CN110405962B - 自动翻转式半导体解理装置及加工方法 - Google Patents
自动翻转式半导体解理装置及加工方法 Download PDFInfo
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- CN110405962B CN110405962B CN201910666021.XA CN201910666021A CN110405962B CN 110405962 B CN110405962 B CN 110405962B CN 201910666021 A CN201910666021 A CN 201910666021A CN 110405962 B CN110405962 B CN 110405962B
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- workbench
- scribing
- wafer
- sucker
- dicing saw
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 27
- 238000003776 cleavage reaction Methods 0.000 title claims abstract description 21
- 230000007017 scission Effects 0.000 title claims abstract description 21
- 230000007306 turnover Effects 0.000 title claims abstract description 20
- 238000003672 processing method Methods 0.000 title claims abstract description 12
- 238000000034 method Methods 0.000 claims abstract description 13
- 238000003825 pressing Methods 0.000 claims abstract description 10
- 238000009475 tablet pressing Methods 0.000 claims abstract 2
- 238000009826 distribution Methods 0.000 claims description 4
- 238000012544 monitoring process Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 46
- 239000002173 cutting fluid Substances 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 241000252254 Catostomidae Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0052—Means for supporting or holding work during breaking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910666021.XA CN110405962B (zh) | 2019-07-23 | 2019-07-23 | 自动翻转式半导体解理装置及加工方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910666021.XA CN110405962B (zh) | 2019-07-23 | 2019-07-23 | 自动翻转式半导体解理装置及加工方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110405962A CN110405962A (zh) | 2019-11-05 |
CN110405962B true CN110405962B (zh) | 2021-11-19 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201910666021.XA Active CN110405962B (zh) | 2019-07-23 | 2019-07-23 | 自动翻转式半导体解理装置及加工方法 |
Country Status (1)
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CN (1) | CN110405962B (zh) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4818767B2 (ja) * | 2006-03-22 | 2011-11-16 | 株式会社メガトレード | 外観検査装置 |
CN103803787A (zh) * | 2012-11-05 | 2014-05-21 | 三星钻石工业股份有限公司 | 基板分断装置 |
CN103978564A (zh) * | 2013-02-07 | 2014-08-13 | 三星钻石工业股份有限公司 | 基板加工装置 |
CN104030558A (zh) * | 2013-03-05 | 2014-09-10 | 三星钻石工业股份有限公司 | 基板处理系统及基板反转装置 |
CN104418496A (zh) * | 2013-09-09 | 2015-03-18 | 三星钻石工业股份有限公司 | 基板反转搬送装置 |
CN105034183A (zh) * | 2014-04-28 | 2015-11-11 | 三星钻石工业股份有限公司 | 脆性材料基板的反转装置 |
JP2017071224A (ja) * | 2016-11-09 | 2017-04-13 | 三星ダイヤモンド工業株式会社 | 基板加工装置 |
-
2019
- 2019-07-23 CN CN201910666021.XA patent/CN110405962B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4818767B2 (ja) * | 2006-03-22 | 2011-11-16 | 株式会社メガトレード | 外観検査装置 |
CN103803787A (zh) * | 2012-11-05 | 2014-05-21 | 三星钻石工业股份有限公司 | 基板分断装置 |
CN103978564A (zh) * | 2013-02-07 | 2014-08-13 | 三星钻石工业股份有限公司 | 基板加工装置 |
CN104030558A (zh) * | 2013-03-05 | 2014-09-10 | 三星钻石工业股份有限公司 | 基板处理系统及基板反转装置 |
CN104418496A (zh) * | 2013-09-09 | 2015-03-18 | 三星钻石工业股份有限公司 | 基板反转搬送装置 |
CN105034183A (zh) * | 2014-04-28 | 2015-11-11 | 三星钻石工业股份有限公司 | 脆性材料基板的反转装置 |
JP2017071224A (ja) * | 2016-11-09 | 2017-04-13 | 三星ダイヤモンド工業株式会社 | 基板加工装置 |
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CN110405962A (zh) | 2019-11-05 |
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Inventor after: Jiang Chen Inventor after: Wang Shengshui Inventor after: Zhu Da Inventor after: Dong Kangjia Inventor after: Lang Xiaohu Inventor after: Wan Xin Inventor before: Jiang Chen Inventor before: Wang Shengshui Inventor before: Zhu Da Inventor before: Dong Kangjia Inventor before: Lang Xiaohu Inventor before: Wan Xin |
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