JP2014080461A - 研磨用組成物の製造方法及び研磨用組成物 - Google Patents

研磨用組成物の製造方法及び研磨用組成物 Download PDF

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Publication number
JP2014080461A
JP2014080461A JP2012227405A JP2012227405A JP2014080461A JP 2014080461 A JP2014080461 A JP 2014080461A JP 2012227405 A JP2012227405 A JP 2012227405A JP 2012227405 A JP2012227405 A JP 2012227405A JP 2014080461 A JP2014080461 A JP 2014080461A
Authority
JP
Japan
Prior art keywords
water
soluble polymer
polishing composition
less
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012227405A
Other languages
English (en)
Japanese (ja)
Inventor
Tomohiro Imao
智宏 今尾
Yoshio Mori
嘉男 森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujimi Inc
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimi Inc filed Critical Fujimi Inc
Priority to JP2012227405A priority Critical patent/JP2014080461A/ja
Priority to PCT/JP2013/077333 priority patent/WO2014057932A1/ja
Priority to TW102136528A priority patent/TW201422797A/zh
Publication of JP2014080461A publication Critical patent/JP2014080461A/ja
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2012227405A 2012-10-12 2012-10-12 研磨用組成物の製造方法及び研磨用組成物 Pending JP2014080461A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2012227405A JP2014080461A (ja) 2012-10-12 2012-10-12 研磨用組成物の製造方法及び研磨用組成物
PCT/JP2013/077333 WO2014057932A1 (ja) 2012-10-12 2013-10-08 研磨用組成物の製造方法及び研磨用組成物
TW102136528A TW201422797A (zh) 2012-10-12 2013-10-09 研磨用組成物之製造方法及研磨用組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012227405A JP2014080461A (ja) 2012-10-12 2012-10-12 研磨用組成物の製造方法及び研磨用組成物

Publications (1)

Publication Number Publication Date
JP2014080461A true JP2014080461A (ja) 2014-05-08

Family

ID=50477399

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012227405A Pending JP2014080461A (ja) 2012-10-12 2012-10-12 研磨用組成物の製造方法及び研磨用組成物

Country Status (3)

Country Link
JP (1) JP2014080461A (zh)
TW (1) TW201422797A (zh)
WO (1) WO2014057932A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019111686A1 (ja) * 2017-12-08 2019-06-13 株式会社フジミインコーポレーテッド 研磨用組成物
JP2019104781A (ja) * 2017-12-08 2019-06-27 ダイセルファインケム株式会社 疎水化ヒドロキシエチルセルロースの製造方法及び研磨助剤

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004128089A (ja) * 2002-09-30 2004-04-22 Fujimi Inc 研磨用組成物及びそれを用いたシリコンウエハの研磨方法、並びにリンス用組成物及びそれを用いたシリコンウエハのリンス方法
JP2008053415A (ja) * 2006-08-24 2008-03-06 Fujimi Inc 研磨用組成物及び研磨方法
JP2008235491A (ja) * 2007-03-19 2008-10-02 Nitta Haas Inc 研磨用組成物
JP2009035701A (ja) * 2006-09-08 2009-02-19 Kao Corp 研磨液組成物
JP2010010167A (ja) * 2008-06-24 2010-01-14 Jsr Corp 化学機械研磨用水系分散体、化学機械研磨用水系分散体の製造方法および化学機械研磨方法
JP2010017841A (ja) * 2008-06-11 2010-01-28 Shin-Etsu Chemical Co Ltd 合成石英ガラス基板用研磨剤
JP2010034509A (ja) * 2008-07-03 2010-02-12 Fujimi Inc 半導体用濡れ剤、それを用いた研磨用組成物および研磨方法
JP2011061089A (ja) * 2009-09-11 2011-03-24 Kao Corp 研磨液組成物
JP2011097045A (ja) * 2009-09-30 2011-05-12 Nitta Haas Inc 研磨組成物
WO2012105651A1 (ja) * 2011-02-03 2012-08-09 ニッタ・ハース株式会社 研磨用組成物およびそれを用いた研磨方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10309660A (ja) * 1997-05-07 1998-11-24 Tokuyama Corp 仕上げ研磨剤
JP4776387B2 (ja) * 2006-02-06 2011-09-21 日立化成工業株式会社 酸化セリウム研磨剤および基板の研磨法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004128089A (ja) * 2002-09-30 2004-04-22 Fujimi Inc 研磨用組成物及びそれを用いたシリコンウエハの研磨方法、並びにリンス用組成物及びそれを用いたシリコンウエハのリンス方法
JP2008053415A (ja) * 2006-08-24 2008-03-06 Fujimi Inc 研磨用組成物及び研磨方法
JP2009035701A (ja) * 2006-09-08 2009-02-19 Kao Corp 研磨液組成物
JP2008235491A (ja) * 2007-03-19 2008-10-02 Nitta Haas Inc 研磨用組成物
JP2010017841A (ja) * 2008-06-11 2010-01-28 Shin-Etsu Chemical Co Ltd 合成石英ガラス基板用研磨剤
JP2010010167A (ja) * 2008-06-24 2010-01-14 Jsr Corp 化学機械研磨用水系分散体、化学機械研磨用水系分散体の製造方法および化学機械研磨方法
JP2010034509A (ja) * 2008-07-03 2010-02-12 Fujimi Inc 半導体用濡れ剤、それを用いた研磨用組成物および研磨方法
JP2011061089A (ja) * 2009-09-11 2011-03-24 Kao Corp 研磨液組成物
JP2011097045A (ja) * 2009-09-30 2011-05-12 Nitta Haas Inc 研磨組成物
WO2012105651A1 (ja) * 2011-02-03 2012-08-09 ニッタ・ハース株式会社 研磨用組成物およびそれを用いた研磨方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019111686A1 (ja) * 2017-12-08 2019-06-13 株式会社フジミインコーポレーテッド 研磨用組成物
JP2019104781A (ja) * 2017-12-08 2019-06-27 ダイセルファインケム株式会社 疎水化ヒドロキシエチルセルロースの製造方法及び研磨助剤
JPWO2019111686A1 (ja) * 2017-12-08 2021-01-14 株式会社フジミインコーポレーテッド 研磨用組成物
JP7303115B2 (ja) 2017-12-08 2023-07-04 株式会社フジミインコーポレーテッド 研磨用組成物

Also Published As

Publication number Publication date
WO2014057932A1 (ja) 2014-04-17
TW201422797A (zh) 2014-06-16

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