JP2013543268A5 - - Google Patents
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- Publication number
- JP2013543268A5 JP2013543268A5 JP2013535076A JP2013535076A JP2013543268A5 JP 2013543268 A5 JP2013543268 A5 JP 2013543268A5 JP 2013535076 A JP2013535076 A JP 2013535076A JP 2013535076 A JP2013535076 A JP 2013535076A JP 2013543268 A5 JP2013543268 A5 JP 2013543268A5
- Authority
- JP
- Japan
- Prior art keywords
- detector
- opaque
- lid
- seal ring
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims 18
- 239000000758 substrate Substances 0.000 claims 18
- 238000000034 method Methods 0.000 claims 17
- 229910000679 solder Inorganic materials 0.000 claims 13
- 230000005855 radiation Effects 0.000 claims 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 6
- 239000007767 bonding agent Substances 0.000 claims 6
- 238000000151 deposition Methods 0.000 claims 6
- 229910052710 silicon Inorganic materials 0.000 claims 6
- 239000010703 silicon Substances 0.000 claims 6
- 229920002120 photoresistant polymer Polymers 0.000 claims 4
- 238000003491 array Methods 0.000 claims 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 3
- 239000010931 gold Substances 0.000 claims 3
- 229910052737 gold Inorganic materials 0.000 claims 3
- 229910052751 metal Inorganic materials 0.000 claims 3
- 239000002184 metal Substances 0.000 claims 3
- MAKDTFFYCIMFQP-UHFFFAOYSA-N titanium tungsten Chemical compound [Ti].[W] MAKDTFFYCIMFQP-UHFFFAOYSA-N 0.000 claims 3
- 238000004806 packaging method and process Methods 0.000 claims 2
- 238000007689 inspection Methods 0.000 claims 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US40562110P | 2010-10-21 | 2010-10-21 | |
| US61/405,621 | 2010-10-21 | ||
| US13/275,635 | 2011-10-18 | ||
| US13/275,635 US8809784B2 (en) | 2010-10-21 | 2011-10-18 | Incident radiation detector packaging |
| PCT/US2011/057021 WO2012054687A1 (en) | 2010-10-21 | 2011-10-20 | Incident radiation detector packaging |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013543268A JP2013543268A (ja) | 2013-11-28 |
| JP2013543268A5 true JP2013543268A5 (https=) | 2014-08-14 |
| JP5873094B2 JP5873094B2 (ja) | 2016-03-01 |
Family
ID=45971785
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013535076A Active JP5873094B2 (ja) | 2010-10-21 | 2011-10-20 | 入射放射線検出器パッケージング |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8809784B2 (https=) |
| EP (1) | EP2630660B1 (https=) |
| JP (1) | JP5873094B2 (https=) |
| IL (1) | IL225715A (https=) |
| TW (1) | TWI597859B (https=) |
| WO (1) | WO2012054687A1 (https=) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103728025A (zh) * | 2012-10-10 | 2014-04-16 | 中国科学院微电子研究所 | 一种非制冷红外成像焦平面阵列探测器 |
| US8736045B1 (en) | 2012-11-02 | 2014-05-27 | Raytheon Company | Integrated bondline spacers for wafer level packaged circuit devices |
| US9287188B2 (en) * | 2013-02-05 | 2016-03-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and apparatus for a seal ring structure |
| US9673169B2 (en) | 2013-02-05 | 2017-06-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and apparatus for a wafer seal ring |
| JP2014186006A (ja) * | 2013-03-25 | 2014-10-02 | Toshiba Corp | 赤外線撮像装置および赤外線撮像モジュール |
| NO2944700T3 (https=) | 2013-07-11 | 2018-03-17 | ||
| JP5997393B2 (ja) * | 2013-09-27 | 2016-09-28 | 京セラ株式会社 | 蓋体、パッケージおよび電子装置 |
| JP6344555B2 (ja) * | 2014-05-28 | 2018-06-20 | パナソニックＩｐマネジメント株式会社 | 固体撮像装置 |
