JP2014025095A5 - - Google Patents
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- JP2014025095A5 JP2014025095A5 JP2012164699A JP2012164699A JP2014025095A5 JP 2014025095 A5 JP2014025095 A5 JP 2014025095A5 JP 2012164699 A JP2012164699 A JP 2012164699A JP 2012164699 A JP2012164699 A JP 2012164699A JP 2014025095 A5 JP2014025095 A5 JP 2014025095A5
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- crystal polymer
- coupling agent
- metal
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 11
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 11
- 239000007769 metal material Substances 0.000 claims description 11
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- 229910052718 tin Inorganic materials 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- 229910052726 zirconium Inorganic materials 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 229910052684 Cerium Inorganic materials 0.000 claims description 3
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 claims description 3
- 229910052749 magnesium Inorganic materials 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 229910052738 indium Inorganic materials 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000007822 coupling agent Substances 0.000 claims 7
- 239000010410 layer Substances 0.000 claims 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 4
- 239000002131 composite material Substances 0.000 claims 3
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims 2
- 239000003990 capacitor Substances 0.000 claims 2
- 239000011777 magnesium Substances 0.000 claims 2
- 229910052757 nitrogen Inorganic materials 0.000 claims 2
- 239000002344 surface layer Substances 0.000 claims 2
- 239000006087 Silane Coupling Agent Substances 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- SMYKVLBUSSNXMV-UHFFFAOYSA-J aluminum;tetrahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[Al+3] SMYKVLBUSSNXMV-UHFFFAOYSA-J 0.000 claims 1
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 claims 1
- 238000001746 injection moulding Methods 0.000 claims 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims 1
- 229910052758 niobium Inorganic materials 0.000 claims 1
- 239000010955 niobium Substances 0.000 claims 1
- OAICVXFJPJFONN-UHFFFAOYSA-N phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims 1
- 229910052715 tantalum Inorganic materials 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N tin hydride Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
Description
以上の知見を基礎として完成した本発明は一側面において、液晶ポリマーと接合させるための表面を有する金属材料であり、STEM(走査型電子顕微鏡)で得られる前記表面の最表層10nm以内におけるEDS(エネルギー分散型X線分析)の濃度プロファイルにおいて、Si、Ti、Al、Zr、Sn、Mg、Ceのいずれかの層の厚みが1nm以上であり、前記表面のSi、Ti、Al、Zr、Sn、Mg、Ceの下方に、Cu、Al、Cr、Ag、Ni、In、Snのいずれか1種以上の金属又はその酸化物の層を有する金属材料である。 The present invention completed on the basis of the above knowledge is, in one aspect, a metal material having a surface to be bonded to a liquid crystal polymer, and an EDS (within the outermost layer of 10 nm on the surface obtained by STEM (scanning electron microscope)). in the concentration profile of the energy dispersive X-ray analysis), Si, Ti, Al, Zr, Sn, Mg, Ri der thickness 1nm or more of any of the layers of Ce, Si of the surface, Ti, Al, Zr, A metal material having a layer of at least one metal of Cu, Al, Cr, Ag, Ni, In, and Sn or an oxide thereof below Sn, Mg, and Ce .
Claims (8)
STEMで得られる前記表面の最表層10nm以内におけるEDS(エネルギー分散型X線分析)の濃度プロファイルにおいて、Si、Ti、Al、Zr、Sn、Mg、Ceのいずれかの層の厚みが1nm以上であり、
前記表面のSi、Ti、Al、Zr、Sn、Mg、Ceの下方に、Cu、Al、Cr、Ag、Ni、In、Snのいずれか1種以上の金属又はその酸化物の層を有する金属材料。 A metal material having a surface for bonding with a liquid crystal polymer;
In the concentration profile of EDS (energy dispersive X-ray analysis) within 10 nm of the outermost surface layer obtained by STEM, the thickness of any layer of Si, Ti, Al, Zr, Sn, Mg, Ce is 1 nm or more. Oh it is,
Metal having at least one metal of Cu, Al, Cr, Ag, Ni, In, Sn or an oxide layer thereof below Si, Ti, Al, Zr, Sn, Mg, Ce on the surface material.
液晶ポリマーと接合させるための前記金属材料の表面が、前記リードフレームの白色めっき表面に窒素を分子内に有するカップリング剤処理で形成されており、
前記リードフレームをケース電極とし、前記ケース電極上にLEDチップが実装され、前記チップが周辺を前記液晶ポリマーからなるケースボディで覆われ、前記ケースボディ内に蛍光体を含有する封止樹脂が充填されることで構成されたLEDパッケージである請求項5に記載の電子部品。 The metal material is a lead frame plated with white,
The surface of the metal material for bonding with the liquid crystal polymer is formed by a coupling agent treatment having nitrogen in the molecule on the white plating surface of the lead frame,
The lead frame is a case electrode, an LED chip is mounted on the case electrode, the chip is covered with a case body made of the liquid crystal polymer, and the case body is filled with a sealing resin containing a phosphor The electronic component according to claim 5 , wherein the electronic component is an LED package configured as described above.
