JP2013540354A5 - - Google Patents

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Publication number
JP2013540354A5
JP2013540354A5 JP2013531787A JP2013531787A JP2013540354A5 JP 2013540354 A5 JP2013540354 A5 JP 2013540354A5 JP 2013531787 A JP2013531787 A JP 2013531787A JP 2013531787 A JP2013531787 A JP 2013531787A JP 2013540354 A5 JP2013540354 A5 JP 2013540354A5
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JP
Japan
Prior art keywords
wafer
translator
test system
sealing member
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013531787A
Other languages
English (en)
Japanese (ja)
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JP2013540354A (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/US2011/053775 external-priority patent/WO2012054201A1/en
Publication of JP2013540354A publication Critical patent/JP2013540354A/ja
Publication of JP2013540354A5 publication Critical patent/JP2013540354A5/ja
Pending legal-status Critical Current

Links

JP2013531787A 2010-09-28 2011-09-28 ウエハテストシステムならびに関連する使用方法および製造方法 Pending JP2013540354A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US40423410P 2010-09-28 2010-09-28
US61/404,234 2010-09-28
PCT/US2011/053775 WO2012054201A1 (en) 2010-09-28 2011-09-28 Wafer testing systems and associated methods of use and manufacture

Publications (2)

Publication Number Publication Date
JP2013540354A JP2013540354A (ja) 2013-10-31
JP2013540354A5 true JP2013540354A5 (enExample) 2014-11-13

Family

ID=45870013

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013531787A Pending JP2013540354A (ja) 2010-09-28 2011-09-28 ウエハテストシステムならびに関連する使用方法および製造方法

Country Status (6)

Country Link
US (4) US8405414B2 (enExample)
JP (1) JP2013540354A (enExample)
KR (1) KR20130138793A (enExample)
CN (1) CN103229066A (enExample)
SG (1) SG189154A1 (enExample)
WO (1) WO2012054201A1 (enExample)

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