JP2016127011A5 - - Google Patents

Claims (16)

Including a thermosetting compound and a thermosetting agent as a thermosetting component, and a plurality of solder particles;
The thermosetting compound includes a thermosetting compound having a weight average molecular weight of 5000 or more and 50000 or less, and a crystalline thermosetting compound,
The solder particles are conductive films in which both the central portion and the conductive outer surface are solder particles.   The conductive film according to claim 1, wherein the crystalline thermosetting compound is solid at 25 ° C.   The conductive film according to claim 1, wherein the crystalline thermosetting compound has a melting point of 80 ° C. or higher and 150 ° C. or lower.   The conductive film according to any one of claims 1 to 3, wherein the crystalline thermosetting compound has a molecular weight of 300 or more and 500 or less.   The conductive film according to claim 1, wherein the crystalline thermosetting compound is a benzophenone type epoxy compound. The conductive film according to claim 1, wherein the solder particles have an average particle diameter of 0.5 μm or more and 40 μm or less.   The conductive film according to claim 1, wherein a content of the solder particles is 10% by weight or more and 90% by weight or less. A first connection target member having at least one first electrode on its surface;
A second connection target member having at least one second electrode on its surface;
A connecting portion connecting the first connection target member and the second connection target member;
The material of the connection part is the conductive film according to any one of claims 1 to 7,
A connection structure in which the first electrode and the second electrode are electrically connected by a solder portion in the connection portion.   The connection structure according to claim 8, wherein the second connection target member is a semiconductor chip, a resin film, a flexible printed board, a flexible flat cable, or a rigid flexible board.   When the first electrode and the second electrode face each other in the stacking direction of the first electrode, the connection portion, and the second electrode, the first electrode and the second electrode The connection structure according to claim 8 or 9, wherein a solder portion in the connection portion is arranged in 50% or more of an area of 100% of a portion facing the two electrodes.   When the portion where the first electrode and the second electrode face each other in the direction orthogonal to the stacking direction of the first electrode, the connection portion, and the second electrode is seen, The connection structure according to any one of claims 8 to 10, wherein 70% or more of a solder portion in the connection portion is disposed at a portion where the electrode and the second electrode face each other. The process of arrange | positioning the said conductive film on the surface of the 1st connection object member which has at least 1 1st electrode on the surface using the conductive film of any one of Claims 1-7,
On the surface opposite to the first connection target member side of the conductive film, a second connection target member having at least one second electrode on the surface, the first electrode and the second electrode And a step of arranging so as to face each other
By connecting the first connection target member and the second connection target member by heating the conductive film above the melting point of the solder particles and above the curing temperature of the thermosetting component, And a step of electrically connecting the first electrode and the second electrode with a solder portion in the connection portion, the method comprising: forming the conductive film; In the step of arranging the second connection target member and the step of forming the connection portion, pressure is not applied, and the conductive film is subjected to the weight of the second connection target member, or
In at least one of the step of arranging the second connection target member and the step of forming the connection portion, pressurizing and forming the second connection target member and the connection portion are formed. The manufacturing method of the connection structure according to claim 12, wherein the pressure of pressurization is less than 1 MPa in both of the steps to be performed.   The manufacturing method of the connection structure of Claim 12 or 13 whose said 2nd connection object member is a semiconductor chip, a resin film, a flexible printed circuit board, a flexible flat cable, or a rigid flexible substrate.   When the first electrode and the second electrode face each other in the stacking direction of the first electrode, the connection portion, and the second electrode, the first electrode and the second electrode The connection structure body according to any one of claims 12 to 14, wherein a solder portion in the connection portion is arranged in 50% or more of an area of 100% of a portion facing the two electrodes. Method for manufacturing the connection structure of the present invention.   When the portion where the first electrode and the second electrode face each other in the direction orthogonal to the stacking direction of the first electrode, the connection portion, and the second electrode is seen, 16. The connection structure according to claim 12, wherein a connection structure in which 70% or more of the solder portion in the connection portion is disposed in a portion where the electrode and the second electrode face each other is obtained. A manufacturing method of a connection structure.