JP2013540169A - 樹脂−直鎖状オルガノシロキサンブロックコポリマーの調製方法 - Google Patents

樹脂−直鎖状オルガノシロキサンブロックコポリマーの調製方法 Download PDF

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JP2013540169A
JP2013540169A JP2013529429A JP2013529429A JP2013540169A JP 2013540169 A JP2013540169 A JP 2013540169A JP 2013529429 A JP2013529429 A JP 2013529429A JP 2013529429 A JP2013529429 A JP 2013529429A JP 2013540169 A JP2013540169 A JP 2013540169A
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resin
block copolymer
organosiloxane
linear
linear organosiloxane
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バーナード ホーストマン ジョン
スワイヤー スティーブン
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Dow Silicones Corp
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Dow Corning Corp
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    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/14Polysiloxanes containing silicon bound to oxygen-containing groups
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    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/10Block or graft copolymers containing polysiloxane sequences
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/22Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/26Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen nitrogen-containing groups
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    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
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    • C08G77/44Block-or graft-polymers containing polysiloxane sequences containing only polysiloxane sequences
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    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
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    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/485Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms containing less than 25 silicon atoms
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    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/54Nitrogen-containing linkages
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
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    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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    • H01ELECTRIC ELEMENTS
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    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293Organic, e.g. plastic
    • H01L23/296Organo-silicon compounds
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    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
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    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70Siloxanes defined by use of the MDTQ nomenclature
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80Siloxanes having aromatic substituents, e.g. phenyl side groups
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    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
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  • Polymers & Plastics (AREA)
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Manufacturing & Machinery (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
JP2013529429A 2010-09-22 2011-09-21 樹脂−直鎖状オルガノシロキサンブロックコポリマーの調製方法 Pending JP2013540169A (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US38544610P 2010-09-22 2010-09-22
US61/385,446 2010-09-22
US201161537146P 2011-09-21 2011-09-21
US201161537151P 2011-09-21 2011-09-21
US61/537,146 2011-09-21
US61/537,151 2011-09-21
PCT/US2011/052513 WO2012040302A1 (en) 2010-09-22 2011-09-21 Process for preparing resin-linear organosiloxane block copolymers

Publications (1)

Publication Number Publication Date
JP2013540169A true JP2013540169A (ja) 2013-10-31

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JP2013529430A Active JP5662580B2 (ja) 2010-09-22 2011-09-21 樹脂−直鎖状オルガノシロキサンブロックコポリマー
JP2013529429A Pending JP2013540169A (ja) 2010-09-22 2011-09-21 樹脂−直鎖状オルガノシロキサンブロックコポリマーの調製方法

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US (2) US8921493B2 (OSRAM)
EP (2) EP2619245B1 (OSRAM)
JP (2) JP5662580B2 (OSRAM)
KR (2) KR101506205B1 (OSRAM)
CN (2) CN103189420B (OSRAM)
WO (2) WO2012040302A1 (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015518062A (ja) * 2012-03-21 2015-06-25 ダウ コーニング コーポレーションDow Corning Corporation 樹脂−直鎖状オルガノシロキサンブロックコポリマーの組成物

