JP2014086522A - 電子デバイスの製造方法、電子部品用容器の接合装置、電子機器、及び移動体機器 - Google Patents

電子デバイスの製造方法、電子部品用容器の接合装置、電子機器、及び移動体機器 Download PDF

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Publication number
JP2014086522A
JP2014086522A JP2012233498A JP2012233498A JP2014086522A JP 2014086522 A JP2014086522 A JP 2014086522A JP 2012233498 A JP2012233498 A JP 2012233498A JP 2012233498 A JP2012233498 A JP 2012233498A JP 2014086522 A JP2014086522 A JP 2014086522A
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Japan
Prior art keywords
lid
joining
base substrate
electronic device
bonding
Prior art date
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Application number
JP2012233498A
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English (en)
Japanese (ja)
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JP2014086522A5 (https=
Inventor
Hideo Miyasaka
英男 宮坂
Kazuhisa Hashimoto
和久 橋本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
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Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2012233498A priority Critical patent/JP2014086522A/ja
Priority to US14/049,283 priority patent/US20140111919A1/en
Priority to CN201310498916.XA priority patent/CN103769747A/zh
Publication of JP2014086522A publication Critical patent/JP2014086522A/ja
Publication of JP2014086522A5 publication Critical patent/JP2014086522A5/ja
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/02—Forming enclosures or casings
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/03—Covers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/03—Assembling devices that include piezoelectric or electrostrictive parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07332—Compression bonding, e.g. thermocompression bonding
    • H10W72/07333—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W80/00—Direct bonding of chips, wafers or substrates
    • H10W80/301—Bonding techniques, e.g. hybrid bonding
    • H10W80/331—Bonding techniques, e.g. hybrid bonding characterised by the application of energy for connecting
    • H10W80/333—Compression bonding
    • H10W80/335—Ultrasonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/791—Package configurations characterised by the relative positions of pads or connectors relative to package parts of direct-bonded pads
    • H10W90/794—Package configurations characterised by the relative positions of pads or connectors relative to package parts of direct-bonded pads between a chip and a stacked insulating package substrate, interposer or RDL

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2012233498A 2012-10-23 2012-10-23 電子デバイスの製造方法、電子部品用容器の接合装置、電子機器、及び移動体機器 Withdrawn JP2014086522A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2012233498A JP2014086522A (ja) 2012-10-23 2012-10-23 電子デバイスの製造方法、電子部品用容器の接合装置、電子機器、及び移動体機器
US14/049,283 US20140111919A1 (en) 2012-10-23 2013-10-09 Method for manufacturing electronic device, bonding device for electronic component container, electronic apparatus, and apparatus for moving object
CN201310498916.XA CN103769747A (zh) 2012-10-23 2013-10-22 电子器件的制造方法、接合装置、电子设备及移动体设备

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012233498A JP2014086522A (ja) 2012-10-23 2012-10-23 電子デバイスの製造方法、電子部品用容器の接合装置、電子機器、及び移動体機器

Publications (2)

Publication Number Publication Date
JP2014086522A true JP2014086522A (ja) 2014-05-12
JP2014086522A5 JP2014086522A5 (https=) 2014-06-19

Family

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JP2012233498A Withdrawn JP2014086522A (ja) 2012-10-23 2012-10-23 電子デバイスの製造方法、電子部品用容器の接合装置、電子機器、及び移動体機器

Country Status (3)

Country Link
US (1) US20140111919A1 (https=)
JP (1) JP2014086522A (https=)
CN (1) CN103769747A (https=)

Cited By (2)

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Publication number Priority date Publication date Assignee Title
KR20190037459A (ko) * 2017-09-29 2019-04-08 삼성전자주식회사 반도체 칩 접합용 지그, 이러한 지그를 포함하는 반도체 칩의 접합 장치 및 이 장치를 이용한 반도체 칩의 접합 방법
CN110227885A (zh) * 2018-03-06 2019-09-13 南京工业职业技术学院 手机充电接头焊接设备

