JP2014027053A5 - - Google Patents
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- JP2014027053A5 JP2014027053A5 JP2012164849A JP2012164849A JP2014027053A5 JP 2014027053 A5 JP2014027053 A5 JP 2014027053A5 JP 2012164849 A JP2012164849 A JP 2012164849A JP 2012164849 A JP2012164849 A JP 2012164849A JP 2014027053 A5 JP2014027053 A5 JP 2014027053A5
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- crystal polymer
- metal
- polymer composite
- coupling agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 21
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 21
- 239000002131 composite material Substances 0.000 claims description 14
- 239000007822 coupling agent Substances 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 239000007769 metal material Substances 0.000 claims description 12
- 238000004381 surface treatment Methods 0.000 claims description 10
- 239000007864 aqueous solution Substances 0.000 claims description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Chemical group N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 238000001746 injection moulding Methods 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- 239000000243 solution Substances 0.000 claims description 4
- 125000000524 functional group Chemical group 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 229910052738 indium Inorganic materials 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 239000003990 capacitor Substances 0.000 claims 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 125000003277 amino group Chemical group 0.000 claims 1
- 238000005452 bending Methods 0.000 claims 1
- 125000001951 carbamoylamino group Chemical group C(N)(=O)N* 0.000 claims 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims 1
- 229910052758 niobium Inorganic materials 0.000 claims 1
- 239000010955 niobium Substances 0.000 claims 1
- OAICVXFJPJFONN-UHFFFAOYSA-N phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims 1
- 229910052715 tantalum Inorganic materials 0.000 claims 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
Description
以上の知見を基礎として完成した本発明は一側面において、粗面化処理されていない金属材料に窒素を含む官能基を有するカップリング剤の水溶液を用いた表面処理を行い、この処理面に液晶ポリマーを圧着又は射出成形で接合させる、金属−液晶ポリマー複合体の製造方法である。 The present invention completed on the basis of the above knowledge, in one aspect, performs a surface treatment using an aqueous solution of a coupling agent having a functional group containing nitrogen on a metal material that has not been roughened, and a liquid crystal is applied to the treated surface. This is a method for producing a metal-liquid crystal polymer composite in which a polymer is joined by pressure bonding or injection molding.
本発明に係る金属−液晶ポリマー複合体の製造方法は更に別の一実施形態において、前記カップリング剤の水溶液を用いた表面処理を行った金属材料が、前記金属材料表面のＳｉ、Ｔｉ、Ａｌの下方に、Ｃｕ、Ａｌ、Ｃｒ、Ａｇ、Ｎｉ、Ｉｎ、Ｓｎのいずれか１種以上の金属又はその酸化物の層を有する。 In another embodiment of the method for producing a metal-liquid crystal polymer composite according to the present invention, the metal material subjected to the surface treatment using the aqueous solution of the coupling agent is Si, Ti, Al on the surface of the metal material. The layer of one or more metals of Cu, Al, Cr, Ag, Ni, In, and Sn, or an oxide thereof is provided below.
本発明に係る金属−液晶ポリマー複合体の製造方法は更に別の一実施形態において、前記カップリング剤の水溶液を用いた表面処理を、カップリング剤が均一に溶解した溶液で行う。 In still another embodiment of the method for producing a metal-liquid crystal polymer composite according to the present invention, the surface treatment using the aqueous solution of the coupling agent is performed with a solution in which the coupling agent is uniformly dissolved.
本発明に係る金属−液晶ポリマー複合体の製造方法は更に別の一実施形態において、前記カップリング剤の水溶液を用いた表面処理を、カップリング剤が溶解したｐＨ７〜１４の溶液で行う。
In still another embodiment of the method for producing a metal-liquid crystal polymer composite according to the present invention, the surface treatment using the aqueous solution of the coupling agent is performed with a solution having a pH of 7 to 14 in which the coupling agent is dissolved.
Claims (12)
液晶ポリマーと接合させるための前記金属材料の表面が、前記リードフレームの白色めっき表面に窒素を分子内に有するカップリング剤処理で形成されており、
前記リードフレームをケース電極とし、前記ケース電極上にＬＥＤチップが実装され、前記チップが周辺を前記液晶ポリマーからなるケースボディで覆われ、前記ケースボディ内に蛍光体を含有する封止樹脂が充填されることで構成されたＬＥＤパッケージである請求項９に記載の電子部品。 The metal material is a lead frame plated with white,
The surface of the metal material for bonding with the liquid crystal polymer is formed by a coupling agent treatment having nitrogen in the molecule on the white plating surface of the lead frame,
The lead frame is a case electrode, an LED chip is mounted on the case electrode, the chip is covered with a case body made of the liquid crystal polymer, and the case body is filled with a sealing resin containing a phosphor The electronic component according to claim 9, wherein the electronic component is an LED package configured as described above.
