JP2014025095A5 - - Google Patents

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JP2014025095A5
JP2014025095A5 JP2012164699A JP2012164699A JP2014025095A5 JP 2014025095 A5 JP2014025095 A5 JP 2014025095A5 JP 2012164699 A JP2012164699 A JP 2012164699A JP 2012164699 A JP2012164699 A JP 2012164699A JP 2014025095 A5 JP2014025095 A5 JP 2014025095A5
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liquid crystal
crystal polymer
coupling agent
metal
electronic component
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JP2012164699A
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JP6134485B2 (en
JP2014025095A (en
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Priority claimed from JP2012164699A external-priority patent/JP6134485B2/en
Priority to JP2012164699A priority Critical patent/JP6134485B2/en
Priority to TW102124039A priority patent/TWI599477B/en
Priority to KR1020157004621A priority patent/KR101792925B1/en
Priority to CN201810722491.9A priority patent/CN108998793A/en
Priority to CN201380038989.9A priority patent/CN104471110A/en
Priority to PCT/JP2013/068890 priority patent/WO2014017299A1/en
Publication of JP2014025095A publication Critical patent/JP2014025095A/en
Publication of JP2014025095A5 publication Critical patent/JP2014025095A5/ja
Publication of JP6134485B2 publication Critical patent/JP6134485B2/en
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以上の知見を基礎として完成した本発明は一側面において、液晶ポリマーと接合させるための表面を有する金属材料であり、STEM(走査型電子顕微鏡)で得られる前記表面の最表層10nm以内におけるEDS(エネルギー分散型X線分析)の濃度プロファイルにおいて、Si、Ti、Al、Zr、Sn、Mg、Ceのいずれかの層の厚みが1nm以上であり、前記表面のSi、Ti、Al、Zr、Sn、Mg、Ceの下方に、Cu、Al、Cr、Ag、Ni、In、Snのいずれか1種以上の金属又はその酸化物の層を有する金属材料である。 The present invention completed on the basis of the above knowledge is, in one aspect, a metal material having a surface to be bonded to a liquid crystal polymer, and an EDS (within the outermost layer of 10 nm on the surface obtained by STEM (scanning electron microscope)). in the concentration profile of the energy dispersive X-ray analysis), Si, Ti, Al, Zr, Sn, Mg, Ri der thickness 1nm or more of any of the layers of Ce, Si of the surface, Ti, Al, Zr, A metal material having a layer of at least one metal of Cu, Al, Cr, Ag, Ni, In, and Sn or an oxide thereof below Sn, Mg, and Ce .

Claims (8)

