JP2014033104A - 放熱部品及びその製造方法 - Google Patents

放熱部品及びその製造方法 Download PDF

Info

Publication number
JP2014033104A
JP2014033104A JP2012173143A JP2012173143A JP2014033104A JP 2014033104 A JP2014033104 A JP 2014033104A JP 2012173143 A JP2012173143 A JP 2012173143A JP 2012173143 A JP2012173143 A JP 2012173143A JP 2014033104 A JP2014033104 A JP 2014033104A
Authority
JP
Japan
Prior art keywords
carbon
plating layer
base material
carbon nanotubes
carbon material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012173143A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014033104A5 (enExample
Inventor
Kenji Kawamura
賢二 川村
Shuzo Aoki
周三 青木
Masao Nakazawa
昌夫 中沢
Yoriyuki Suwa
順之 諏訪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2012173143A priority Critical patent/JP2014033104A/ja
Priority to US13/951,582 priority patent/US20140034282A1/en
Priority to TW102127221A priority patent/TW201423920A/zh
Priority to CN201310332818.9A priority patent/CN103579140A/zh
Publication of JP2014033104A publication Critical patent/JP2014033104A/ja
Publication of JP2014033104A5 publication Critical patent/JP2014033104A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/007—Electroplating using magnetic fields, e.g. magnets
    • C25D5/009—Deposition of ferromagnetic material
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B32/00—Carbon; Compounds thereof
    • C01B32/15—Nano-sized carbon materials
    • C01B32/158—Carbon nanotubes
    • C01B32/16—Preparation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1662—Use of incorporated material in the solution or dispersion, e.g. particles, whiskers, wires
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1664—Process features with additional means during the plating process
    • C23C18/1673—Magnetic field
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/007—Electroplating using magnetic fields, e.g. magnets
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B2202/00—Structure or properties of carbon nanotubes
    • C01B2202/20—Nanotubes characterized by their properties
    • C01B2202/34—Length
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B2202/00—Structure or properties of carbon nanotubes
    • C01B2202/20—Nanotubes characterized by their properties
    • C01B2202/36—Diameter
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Nanotechnology (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2012173143A 2012-08-03 2012-08-03 放熱部品及びその製造方法 Pending JP2014033104A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012173143A JP2014033104A (ja) 2012-08-03 2012-08-03 放熱部品及びその製造方法
US13/951,582 US20140034282A1 (en) 2012-08-03 2013-07-26 Heat radiation component and method for manufacturing heat radiation component
TW102127221A TW201423920A (zh) 2012-08-03 2013-07-30 散熱元件及其製造方法
CN201310332818.9A CN103579140A (zh) 2012-08-03 2013-08-02 散热元件及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012173143A JP2014033104A (ja) 2012-08-03 2012-08-03 放熱部品及びその製造方法

Publications (2)

Publication Number Publication Date
JP2014033104A true JP2014033104A (ja) 2014-02-20
JP2014033104A5 JP2014033104A5 (enExample) 2015-09-10

Family

ID=50024329

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012173143A Pending JP2014033104A (ja) 2012-08-03 2012-08-03 放熱部品及びその製造方法

Country Status (4)

Country Link
US (1) US20140034282A1 (enExample)
JP (1) JP2014033104A (enExample)
CN (1) CN103579140A (enExample)
TW (1) TW201423920A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016012448A (ja) * 2014-06-27 2016-01-21 Tdk株式会社 導電線
WO2017115832A1 (ja) * 2015-12-28 2017-07-06 日立造船株式会社 カーボンナノチューブ複合材およびカーボンナノチューブ複合材の製造方法
WO2017154885A1 (ja) * 2016-03-09 2017-09-14 日立造船株式会社 カーボンナノチューブ構造体の起毛方法、カーボンナノチューブ構造体の製造方法およびカーボンナノチューブ構造体

