure in interconnect region |
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US20180165032A1 (en) * | 2016-12-14 | 2018-06-14 | Western Digital Technologies, Inc. | Read write performance for nand flash for archival application |
TW201901887A (zh) | 2017-05-24 | 2019-01-01 | 以色列商奧寶科技股份有限公司 | 於未事先圖樣化基板上電器互連電路元件 |
KR102089581B1 (ko) * | 2017-10-31 | 2020-03-16 | 금오공과대학교 산학협력단 | 고분해능의 대면적 미세 패턴 제조 방법 및 그 방법으로 제조된 평판 디스플레이 |
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CN108681694A (zh) * | 2018-04-19 | 2018-10-19 | 蚌埠华特科技有限公司 | 一种指纹模组盖板logo的制备工艺 |
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CN109683229B (zh) * | 2019-01-24 | 2021-04-02 | 凤阳硅谷智能有限公司 | 一种玻璃导光板的制备方法 |
CN109733084A (zh) * | 2019-02-25 | 2019-05-10 | 深圳市天虹激光技术有限公司 | 一种新型的镭射纳米金油墨烘干方法 |
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- 2010-07-14 KR KR1020100068120A patent/KR101114256B1/ko active IP Right Grant
-
2011
- 2011-07-06 EP EP11172936A patent/EP2408283A1/en not_active Withdrawn
- 2011-07-12 US US13/180,921 patent/US20120015112A1/en not_active Abandoned
- 2011-07-14 JP JP2011156147A patent/JP2012023380A/ja active Pending
- 2011-07-14 CN CN201110196959.3A patent/CN102338983B/zh not_active Expired - Fee Related
-
2014
- 2014-06-25 JP JP2014129895A patent/JP2014170973A/ja active Pending
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Also Published As
Publication number | Publication date |
---|---|
US20120015112A1 (en) | 2012-01-19 |
KR101114256B1 (ko) | 2012-03-05 |
JP2012023380A (ja) | 2012-02-02 |
KR20120007381A (ko) | 2012-01-20 |
CN102338983A (zh) | 2012-02-01 |
CN102338983B (zh) | 2014-03-12 |
EP2408283A1 (en) | 2012-01-18 |
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