HK1212653A1 - 带磨粒线材工具 - Google Patents

带磨粒线材工具 Download PDF

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Publication number
HK1212653A1
HK1212653A1 HK16100535.4A HK16100535A HK1212653A1 HK 1212653 A1 HK1212653 A1 HK 1212653A1 HK 16100535 A HK16100535 A HK 16100535A HK 1212653 A1 HK1212653 A1 HK 1212653A1
Authority
HK
Hong Kong
Prior art keywords
abrasive
abrasive grains
holes
wire
plating
Prior art date
Application number
HK16100535.4A
Other languages
English (en)
Chinese (zh)
Inventor
中島秀俊
中岛秀俊
鹽山勝德
盐山胜德
高岩昭博
田中彰
田中一彰
鈴木理
铃木理
潮田貴大
潮田贵大
Original Assignee
理研客乐好磨株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 理研客乐好磨株式会社 filed Critical 理研客乐好磨株式会社
Publication of HK1212653A1 publication Critical patent/HK1212653A1/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
HK16100535.4A 2012-10-26 2013-10-24 带磨粒线材工具 HK1212653A1 (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012-237282 2012-10-26
JP2012237282A JP2014083673A (ja) 2012-10-26 2012-10-26 砥粒付ワイヤ工具
PCT/JP2013/078834 WO2014065372A1 (ja) 2012-10-26 2013-10-24 砥粒付ワイヤ工具

Publications (1)

Publication Number Publication Date
HK1212653A1 true HK1212653A1 (zh) 2016-06-17

Family

ID=50544744

Family Applications (1)

Application Number Title Priority Date Filing Date
HK16100535.4A HK1212653A1 (zh) 2012-10-26 2013-10-24 带磨粒线材工具

Country Status (8)

Country Link
US (1) US20150283666A1 (enExample)
JP (1) JP2014083673A (enExample)
KR (1) KR20150060915A (enExample)
CN (1) CN104903055A (enExample)
DE (1) DE112013005160T5 (enExample)
HK (1) HK1212653A1 (enExample)
TW (1) TWI576205B (enExample)
WO (1) WO2014065372A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6172053B2 (ja) * 2014-05-28 2017-08-02 信越半導体株式会社 固定砥粒ワイヤ及びワイヤソー並びにワークの切断方法
MX2018009428A (es) * 2016-02-22 2018-11-09 Almt Corp Herramienta abrasiva.
SG11202111151XA (en) * 2019-04-09 2021-11-29 Entegris Inc Segment designs for discs
CN114346922A (zh) * 2021-12-17 2022-04-15 淄博理研泰山涂附磨具有限公司 一种一体覆胶的图案型涂附磨具及其制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3557231B2 (ja) * 1993-09-24 2004-08-25 憲一 石川 ダイヤモンド電着ワイヤ工具及びその製造方法
JP3725098B2 (ja) * 2002-07-17 2005-12-07 株式会社ノリタケスーパーアブレーシブ ワイヤソー
JP2009066689A (ja) * 2007-09-12 2009-04-02 Read Co Ltd 固定砥粒ワイヤーソー
CN101618575A (zh) * 2008-07-01 2010-01-06 捷斯奥企业有限公司 具有磨粒的线材的制造方法
WO2010141206A2 (en) * 2009-06-05 2010-12-09 Applied Materials, Inc. Method and apparatus for manufacturing an abrasive wire
JP5468392B2 (ja) * 2010-01-07 2014-04-09 株式会社ノリタケカンパニーリミテド 電着ワイヤー工具およびその製造方法
JP5541941B2 (ja) * 2010-02-15 2014-07-09 金井 宏彰 固定砥粒式ソーワイヤ
TWI461249B (zh) * 2010-04-27 2014-11-21 Kinik Co 線鋸及其製作方法
WO2011158834A1 (ja) * 2010-06-15 2011-12-22 新日本製鐵株式会社 ソーワイヤ

Also Published As

Publication number Publication date
JP2014083673A (ja) 2014-05-12
WO2014065372A1 (ja) 2014-05-01
TW201429632A (zh) 2014-08-01
DE112013005160T5 (de) 2015-08-06
KR20150060915A (ko) 2015-06-03
TWI576205B (zh) 2017-04-01
US20150283666A1 (en) 2015-10-08
CN104903055A (zh) 2015-09-09

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