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JP6155551B2 (ja) * 2012-04-10 2017-07-05 セイコーエプソン株式会社 電子デバイス、電子機器および電子デバイスの製造方法
JP6167494B2 (ja) * 2012-09-26 2017-07-26 セイコーエプソン株式会社 電子デバイス用容器の製造方法、電子デバイスの製造方法、電子デバイス、電子機器及び移動体機器
JP2015128276A (ja) * 2013-11-29 2015-07-09 日本電波工業株式会社 表面実装水晶振動子及びその製造方法
JP6378971B2 (ja) 2014-08-19 2018-08-22 矢崎総業株式会社 外装部材取付方法及び外装部材取付装置
CN105491869B (zh) * 2016-01-16 2022-05-24 深圳市坤亚电子有限公司 一种全自动多通道散装贴片供料装置
JP6465097B2 (ja) * 2016-11-21 2019-02-06 横河電機株式会社 振動式トランスデューサ
FR3065577B1 (fr) * 2017-04-25 2021-09-17 Commissariat Energie Atomique Cellule de scellement et procede d'encapsulation d'un composant microelectronique avec une telle cellule de scellement
CN109382559B (zh) * 2017-08-09 2021-02-23 宁波江丰电子材料股份有限公司 背板制造方法及背板
CN108909085A (zh) * 2018-07-13 2018-11-30 安徽晶赛科技股份有限公司 一种适用于激光焊接石英晶体封装的上盖及其制备方法
US11553265B2 (en) * 2019-07-24 2023-01-10 Google Llc Compact home assistant having a controlled sound path
CN115302207B (zh) * 2022-08-31 2024-05-14 陕西智拓固相增材制造技术有限公司 复合基座的制作方法和复合基座

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JPH09130188A (ja) * 1995-11-02 1997-05-16 Fujimaru Kogyo Kk 薄型電子部品
JP2004172206A (ja) * 2002-11-18 2004-06-17 Teitsu Engineering Co Ltd 電子部品パッケージへのリッド溶接方法
JP2005353885A (ja) * 2004-06-11 2005-12-22 Seiko Epson Corp 電子デバイスの製造方法
JP2006086585A (ja) * 2004-09-14 2006-03-30 Daishinku Corp 表面実装型圧電振動デバイス
JP2007095812A (ja) * 2005-09-27 2007-04-12 Pioneer Electronic Corp 電子部品用筐体、レーザ溶接装置、レーザ溶接方法
JP2007227821A (ja) * 2006-02-27 2007-09-06 Denso Corp 半導体装置の異物除去装置及び異物除去方法
JP2008016667A (ja) * 2006-07-06 2008-01-24 Fujifilm Corp パッケージ開封方法及びパッケージ開封装置、研磨方法及び研磨装置、チップ取り出し方法及びチップ取り出し装置、検査方法及び検査装置
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JP2009182924A (ja) * 2008-02-01 2009-08-13 Epson Toyocom Corp 圧電デバイス及び圧電デバイスの製造方法
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JP2011029911A (ja) * 2009-07-24 2011-02-10 Seiko Instruments Inc 圧電振動子の製造方法、並びに圧電振動子、発振器、電子機器および電波時計
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JPH09130188A (ja) * 1995-11-02 1997-05-16 Fujimaru Kogyo Kk 薄型電子部品
JP2004172206A (ja) * 2002-11-18 2004-06-17 Teitsu Engineering Co Ltd 電子部品パッケージへのリッド溶接方法
JP2005353885A (ja) * 2004-06-11 2005-12-22 Seiko Epson Corp 電子デバイスの製造方法
JP2006086585A (ja) * 2004-09-14 2006-03-30 Daishinku Corp 表面実装型圧電振動デバイス
JP2007095812A (ja) * 2005-09-27 2007-04-12 Pioneer Electronic Corp 電子部品用筐体、レーザ溶接装置、レーザ溶接方法
JP2007227821A (ja) * 2006-02-27 2007-09-06 Denso Corp 半導体装置の異物除去装置及び異物除去方法
JP2008016667A (ja) * 2006-07-06 2008-01-24 Fujifilm Corp パッケージ開封方法及びパッケージ開封装置、研磨方法及び研磨装置、チップ取り出し方法及びチップ取り出し装置、検査方法及び検査装置
JP2010034099A (ja) * 2008-07-25 2010-02-12 Nippon Avionics Co Ltd 気密封止方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190037459A (ko) * 2017-09-29 2019-04-08 삼성전자주식회사 반도체 칩 접합용 지그, 이러한 지그를 포함하는 반도체 칩의 접합 장치 및 이 장치를 이용한 반도체 칩의 접합 방법
KR102410948B1 (ko) * 2017-09-29 2022-06-20 삼성전자주식회사 반도체 칩 접합용 지그, 이러한 지그를 포함하는 반도체 칩의 접합 장치 및 이 장치를 이용한 반도체 칩의 접합 방법
CN110227885A (zh) * 2018-03-06 2019-09-13 南京工业职业技术学院 手机充电接头焊接设备
CN110227885B (zh) * 2018-03-06 2024-03-01 南京工业职业技术学院 手机充电接头焊接设备

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US20140111919A1 (en) 2014-04-24

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