CN104903055A - 带磨粒线材工具 - Google Patents

带磨粒线材工具 Download PDF

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Publication number
CN104903055A
CN104903055A CN201380055808.3A CN201380055808A CN104903055A CN 104903055 A CN104903055 A CN 104903055A CN 201380055808 A CN201380055808 A CN 201380055808A CN 104903055 A CN104903055 A CN 104903055A
Authority
CN
China
Prior art keywords
abrasive grains
wire
abrasive
plating
wire tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201380055808.3A
Other languages
English (en)
Chinese (zh)
Inventor
中岛秀俊
盐山胜德
高岩昭博
田中一彰
铃木理
潮田贵大
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Riken Corundum Co Ltd
Original Assignee
Riken Corundum Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Riken Corundum Co Ltd filed Critical Riken Corundum Co Ltd
Publication of CN104903055A publication Critical patent/CN104903055A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
CN201380055808.3A 2012-10-26 2013-10-24 带磨粒线材工具 Pending CN104903055A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012-237282 2012-10-26
JP2012237282A JP2014083673A (ja) 2012-10-26 2012-10-26 砥粒付ワイヤ工具
PCT/JP2013/078834 WO2014065372A1 (ja) 2012-10-26 2013-10-24 砥粒付ワイヤ工具

Publications (1)

Publication Number Publication Date
CN104903055A true CN104903055A (zh) 2015-09-09

Family

ID=50544744

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380055808.3A Pending CN104903055A (zh) 2012-10-26 2013-10-24 带磨粒线材工具

Country Status (8)

Country Link
US (1) US20150283666A1 (enExample)
JP (1) JP2014083673A (enExample)
KR (1) KR20150060915A (enExample)
CN (1) CN104903055A (enExample)
DE (1) DE112013005160T5 (enExample)
HK (1) HK1212653A1 (enExample)
TW (1) TWI576205B (enExample)
WO (1) WO2014065372A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113661031A (zh) * 2019-04-09 2021-11-16 恩特格里斯公司 圆盘的区段设计
CN114346922A (zh) * 2021-12-17 2022-04-15 淄博理研泰山涂附磨具有限公司 一种一体覆胶的图案型涂附磨具及其制备方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6172053B2 (ja) * 2014-05-28 2017-08-02 信越半導体株式会社 固定砥粒ワイヤ及びワイヤソー並びにワークの切断方法
MX2018009428A (es) * 2016-02-22 2018-11-09 Almt Corp Herramienta abrasiva.

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0796454A (ja) * 1993-09-24 1995-04-11 Kenichi Ishikawa ダイヤモンド電着ワイヤ工具及びその製造方法
JP2009066689A (ja) * 2007-09-12 2009-04-02 Read Co Ltd 固定砥粒ワイヤーソー
CN101618575A (zh) * 2008-07-01 2010-01-06 捷斯奥企业有限公司 具有磨粒的线材的制造方法
WO2010141206A2 (en) * 2009-06-05 2010-12-09 Applied Materials, Inc. Method and apparatus for manufacturing an abrasive wire
US20110263187A1 (en) * 2010-04-27 2011-10-27 Yen-Kang Liu Wire saw and method for fabricating the same
CN102712080A (zh) * 2010-06-15 2012-10-03 新日本制铁株式会社 锯线

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3725098B2 (ja) * 2002-07-17 2005-12-07 株式会社ノリタケスーパーアブレーシブ ワイヤソー
JP5468392B2 (ja) * 2010-01-07 2014-04-09 株式会社ノリタケカンパニーリミテド 電着ワイヤー工具およびその製造方法
JP5541941B2 (ja) * 2010-02-15 2014-07-09 金井 宏彰 固定砥粒式ソーワイヤ

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0796454A (ja) * 1993-09-24 1995-04-11 Kenichi Ishikawa ダイヤモンド電着ワイヤ工具及びその製造方法
JP2009066689A (ja) * 2007-09-12 2009-04-02 Read Co Ltd 固定砥粒ワイヤーソー
CN101618575A (zh) * 2008-07-01 2010-01-06 捷斯奥企业有限公司 具有磨粒的线材的制造方法
WO2010141206A2 (en) * 2009-06-05 2010-12-09 Applied Materials, Inc. Method and apparatus for manufacturing an abrasive wire
US20110263187A1 (en) * 2010-04-27 2011-10-27 Yen-Kang Liu Wire saw and method for fabricating the same
CN102712080A (zh) * 2010-06-15 2012-10-03 新日本制铁株式会社 锯线

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113661031A (zh) * 2019-04-09 2021-11-16 恩特格里斯公司 圆盘的区段设计
CN113661031B (zh) * 2019-04-09 2024-05-07 恩特格里斯公司 用于化学机械平坦化组合件的垫修整器和垫修整器组合件
CN114346922A (zh) * 2021-12-17 2022-04-15 淄博理研泰山涂附磨具有限公司 一种一体覆胶的图案型涂附磨具及其制备方法

Also Published As

Publication number Publication date
JP2014083673A (ja) 2014-05-12
WO2014065372A1 (ja) 2014-05-01
TW201429632A (zh) 2014-08-01
DE112013005160T5 (de) 2015-08-06
KR20150060915A (ko) 2015-06-03
TWI576205B (zh) 2017-04-01
HK1212653A1 (zh) 2016-06-17
US20150283666A1 (en) 2015-10-08

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