| US9334154B2 (en) | 2014-08-11 | 2016-05-10 | Raytheon Company | Hermetically sealed package having stress reducing layer |
| JP6891203B2 (ja) * | 2014-08-11 | 2021-06-18 | レイセオン カンパニー | 応力低減レイヤを有する密封されたパッケージ |
| JP6891202B2 (ja) * | 2014-08-11 | 2021-06-18 | レイセオン カンパニー | 応力低減レイヤを有する密封されたパッケージ |
| KR101931010B1 (ko) * | 2014-08-11 | 2018-12-19 | 레이던 컴퍼니 | 응력 감소층을 갖는 기밀 밀봉된 패키지 |
| US9508681B2 (en) * | 2014-12-22 | 2016-11-29 | Google Inc. | Stacked semiconductor chip RGBZ sensor |
| US9756273B2 (en) * | 2015-03-04 | 2017-09-05 | Sensors Unlimited, Inc. | Multi-tiered tamper-resistant assembly system and method |
| CN104779214A (zh) * | 2015-04-16 | 2015-07-15 | 歌尔声学股份有限公司 | 集成传感器的封装结构 |
| US9771258B2 (en) | 2015-06-24 | 2017-09-26 | Raytheon Company | Wafer level MEMS package including dual seal ring |
| US20170081178A1 (en) * | 2015-09-22 | 2017-03-23 | Freescale Semiconductor, Inc. | Semiconductor device package with seal structure |
| US9570321B1 (en) | 2015-10-20 | 2017-02-14 | Raytheon Company | Use of an external getter to reduce package pressure |
| JP2018146263A (ja) * | 2017-03-01 | 2018-09-20 | 浜松ホトニクス株式会社 | 光検出器 |
| CN107681017B (zh) * | 2017-09-26 | 2019-04-09 | 中国科学院长春光学精密机械与物理研究所 | 一种自下而上生长AlGaN基紫外及深紫外探测器阵列的方法 |
| JP7292077B2 (ja) * | 2018-07-11 | 2023-06-16 | 三菱電機株式会社 | パッケージ素子の製造方法およびパッケージ素子 |
| US11515220B2 (en) * | 2019-12-04 | 2022-11-29 | Advanced Semiconductor Engineering, Inc. | Semiconductor package structures and methods of manufacturing the same |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5962854A (en) * | 1996-06-12 | 1999-10-05 | Ishizuka Electronics Corporation | Infrared sensor and infrared detector |
| US6521477B1 (en) * | 2000-02-02 | 2003-02-18 | Raytheon Company | Vacuum package fabrication of integrated circuit components |
| JP2003531475A (ja) * | 2000-02-02 | 2003-10-21 | レイセオン・カンパニー | 集積回路コンポーネントを備えたマイクロ電気機械システムデバイスの真空パッケージの製造 |
| US6876052B1 (en) * | 2000-05-12 | 2005-04-05 | National Semiconductor Corporation | Package-ready light-sensitive integrated circuit and method for its preparation |
| US20040232535A1 (en) * | 2003-05-22 | 2004-11-25 | Terry Tarn | Microelectromechanical device packages with integral heaters |
| JP2008523622A (ja) | 2004-12-07 | 2008-07-03 | サンダーバード・テクノロジーズ，インコーポレイテッド | Ｆｅｒｍｉ−ＦＥＴのひずみシリコンとゲート技術 |
| US7262412B2 (en) | 2004-12-10 | 2007-08-28 | L-3 Communications Corporation | Optically blocked reference pixels for focal plane arrays |
| US20060257785A1 (en) * | 2005-05-13 | 2006-11-16 | Johnson Donald W | Method of forming a photoresist element |
| JP4937623B2 (ja) * | 2006-03-29 | 2012-05-23 | シチズンホールディングス株式会社 | 半導体装置の製造方法 |
| US8115305B2 (en) * | 2007-05-17 | 2012-02-14 | Stats Chippac Ltd. | Integrated circuit package system with thin profile |
| JP4665959B2 (ja) * | 2007-11-30 | 2011-04-06 | 日本電気株式会社 | 真空パッケージ |
| US8173471B2 (en) * | 2008-04-29 | 2012-05-08 | Solid State System Co., Ltd. | Method for fabricating micro-electro-mechanical system (MEMS) device |
-
2011
- 2011-10-18 US US13/275,635 patent/US8809784B2/en active Active
- 2011-10-20 WO PCT/US2011/057021 patent/WO2012054687A1/en not_active Ceased
- 2011-10-20 EP EP11788252.2A patent/EP2630660B1/en active Active
- 2011-10-20 IL IL225715A patent/IL225715A/en active IP Right Grant
- 2011-10-20 TW TW100138076A patent/TWI597859B/zh active
- 2011-10-20 JP JP2013535076A patent/JP5873094B2/ja active Active
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