液晶ポリマーと接合させるための表面を有する金属材料であり、
STEMで得られる前記表面の最表層10nm以内におけるEDS(エネルギー分散型X線分析)の濃度プロファイルにおいて、Si、Ti、Al、Zr、Sn、Mg、Ceのいずれかの層の厚みが1nm以上であり、
前記表面のSi、Ti、Al、Zr、Sn、Mg、Ceの下方に、Cu、Al、Cr、Ag、Ni、In、Snのいずれか1種以上の金属又はその酸化物の層を有する金属材料。
A metal material having a surface for bonding with a liquid crystal polymer;
In the concentration profile of EDS (energy dispersive X-ray analysis) within 10 nm of the outermost surface layer obtained by STEM, the thickness of any layer of Si, Ti, Al, Zr, Sn, Mg, Ce is 1 nm or more. Oh it is,
Metal having at least one metal of Cu, Al, Cr, Ag, Ni, In, Sn or an oxide layer thereof below Si, Ti, Al, Zr, Sn, Mg, Ce on the surface material.
STEMで得られる前記表面の最表層10nm以内におけるEDS(エネルギー分散型X線分析)の濃度プロファイルにおいて、Si、Ti、Al、Zr、Sn、Mg、Ceのいずれかの層の厚みが1.5nm以上である請求項1に記載の金属材料。   In the concentration profile of EDS (energy dispersive X-ray analysis) within 10 nm of the outermost surface layer obtained by STEM, the thickness of any layer of Si, Ti, Al, Zr, Sn, Mg, and Ce is 1.5 nm. It is the above, The metal material of Claim 1. 請求項1又は2に記載の金属材料の前記表面に液晶ポリマーが接合されてなる金属−液晶ポリマー複合体。 The metal liquid crystal polymer is joined to the surface of the metallic material according to claim 1 or 2 - the liquid crystal polymer composite. 窒素を分子内に含有するシランカップリング剤、チタネートカップリング剤、アルミネートカップリング剤、ジルコニアカップリング剤、マグネシウムカップリング剤、スズカップリング剤、セリウムカップリング剤のいずれかで金属材料に表面処理を施し、前記金属材料の処理面に液晶ポリマーを圧着又は射出成形で接合させる、金属−液晶ポリマー複合体の製造方法。   Surface of metal material with any of silane coupling agent, titanate coupling agent, aluminate coupling agent, zirconia coupling agent, magnesium coupling agent, tin coupling agent and cerium coupling agent containing nitrogen in the molecule A method for producing a metal-liquid crystal polymer composite, comprising: performing treatment and bonding a liquid crystal polymer to the treated surface of the metal material by pressure bonding or injection molding. 請求項に記載の金属−液晶ポリマー複合体を備えた電子部品。 An electronic component comprising the metal-liquid crystal polymer composite according to claim 3 . 前記金属材料が白色めっきをしたリードフレームであり、
液晶ポリマーと接合させるための前記金属材料の表面が、前記リードフレームの白色めっき表面に窒素を分子内に有するカップリング剤処理で形成されており、
前記リードフレームをケース電極とし、前記ケース電極上にLEDチップが実装され、前記チップが周辺を前記液晶ポリマーからなるケースボディで覆われ、前記ケースボディ内に蛍光体を含有する封止樹脂が充填されることで構成されたLEDパッケージである請求項に記載の電子部品。
The metal material is a lead frame plated with white,
The surface of the metal material for bonding with the liquid crystal polymer is formed by a coupling agent treatment having nitrogen in the molecule on the white plating surface of the lead frame,
The lead frame is a case electrode, an LED chip is mounted on the case electrode, the chip is covered with a case body made of the liquid crystal polymer, and the case body is filled with a sealing resin containing a phosphor The electronic component according to claim 5 , wherein the electronic component is an LED package configured as described above.
前記金属材料が陰極端子、陽極端子、及び、最表層が金属ペーストで覆われたコンデンサ本体の一部または全部であり、
前記陰極端子、前記陽極端子、及び、前記コンデンサ本体が液晶ポリマーで覆われて構成された、アルミ、タンタル及びニオブのうちいずれかのコンデンサである請求項に記載の電子部品。
The metal material is a cathode terminal, an anode terminal, and a part or all of the capacitor body in which the outermost layer is covered with a metal paste,
The electronic component according to claim 5 , wherein the electronic component is any one of aluminum, tantalum, and niobium, wherein the cathode terminal, the anode terminal, and the capacitor body are covered with a liquid crystal polymer.
前記液晶ポリマーは、前記金属材料との熱膨張係数の差が±10ppm/℃である請求項のいずれかに記載の電子部品。 The liquid crystal polymer, electronic component according to any of claims 5-7 the difference in thermal expansion coefficient between the metallic material is ± 10 ppm / ° C..
JP2012164699A 2012-07-25 2012-07-25 Metal material having surface for bonding with liquid crystal polymer, metal-liquid crystal polymer composite, method for producing the same, and electronic component Active JP6134485B2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2012164699A JP6134485B2 (en) 2012-07-25 2012-07-25 Metal material having surface for bonding with liquid crystal polymer, metal-liquid crystal polymer composite, method for producing the same, and electronic component
TW102124039A TWI599477B (en) 2012-07-25 2013-07-04 Metal materials having a surface for bonding with a liquid crystal polymer, a metal-liquid crystal polymer composite, a method of manufacturing the same, and an electronic part
CN201380038989.9A CN104471110A (en) 2012-07-25 2013-07-10 Metal material having surface for bonding to liquid crystal polymer, metal-liquid crystal polymer composite, method for producing same, and electronic component
CN201810722491.9A CN108998793A (en) 2012-07-25 2013-07-10 metal material, metal-liquid crystal polymer complex and its manufacturing method and electronic component
KR1020157004621A KR101792925B1 (en) 2012-07-25 2013-07-10 Metal material having surface for bonding to liquid crystal polymer, metal-liquid crystal polymer composite, method for producing same, and electronic component
PCT/JP2013/068890 WO2014017299A1 (en) 2012-07-25 2013-07-10 Metal material having surface for bonding to liquid crystal polymer, metal-liquid crystal polymer composite, method for producing same, and electronic component

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JP2012164699A JP6134485B2 (en) 2012-07-25 2012-07-25 Metal material having surface for bonding with liquid crystal polymer, metal-liquid crystal polymer composite, method for producing the same, and electronic component

Publications (3)

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JP2014025095A JP2014025095A (en) 2014-02-06
JP2014025095A5 true JP2014025095A5 (en) 2015-02-05
JP6134485B2 JP6134485B2 (en) 2017-05-24

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JP (1) JP6134485B2 (en)
KR (1) KR101792925B1 (en)
CN (2) CN104471110A (en)
TW (1) TWI599477B (en)
WO (1) WO2014017299A1 (en)

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CN108431298B (en) 2016-01-27 2019-06-21 株式会社新技术研究所 Copper or copper alloy articles and manufacturing method comprising surface modified poly ester system resin
JP6511614B2 (en) 2017-08-02 2019-05-15 株式会社新技術研究所 Composite of metal and resin
USD873801S1 (en) 2017-12-05 2020-01-28 Bose Corporation Remote control

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JP3117699B2 (en) * 1990-07-07 2000-12-18 日本ケミコン株式会社 Exterior method of solid capacitor
CN101890829B (en) * 1999-09-16 2013-03-27 日矿材料美国有限公司 Treated copper foil and preparation method thereof
JP2001237591A (en) * 2000-02-25 2001-08-31 Sony Corp Electromagnetic wave shield material and manufacturing method thereof
CN101510468B (en) * 2001-04-12 2012-01-18 昭和电工株式会社 Production process for niobium capacitor
TW200535259A (en) * 2004-02-06 2005-11-01 Furukawa Circuit Foil Treated copper foil and circuit board
JP2006245303A (en) * 2005-03-03 2006-09-14 Nikko Kinzoku Kk Surface treatment method of copper foil
JP5638951B2 (en) * 2008-07-22 2014-12-10 古河電気工業株式会社 Flexible copper clad laminate
JP2010199166A (en) * 2009-02-24 2010-09-09 Panasonic Corp Lead frame for optical semiconductor apparatus, and method of manufacturing the same
JP2010287588A (en) * 2009-06-09 2010-12-24 Nec Tokin Corp Solid electrolytic capacitor
JP2012041626A (en) * 2010-08-23 2012-03-01 Furukawa Electric Co Ltd:The Copper-clad laminated board and method for producing the same

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