前記陰極端子、前記陽極端子、及び、前記コンデンサ本体が液晶ポリマーで覆われて構成された、アルミ、タンタル及びニオブのうちいずれかのコンデンサである請求項5に記載の電子部品。 The metal material is a cathode terminal, an anode terminal, and a part or all of the capacitor body in which the outermost layer is covered with a metal paste,
The electronic component according to claim 5 , wherein the electronic component is any one of aluminum, tantalum, and niobium, wherein the cathode terminal, the anode terminal, and the capacitor body are covered with a liquid crystal polymer.
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012164699A JP6134485B2 (en) | 2012-07-25 | 2012-07-25 | Metal material having surface for bonding with liquid crystal polymer, metal-liquid crystal polymer composite, method for producing the same, and electronic component |
TW102124039A TWI599477B (en) | 2012-07-25 | 2013-07-04 | Metal materials having a surface for bonding with a liquid crystal polymer, a metal-liquid crystal polymer composite, a method of manufacturing the same, and an electronic part |
CN201380038989.9A CN104471110A (en) | 2012-07-25 | 2013-07-10 | Metal material having surface for bonding to liquid crystal polymer, metal-liquid crystal polymer composite, method for producing same, and electronic component |
CN201810722491.9A CN108998793A (en) | 2012-07-25 | 2013-07-10 | metal material, metal-liquid crystal polymer complex and its manufacturing method and electronic component |
KR1020157004621A KR101792925B1 (en) | 2012-07-25 | 2013-07-10 | Metal material having surface for bonding to liquid crystal polymer, metal-liquid crystal polymer composite, method for producing same, and electronic component |
PCT/JP2013/068890 WO2014017299A1 (en) | 2012-07-25 | 2013-07-10 | Metal material having surface for bonding to liquid crystal polymer, metal-liquid crystal polymer composite, method for producing same, and electronic component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012164699A JP6134485B2 (en) | 2012-07-25 | 2012-07-25 | Metal material having surface for bonding with liquid crystal polymer, metal-liquid crystal polymer composite, method for producing the same, and electronic component |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2014025095A JP2014025095A (en) | 2014-02-06 |
JP2014025095A5 true JP2014025095A5 (en) | 2015-02-05 |
JP6134485B2 JP6134485B2 (en) | 2017-05-24 |
Family
ID=49997115
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012164699A Active JP6134485B2 (en) | 2012-07-25 | 2012-07-25 | Metal material having surface for bonding with liquid crystal polymer, metal-liquid crystal polymer composite, method for producing the same, and electronic component |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6134485B2 (en) |
KR (1) | KR101792925B1 (en) |
CN (2) | CN104471110A (en) |
TW (1) | TWI599477B (en) |
WO (1) | WO2014017299A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108431298B (en) | 2016-01-27 | 2019-06-21 | 株式会社新技术研究所 | Copper or copper alloy articles and manufacturing method comprising surface modified poly ester system resin |
JP6511614B2 (en) | 2017-08-02 | 2019-05-15 | 株式会社新技術研究所 | Composite of metal and resin |
USD873801S1 (en) | 2017-12-05 | 2020-01-28 | Bose Corporation | Remote control |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3117699B2 (en) * | 1990-07-07 | 2000-12-18 | 日本ケミコン株式会社 | Exterior method of solid capacitor |
CN101890829B (en) * | 1999-09-16 | 2013-03-27 | 日矿材料美国有限公司 | Treated copper foil and preparation method thereof |
JP2001237591A (en) * | 2000-02-25 | 2001-08-31 | Sony Corp | Electromagnetic wave shield material and manufacturing method thereof |
CN101510468B (en) * | 2001-04-12 | 2012-01-18 | 昭和电工株式会社 | Production process for niobium capacitor |
TW200535259A (en) * | 2004-02-06 | 2005-11-01 | Furukawa Circuit Foil | Treated copper foil and circuit board |
JP2006245303A (en) * | 2005-03-03 | 2006-09-14 | Nikko Kinzoku Kk | Surface treatment method of copper foil |
JP5638951B2 (en) * | 2008-07-22 | 2014-12-10 | 古河電気工業株式会社 | Flexible copper clad laminate |
JP2010199166A (en) * | 2009-02-24 | 2010-09-09 | Panasonic Corp | Lead frame for optical semiconductor apparatus, and method of manufacturing the same |
JP2010287588A (en) * | 2009-06-09 | 2010-12-24 | Nec Tokin Corp | Solid electrolytic capacitor |
JP2012041626A (en) * | 2010-08-23 | 2012-03-01 | Furukawa Electric Co Ltd:The | Copper-clad laminated board and method for producing the same |
-
2012
- 2012-07-25 JP JP2012164699A patent/JP6134485B2/en active Active
-
2013
- 2013-07-04 TW TW102124039A patent/TWI599477B/en active
- 2013-07-10 KR KR1020157004621A patent/KR101792925B1/en active IP Right Grant
- 2013-07-10 CN CN201380038989.9A patent/CN104471110A/en active Pending
- 2013-07-10 CN CN201810722491.9A patent/CN108998793A/en active Pending
- 2013-07-10 WO PCT/JP2013/068890 patent/WO2014017299A1/en active Application Filing
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