JP2014083673A - 砥粒付ワイヤ工具 - Google Patents

砥粒付ワイヤ工具 Download PDF

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Publication number
JP2014083673A
JP2014083673A JP2012237282A JP2012237282A JP2014083673A JP 2014083673 A JP2014083673 A JP 2014083673A JP 2012237282 A JP2012237282 A JP 2012237282A JP 2012237282 A JP2012237282 A JP 2012237282A JP 2014083673 A JP2014083673 A JP 2014083673A
Authority
JP
Japan
Prior art keywords
wire
current
abrasive grains
carrying
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012237282A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014083673A5 (enExample
Inventor
Hidetoshi Nakajima
秀俊 中島
Katsunori Shioyama
勝徳 塩山
Akihiro Takaiwa
昭博 高岩
Kazuaki Tanaka
一彰 田中
Osamu Suzuki
理 鈴木
Takahiro Shiota
貴大 潮田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Riken Corundum Co Ltd
Original Assignee
Riken Corundum Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Riken Corundum Co Ltd filed Critical Riken Corundum Co Ltd
Priority to JP2012237282A priority Critical patent/JP2014083673A/ja
Priority to CN201380055808.3A priority patent/CN104903055A/zh
Priority to PCT/JP2013/078834 priority patent/WO2014065372A1/ja
Priority to KR1020157010721A priority patent/KR20150060915A/ko
Priority to US14/437,988 priority patent/US20150283666A1/en
Priority to DE112013005160.5T priority patent/DE112013005160T5/de
Priority to HK16100535.4A priority patent/HK1212653A1/zh
Priority to TW102138638A priority patent/TWI576205B/zh
Publication of JP2014083673A publication Critical patent/JP2014083673A/ja
Publication of JP2014083673A5 publication Critical patent/JP2014083673A5/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2012237282A 2012-10-26 2012-10-26 砥粒付ワイヤ工具 Pending JP2014083673A (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2012237282A JP2014083673A (ja) 2012-10-26 2012-10-26 砥粒付ワイヤ工具
CN201380055808.3A CN104903055A (zh) 2012-10-26 2013-10-24 带磨粒线材工具
PCT/JP2013/078834 WO2014065372A1 (ja) 2012-10-26 2013-10-24 砥粒付ワイヤ工具
KR1020157010721A KR20150060915A (ko) 2012-10-26 2013-10-24 지립 부착 와이어 공구
US14/437,988 US20150283666A1 (en) 2012-10-26 2013-10-24 Abrasive-grain wire tool
DE112013005160.5T DE112013005160T5 (de) 2012-10-26 2013-10-24 Schleifkorndrahtwerkzeug
HK16100535.4A HK1212653A1 (zh) 2012-10-26 2013-10-24 带磨粒线材工具
TW102138638A TWI576205B (zh) 2012-10-26 2013-10-25 附有硏磨粒之線工具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012237282A JP2014083673A (ja) 2012-10-26 2012-10-26 砥粒付ワイヤ工具

Publications (2)

Publication Number Publication Date
JP2014083673A true JP2014083673A (ja) 2014-05-12
JP2014083673A5 JP2014083673A5 (enExample) 2015-11-26

Family

ID=50544744

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012237282A Pending JP2014083673A (ja) 2012-10-26 2012-10-26 砥粒付ワイヤ工具

Country Status (8)

Country Link
US (1) US20150283666A1 (enExample)
JP (1) JP2014083673A (enExample)
KR (1) KR20150060915A (enExample)
CN (1) CN104903055A (enExample)
DE (1) DE112013005160T5 (enExample)
HK (1) HK1212653A1 (enExample)
TW (1) TWI576205B (enExample)
WO (1) WO2014065372A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6172053B2 (ja) * 2014-05-28 2017-08-02 信越半導体株式会社 固定砥粒ワイヤ及びワイヤソー並びにワークの切断方法
MX2018009428A (es) * 2016-02-22 2018-11-09 Almt Corp Herramienta abrasiva.
SG11202111151XA (en) * 2019-04-09 2021-11-29 Entegris Inc Segment designs for discs
CN114346922A (zh) * 2021-12-17 2022-04-15 淄博理研泰山涂附磨具有限公司 一种一体覆胶的图案型涂附磨具及其制备方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0796454A (ja) * 1993-09-24 1995-04-11 Kenichi Ishikawa ダイヤモンド電着ワイヤ工具及びその製造方法
JP2004050318A (ja) * 2002-07-17 2004-02-19 Noritake Super Abrasive:Kk ワイヤソー
JP2009066689A (ja) * 2007-09-12 2009-04-02 Read Co Ltd 固定砥粒ワイヤーソー
WO2010141206A2 (en) * 2009-06-05 2010-12-09 Applied Materials, Inc. Method and apparatus for manufacturing an abrasive wire
JP2011140095A (ja) * 2010-01-07 2011-07-21 Noritake Co Ltd 電着ワイヤー工具およびその製造方法
JP2011161613A (ja) * 2010-02-15 2011-08-25 Kanai Hiroaki 固定砥粒式ソーワイヤ
US20110263187A1 (en) * 2010-04-27 2011-10-27 Yen-Kang Liu Wire saw and method for fabricating the same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101618575A (zh) * 2008-07-01 2010-01-06 捷斯奥企业有限公司 具有磨粒的线材的制造方法
WO2011158834A1 (ja) * 2010-06-15 2011-12-22 新日本製鐵株式会社 ソーワイヤ

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0796454A (ja) * 1993-09-24 1995-04-11 Kenichi Ishikawa ダイヤモンド電着ワイヤ工具及びその製造方法
JP2004050318A (ja) * 2002-07-17 2004-02-19 Noritake Super Abrasive:Kk ワイヤソー
JP2009066689A (ja) * 2007-09-12 2009-04-02 Read Co Ltd 固定砥粒ワイヤーソー
WO2010141206A2 (en) * 2009-06-05 2010-12-09 Applied Materials, Inc. Method and apparatus for manufacturing an abrasive wire
JP2011140095A (ja) * 2010-01-07 2011-07-21 Noritake Co Ltd 電着ワイヤー工具およびその製造方法
JP2011161613A (ja) * 2010-02-15 2011-08-25 Kanai Hiroaki 固定砥粒式ソーワイヤ
US20110263187A1 (en) * 2010-04-27 2011-10-27 Yen-Kang Liu Wire saw and method for fabricating the same

Also Published As

Publication number Publication date
WO2014065372A1 (ja) 2014-05-01
TW201429632A (zh) 2014-08-01
DE112013005160T5 (de) 2015-08-06
KR20150060915A (ko) 2015-06-03
TWI576205B (zh) 2017-04-01
HK1212653A1 (zh) 2016-06-17
US20150283666A1 (en) 2015-10-08
CN104903055A (zh) 2015-09-09

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