JP2014091652A - 基板分断装置 - Google Patents

基板分断装置 Download PDF

Info

Publication number
JP2014091652A
JP2014091652A JP2012243232A JP2012243232A JP2014091652A JP 2014091652 A JP2014091652 A JP 2014091652A JP 2012243232 A JP2012243232 A JP 2012243232A JP 2012243232 A JP2012243232 A JP 2012243232A JP 2014091652 A JP2014091652 A JP 2014091652A
Authority
JP
Japan
Prior art keywords
substrate
brittle material
suction
suction plate
material substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012243232A
Other languages
English (en)
Japanese (ja)
Inventor
Toru Naruo
徹 成尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2012243232A priority Critical patent/JP2014091652A/ja
Priority to TW102121276A priority patent/TW201418533A/zh
Priority to CN201310437088.9A priority patent/CN103803787A/zh
Priority to KR1020130113713A priority patent/KR20140058328A/ko
Publication of JP2014091652A publication Critical patent/JP2014091652A/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027—Scoring tool holders; Driving mechanisms therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037—Controlling or regulating
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
JP2012243232A 2012-11-05 2012-11-05 基板分断装置 Pending JP2014091652A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012243232A JP2014091652A (ja) 2012-11-05 2012-11-05 基板分断装置
TW102121276A TW201418533A (zh) 2012-11-05 2013-06-17 基板分斷裝置
CN201310437088.9A CN103803787A (zh) 2012-11-05 2013-09-17 基板分断装置
KR1020130113713A KR20140058328A (ko) 2012-11-05 2013-09-25 기판 분단 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012243232A JP2014091652A (ja) 2012-11-05 2012-11-05 基板分断装置

Publications (1)

Publication Number Publication Date
JP2014091652A true JP2014091652A (ja) 2014-05-19

Family

ID=50701235

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012243232A Pending JP2014091652A (ja) 2012-11-05 2012-11-05 基板分断装置

Country Status (4)

Country Link
JP (1) JP2014091652A (zh)
KR (1) KR20140058328A (zh)
CN (1) CN103803787A (zh)
TW (1) TW201418533A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016016525A (ja) * 2014-07-04 2016-02-01 三星ダイヤモンド工業株式会社 基板加工装置

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6117755B2 (ja) * 2014-09-22 2017-04-19 ファナック株式会社 予め切断された基板の引っ掛かりを解除する装置、ロボット、およびロボットシステム
KR102605917B1 (ko) * 2016-04-07 2023-11-27 주식회사 탑 엔지니어링 스크라이빙 장치
JP6842689B2 (ja) * 2016-12-05 2021-03-17 三星ダイヤモンド工業株式会社 搬送装置およびスクライブシステム
CN110405962B (zh) * 2019-07-23 2021-11-19 上海理工大学 自动翻转式半导体解理装置及加工方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016016525A (ja) * 2014-07-04 2016-02-01 三星ダイヤモンド工業株式会社 基板加工装置

Also Published As

Publication number Publication date
KR20140058328A (ko) 2014-05-14
CN103803787A (zh) 2014-05-21
TW201418533A (zh) 2014-05-16

Similar Documents

Publication Publication Date Title
JP6280332B2 (ja) 基板反転搬送装置
JP4965632B2 (ja) 基板分断システム、基板製造装置、基板スクライブ方法および基板分断方法
TWI571954B (zh) Substrate processing system and substrate reversing device
JP6259891B2 (ja) 基板加工装置
JP2014091652A (ja) 基板分断装置
JP2016040203A (ja) 基板反転搬送装置
JP2008087975A (ja) ガラス板加工装置およびガラス板加工方法
JP2009208080A (ja) ワーク搬送装置
JP6126396B2 (ja) 基板加工装置
TWI532088B (zh) Breaking device
JP2014080336A (ja) 基板分断装置
TW201532989A (zh) 劃線裝置
CN107151091B (zh) 划片设备
JP5447992B2 (ja) 基板分断装置
JP2012092010A (ja) ガラス加工装置
JP4854337B2 (ja) 板材の加工装置とそれを備えた加工設備
JP2014080334A (ja) 基板分断装置
JP6227098B2 (ja) 基板加工装置
JP6435669B2 (ja) 基板加工装置
JP2014080335A (ja) 基板分断装置
JP2014065600A (ja) 基板吸着装置
JP5160628B2 (ja) 貼り合せ基板の分断方法
JP2017213710A (ja) 基板加工装置
JP2014019604A (ja) 脆性材料基板のブレイク装置
TWM595127U (zh) 液晶面板之切割裝置