前記陰極端子、前記陽極端子、及び、前記コンデンサ本体が液晶ポリマーで覆われて構成されたアルミ、タンタル及びニオブのいずれかのコンデンサである請求項９に記載の電子部品。 The metal material is a cathode terminal, an anode terminal, and a part or all of the capacitor body in which the outermost layer is covered with a metal paste,
10. The electronic component according to claim 9, wherein the cathode terminal, the anode terminal, and the capacitor body are any one of an aluminum, tantalum, and niobium capacitor configured by being covered with a liquid crystal polymer.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012164849A JP5869976B2 (en) | 2012-07-25 | 2012-07-25 | Method for producing metal-liquid crystal polymer composite |
| TW102124351A TWI552865B (en) | 2012-07-25 | 2013-07-08 | Metal-liquid crystal polymer composite manufacturing method and electronic parts |
| PCT/JP2013/068891 WO2014017300A1 (en) | 2012-07-25 | 2013-07-10 | Method for producing metal-liquid crystal polymer complex and electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012164849A JP5869976B2 (en) | 2012-07-25 | 2012-07-25 | Method for producing metal-liquid crystal polymer composite |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014027053A JP2014027053A (en) | 2014-02-06 |
| JP2014027053A5 true JP2014027053A5 (en) | 2015-02-19 |
| JP5869976B2 JP5869976B2 (en) | 2016-02-24 |
Family
ID=49997116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012164849A Active JP5869976B2 (en) | 2012-07-25 | 2012-07-25 | Method for producing metal-liquid crystal polymer composite |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5869976B2 (en) |
| TW (1) | TWI552865B (en) |
| WO (1) | WO2014017300A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016109611A2 (en) | 2014-12-30 | 2016-07-07 | Koninklijke Philips N.V. | Led package with integrated features for gas or liquid cooling |
| CN108431298B (en) | 2016-01-27 | 2019-06-21 | 株式会社新技术研究所 | Copper or copper alloy articles and manufacturing method comprising surface modified poly ester system resin |
| JP6454858B2 (en) * | 2016-06-15 | 2019-01-23 | 株式会社新技術研究所 | Copper alloy article containing polyester resin and method for producing the same |
| JP6511614B2 (en) | 2017-08-02 | 2019-05-15 | 株式会社新技術研究所 | Composite of metal and resin |
| CN113193348A (en) * | 2021-04-25 | 2021-07-30 | 江门市德众泰工程塑胶科技有限公司 | Preparation method of antenna containing LCP (liquid Crystal Polymer) base material |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0720635B2 (en) * | 1987-04-29 | 1995-03-08 | 豊田合成株式会社 | Insert reaction injection molding |
| JP3117699B2 (en) * | 1990-07-07 | 2000-12-18 | 日本ケミコン株式会社 | Exterior method of solid capacitor |
| JP2001237591A (en) * | 2000-02-25 | 2001-08-31 | Sony Corp | Electromagnetic wave shield material and manufacturing method thereof |
| TW200535259A (en) * | 2004-02-06 | 2005-11-01 | Furukawa Circuit Foil | Treated copper foil and circuit board |
| JP2006245303A (en) * | 2005-03-03 | 2006-09-14 | Nikko Kinzoku Kk | Surface treatment method of copper foil |
| JP2010199166A (en) * | 2009-02-24 | 2010-09-09 | Panasonic Corp | Lead frame for optical semiconductor apparatus, and method of manufacturing the same |
| JP2010287588A (en) * | 2009-06-09 | 2010-12-24 | Nec Tokin Corp | Solid electrolytic capacitor |
| JP2011088296A (en) * | 2009-10-20 | 2011-05-06 | Bridgestone Corp | Composite member |
-
2012
- 2012-07-25 JP JP2012164849A patent/JP5869976B2/en active Active
-
2013
- 2013-07-08 TW TW102124351A patent/TWI552865B/en active
- 2013-07-10 WO PCT/JP2013/068891 patent/WO2014017300A1/en active Application Filing
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