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9210806B2 (en) * 2004-06-02 2015-12-08 Joel S. Douglas Bondable conductive ink
JP6118540B2 (ja) * 2012-11-08 2017-04-19 新光電気工業株式会社 放熱部品及びその製造方法
WO2016180278A1 (zh) * 2015-05-08 2016-11-17 宁波信远工业集团有限公司 一种波热转化结构及其应用
JP6489979B2 (ja) * 2015-09-07 2019-03-27 新光電気工業株式会社 放熱部品及びその製造方法
US12035448B2 (en) * 2015-11-23 2024-07-09 Daniel Paul Hashim Dielectric heating of three-dimensional carbon nanostructured porous foams as a heat exchanger for volumetric heating of flowing fluids
US10082918B2 (en) 2016-11-08 2018-09-25 International Business Machines Corporation In-cell capacitive touch and fingerprint detector
FR3087938A1 (fr) * 2018-10-25 2020-05-01 Thales Interface de diffusion thermique

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005089836A (ja) * 2003-09-18 2005-04-07 Shinko Electric Ind Co Ltd 放熱部材及びその製造方法
JP2007532335A (ja) * 2004-04-13 2007-11-15 ユナイテッド ステイツ オブ アメリカ アズ リプリゼンティッド バイ ザ アドミニストレイター オブ ザ ナサ カーボンナノチューブ・アレイ複合材料をベースにするナノ加工熱材料
JP2010192661A (ja) * 2009-02-18 2010-09-02 Sumitomo Electric Ind Ltd 放熱部品とその製造方法、およびこれを用いた放熱装置と放熱方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3796587A (en) * 1972-07-10 1974-03-12 Union Carbide Corp Carbon fiber reinforced nickel matrix composite having an intermediate layer of metal carbide
US5545473A (en) * 1994-02-14 1996-08-13 W. L. Gore & Associates, Inc. Thermally conductive interface
US6340822B1 (en) * 1999-10-05 2002-01-22 Agere Systems Guardian Corp. Article comprising vertically nano-interconnected circuit devices and method for making the same
US20090255660A1 (en) * 2008-04-10 2009-10-15 Metal Matrix Cast Composites, Llc High Thermal Conductivity Heat Sinks With Z-Axis Inserts
JP5239768B2 (ja) * 2008-11-14 2013-07-17 富士通株式会社 放熱材料並びに電子機器及びその製造方法
CN101989583B (zh) * 2009-08-05 2013-04-24 清华大学 散热结构及使用该散热结构的散热系统
WO2011078934A1 (en) * 2009-12-01 2011-06-30 Applied Nanostructured Solutions, Llc Metal matrix composite materials containing carbon nanotube-infused fiber materials and methods for production thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005089836A (ja) * 2003-09-18 2005-04-07 Shinko Electric Ind Co Ltd 放熱部材及びその製造方法
JP2007532335A (ja) * 2004-04-13 2007-11-15 ユナイテッド ステイツ オブ アメリカ アズ リプリゼンティッド バイ ザ アドミニストレイター オブ ザ ナサ カーボンナノチューブ・アレイ複合材料をベースにするナノ加工熱材料
JP2010192661A (ja) * 2009-02-18 2010-09-02 Sumitomo Electric Ind Ltd 放熱部品とその製造方法、およびこれを用いた放熱装置と放熱方法

