JP2014025095A5 - - Google Patents
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- Publication number
- JP2014025095A5 JP2014025095A5 JP2012164699A JP2012164699A JP2014025095A5 JP 2014025095 A5 JP2014025095 A5 JP 2014025095A5 JP 2012164699 A JP2012164699 A JP 2012164699A JP 2012164699 A JP2012164699 A JP 2012164699A JP 2014025095 A5 JP2014025095 A5 JP 2014025095A5
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- crystal polymer
- coupling agent
- metal
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 11
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 11
- 239000007769 metal material Substances 0.000 claims description 11
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- 229910052718 tin Inorganic materials 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- 229910052726 zirconium Inorganic materials 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 229910052684 Cerium Inorganic materials 0.000 claims description 3
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 claims description 3
- 229910052749 magnesium Inorganic materials 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 229910052738 indium Inorganic materials 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000007822 coupling agent Substances 0.000 claims 7
- 239000010410 layer Substances 0.000 claims 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 4
- 239000002131 composite material Substances 0.000 claims 3
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims 2
- 239000003990 capacitor Substances 0.000 claims 2
- 239000011777 magnesium Substances 0.000 claims 2
- 229910052757 nitrogen Inorganic materials 0.000 claims 2
- 239000002344 surface layer Substances 0.000 claims 2
- 239000006087 Silane Coupling Agent Substances 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- SMYKVLBUSSNXMV-UHFFFAOYSA-J aluminum;tetrahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[Al+3] SMYKVLBUSSNXMV-UHFFFAOYSA-J 0.000 claims 1
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 claims 1
- 238000001746 injection moulding Methods 0.000 claims 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims 1
- 229910052758 niobium Inorganic materials 0.000 claims 1
- 239000010955 niobium Substances 0.000 claims 1
- OAICVXFJPJFONN-UHFFFAOYSA-N phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims 1
- 229910052715 tantalum Inorganic materials 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N tin hydride Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012164699A JP6134485B2 (ja) | 2012-07-25 | 2012-07-25 | 液晶ポリマーと接合させるための表面を有する金属材料、金属−液晶ポリマー複合体及びその製造方法、並びに、電子部品 |
| TW102124039A TWI599477B (zh) | 2012-07-25 | 2013-07-04 | Metal materials having a surface for bonding with a liquid crystal polymer, a metal-liquid crystal polymer composite, a method of manufacturing the same, and an electronic part |
| KR1020157004621A KR101792925B1 (ko) | 2012-07-25 | 2013-07-10 | 액정 폴리머와 접합시키기 위한 표면을 갖는 금속 재료, 금속-액정 폴리머 복합체 및 그 제조 방법, 그리고 전자 부품 |
| CN201380038989.9A CN104471110A (zh) | 2012-07-25 | 2013-07-10 | 具有用于与液晶聚合物接合的表面的金属材料、金属-液晶聚合物复合体及其制造方法、以及电子部件 |
| CN201810722491.9A CN108998793A (zh) | 2012-07-25 | 2013-07-10 | 金属材料、金属-液晶聚合物复合体及其制造方法、以及电子部件 |
| PCT/JP2013/068890 WO2014017299A1 (ja) | 2012-07-25 | 2013-07-10 | 液晶ポリマーと接合させるための表面を有する金属材料、金属－液晶ポリマー複合体及びその製造方法、並びに、電子部品 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012164699A JP6134485B2 (ja) | 2012-07-25 | 2012-07-25 | 液晶ポリマーと接合させるための表面を有する金属材料、金属−液晶ポリマー複合体及びその製造方法、並びに、電子部品 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014025095A JP2014025095A (ja) | 2014-02-06 |
| JP2014025095A5 true JP2014025095A5 (zh) | 2015-02-05 |
| JP6134485B2 JP6134485B2 (ja) | 2017-05-24 |
Family
ID=49997115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012164699A Active JP6134485B2 (ja) | 2012-07-25 | 2012-07-25 | 液晶ポリマーと接合させるための表面を有する金属材料、金属−液晶ポリマー複合体及びその製造方法、並びに、電子部品 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6134485B2 (zh) |
| KR (1) | KR101792925B1 (zh) |
| CN (2) | CN104471110A (zh) |
| TW (1) | TWI599477B (zh) |
| WO (1) | WO2014017299A1 (zh) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE112017000516B4 (de) | 2016-01-27 | 2020-08-20 | Advanced Technologies, Inc. | Kupferlegierungsgegenstand, Harzelement, Kupferlegierungselement und deren Herstellung |
| JP6511614B2 (ja) | 2017-08-02 | 2019-05-15 | 株式会社新技術研究所 | 金属と樹脂の複合材 |
| USD873801S1 (en) | 2017-12-05 | 2020-01-28 | Bose Corporation | Remote control |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3117699B2 (ja) * | 1990-07-07 | 2000-12-18 | 日本ケミコン株式会社 | 固体コンデンサの外装方法 |
| CN101890829B (zh) * | 1999-09-16 | 2013-03-27 | 日矿材料美国有限公司 | 活性铜箔和其制备方法 |
| JP2001237591A (ja) * | 2000-02-25 | 2001-08-31 | Sony Corp | 電磁波シールド材料及びその製造方法 |
| CN101510468B (zh) * | 2001-04-12 | 2012-01-18 | 昭和电工株式会社 | 铌电容器的制备方法 |
| TW200535259A (en) * | 2004-02-06 | 2005-11-01 | Furukawa Circuit Foil | Treated copper foil and circuit board |
| JP2006245303A (ja) * | 2005-03-03 | 2006-09-14 | Nikko Kinzoku Kk | 銅箔の表面処理方法 |
| WO2010010892A1 (ja) * | 2008-07-22 | 2010-01-28 | 古河電気工業株式会社 | フレキシブル銅張積層板 |
| JP2010199166A (ja) * | 2009-02-24 | 2010-09-09 | Panasonic Corp | 光半導体装置用リードフレームおよび光半導体装置用リードフレームの製造方法 |
| JP2010287588A (ja) * | 2009-06-09 | 2010-12-24 | Nec Tokin Corp | 固体電解コンデンサ |
| JP2012041626A (ja) * | 2010-08-23 | 2012-03-01 | Furukawa Electric Co Ltd:The | 銅張積層基板とその製造方法 |
-
2012
- 2012-07-25 JP JP2012164699A patent/JP6134485B2/ja active Active
-
2013
- 2013-07-04 TW TW102124039A patent/TWI599477B/zh active
- 2013-07-10 CN CN201380038989.9A patent/CN104471110A/zh active Pending
- 2013-07-10 WO PCT/JP2013/068890 patent/WO2014017299A1/ja active Application Filing
- 2013-07-10 CN CN201810722491.9A patent/CN108998793A/zh active Pending
- 2013-07-10 KR KR1020157004621A patent/KR101792925B1/ko active IP Right Grant
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