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016012448A (ja) * 2014-06-27 2016-01-21 Tdk株式会社 導電線
WO2017115832A1 (ja) * 2015-12-28 2017-07-06 日立造船株式会社 カーボンナノチューブ複合材およびカーボンナノチューブ複合材の製造方法
KR20180099695A (ko) * 2015-12-28 2018-09-05 히다치 조센 가부시키가이샤 카본나노튜브 복합재 및 카본나노튜브 복합재의 제조방법
JPWO2017115832A1 (ja) * 2015-12-28 2018-11-29 日立造船株式会社 カーボンナノチューブ複合材およびカーボンナノチューブ複合材の製造方法
US10836633B2 (en) 2015-12-28 2020-11-17 Hitachi Zosen Corporation Carbon nanotube composite material and method for producing carbon nanotube composite material
CN114133918A (zh) * 2015-12-28 2022-03-04 日立造船株式会社 碳纳米管复合材料以及碳纳米管复合材料的制造方法
US11414321B2 (en) 2015-12-28 2022-08-16 Hitachi Zosen Corporation Carbon nanotube composite material and method for producing carbon nanotube composite material
KR102570247B1 (ko) 2015-12-28 2023-08-23 히다치 조센 가부시키가이샤 카본나노튜브 복합재 및 카본나노튜브 복합재의 제조방법
WO2017154885A1 (ja) * 2016-03-09 2017-09-14 日立造船株式会社 カーボンナノチューブ構造体の起毛方法、カーボンナノチューブ構造体の製造方法およびカーボンナノチューブ構造体
JPWO2017154885A1 (ja) * 2016-03-09 2019-02-14 日立造船株式会社 カーボンナノチューブ構造体の起毛方法、カーボンナノチューブ構造体の製造方法およびカーボンナノチューブ構造体
US10710880B2 (en) 2016-03-09 2020-07-14 Hitachi Zosen Corporation Method for uplifting carbon nanotube structure, method for producing carbon nanotube structure, and carbon nanotube structure

Also Published As

Publication number Publication date
CN103579140A (zh) 2014-02-12
US20140034282A1 (en) 2014-02-06
TW201423920A (zh) 2014-06-16

Similar Documents

Publication Publication Date Title
JP2014033104A (ja) 放熱部品及びその製造方法
US9136200B2 (en) Heat radiating component and method of producing same
Zhang et al. Magnetic field enhanced electrocatalytic oxygen evolution of NiFe‐LDH/Co3O4 p‐n heterojunction supported on nickel foam
JP6118540B2 (ja) 放熱部品及びその製造方法
KR101476424B1 (ko) 반도체칩용 열계면 재료 및 그것의 형성방법
JP5102328B2 (ja) 熱伝導部材の製造方法
US20090224422A1 (en) Methods of fabricating a composite carbon nanotube thermal interface device
KR101004189B1 (ko) 높은 전기 전도도 및 열 전도도를 갖는 탄소 나노튜브아키텍처 및 컴포지트의 형성 방법 및 그에 의해 형성된구조물
CN101768427A (zh) 热界面材料及其制备方法
Wang et al. Designed Synthesis of Size‐Controlled Pt Cu Alloy Nanoparticles Encapsulated in Carbon Nanofibers and Their High Efficient Electrocatalytic Activity Toward Hydrogen Evolution Reaction
JP2013115094A (ja) 放熱材料及びその製造方法
JPH10330177A (ja) 金属−グラファイト複合体及びそれを用いた放熱体
JP6489979B2 (ja) 放熱部品及びその製造方法
JP6202104B2 (ja) シート状構造体、これを用いた電子機器、シート状構造体の製造方法、及び電子機器の製造方法
JP5340069B2 (ja) 炭素−金属複合体およびこれを用いた回路部材または放熱部材
TWI312380B (enExample)
JP5899804B2 (ja) 放熱シート及び該放熱シートの製造方法
Khosravi et al. Flame synthesis of carbon nanofibers on carbon paper: Physicochemical characterization and application as catalyst support for methanol oxidation
JP4899045B2 (ja) ナノカーボン材料の生成方法、生成装置、及びナノカーボン材料
Ren et al. Prussian blue analog‐derived bimetallic phosphide nanoparticles anchored in nitrogen‐doped porous electrospun carbon nanofibers for efficient oxygen evolution reaction
JP2009220209A (ja) カーボンナノチューブ繊維製造方法およびカーボンナノチューブ繊維製造装置
CN107919258B (zh) 一种产生可控涡旋电子束的装置及方法
JP2007115868A (ja) 熱拡散シート及び半導体装置
TWI310982B (enExample)
Wang et al. Ligand‐Engineered Cu@ Ni Core‐Shell Nanoparticles with Excellent Performance for Printed Electronics

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150728

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20150728

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20160527

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20160607

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20170307