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2619248B1 (en) 2010-09-22 2014-08-13 Dow Corning Corporation Thermally stable compositions containing resin-linear organosiloxane block copolymers
KR101807163B1 (ko) 2010-09-22 2017-12-08 다우 코닝 코포레이션 유기실록산 블록 공중합체
EP2619245B1 (en) 2010-09-22 2017-07-12 Dow Corning Corporation Process for preparing resin-linear organosiloxane block copolymers
EP2619249B1 (en) 2010-09-22 2014-05-14 Dow Corning Corporation High refractive index compositions containing resin-linear organosiloxane block copolymers
CN103339171B (zh) 2011-02-04 2016-05-04 道康宁公司 可固化有机硅氧烷嵌段共聚物乳剂
US9006356B2 (en) 2011-12-02 2015-04-14 Dow Corning Corporation Curable compositions of resin-linear organosiloxane block copolymers
CN104114656B (zh) 2011-12-14 2017-08-25 道康宁公司 树脂‑线性有机硅氧烷嵌段共聚物的固化性组合物
JP6001676B2 (ja) 2011-12-30 2016-10-05 ダウ コーニング コーポレーションDow Corning Corporation 固体ライト及び形成方法
KR102026598B1 (ko) 2012-01-16 2019-09-30 다우 실리콘즈 코포레이션 광학 물품 및 형성 방법
US20130200425A1 (en) * 2012-02-03 2013-08-08 Shin-Etsu Chemical Co., Ltd Phosphor-containing adhesive silicone composition sheet, and method of producing light-emitting device using same
US9705056B2 (en) 2012-02-09 2017-07-11 Dow Corning Corporation Gradient polymer structures and methods
US9212262B2 (en) 2012-02-29 2015-12-15 Dow Corning Corporation Compositions of resin-linear organosiloxane block copolymers
JP6218757B2 (ja) 2012-03-09 2017-10-25 ダウ コーニング コーポレーションDow Corning Corporation 樹脂−直鎖状オルガノシロキサンブロックコポリマーの組成物
JP2015513362A (ja) * 2012-03-12 2015-05-11 ダウ コーニング コーポレーションDow Corning Corporation 樹脂−直鎖状オルガノシロキサンブロックコポリマーの組成物
KR102063029B1 (ko) * 2012-03-20 2020-02-11 다우 실리콘즈 코포레이션 광 가이드 및 관련된 광 어셈블리
CN104321366B (zh) * 2012-03-21 2017-08-25 道康宁公司 树脂‑线性有机硅氧烷嵌段共聚物的组合物
EP2828319B1 (en) 2012-03-21 2018-09-12 Dow Silicones Corporation Compositions comprising resin-linear organosiloxane block copolymers and organopolysiloxanes
US9076934B2 (en) * 2012-03-21 2015-07-07 Dow Corning Corporation Process for preparing resin-linear organosiloxane block copolymers
JP6387355B2 (ja) 2012-12-21 2018-09-05 ダウ シリコーンズ コーポレーション 層状ポリマー構造及び方法
TW201431959A (zh) 2012-12-28 2014-08-16 Dow Corning 用於轉換器之可固化有機聚矽氧烷組合物及該可固化聚矽氧組合物於轉換器之應用
JP2016522978A (ja) * 2013-03-15 2016-08-04 ダウ コーニング コーポレーションDow Corning Corporation 粉末形態の固体シリコーン含有ホットメルト組成物の堆積及びそのカプセル化材の形成を含む光学アセンブリの製造方法
WO2014152522A1 (en) 2013-03-15 2014-09-25 Dow Corning Corporation Compositions of resin-linear organosiloxane block copolymers
WO2014197617A1 (en) 2013-06-05 2014-12-11 Dow Corning Corporation Compositions of resin-linear organosiloxane block copolymers
WO2015042285A1 (en) 2013-09-18 2015-03-26 Dow Corning Corporation Compositions of resin-linear organosiloxane block copolymers
CN107995918A (zh) * 2014-09-23 2018-05-04 道康宁公司 粘合剂组合物及其用途
TWI688609B (zh) * 2014-11-13 2020-03-21 美商道康寧公司 含硫聚有機矽氧烷組成物及相關態樣
WO2016136244A1 (ja) * 2015-02-26 2016-09-01 東レ・ダウコーニング株式会社 プライマー組成物、接着方法、および電気・電子部品
EP3328918B1 (en) 2015-07-27 2019-05-15 Dow Silicones Corporation Polyorganosiloxane compositions with metal based n-heterocyclic carbene condensation reaction catalysts and methods for the preparation thereof
TWI678551B (zh) 2015-07-28 2019-12-01 美商道康寧公司 智慧型光學材料、配方、方法、用途、物品、及裝置
JP7110105B2 (ja) 2016-02-10 2022-08-01 コーニンクレッカ フィリップス エヌ ヴェ Led用途におけるシロキサン樹脂の気相硬化触媒及び不動態化
CN108699389B (zh) * 2016-02-24 2020-10-27 日产化学株式会社 含有硅的图案反转用被覆剂
JP6574147B2 (ja) * 2016-07-08 2019-09-11 信越化学工業株式会社 硬化性有機ケイ素樹脂組成物
CN109476815B (zh) * 2016-07-28 2021-05-04 3M创新有限公司 分段有机硅聚酰胺嵌段共聚物和包含其的制品
US20190233594A1 (en) * 2016-10-04 2019-08-01 Dow Silicones Corporation Silicone resin-linear copolymer and related methods
EP3524633A4 (en) * 2016-10-04 2020-06-03 Dow Toray Co., Ltd. INNOVATIVE RESIN LINEAR ORGANOPOLYSILOXANE BLOCK COPOLYMERS, USE THEREOF AND METHOD FOR PRODUCING THE SAME
WO2018204068A1 (en) * 2017-05-05 2018-11-08 Dow Silicones Corporation Hydrosilylation curable silicone resin
KR102587545B1 (ko) * 2017-05-17 2023-10-11 주식회사 다이셀 접착제 조성물, 경화물, 적층체 및 장치
TWI859121B (zh) 2017-07-27 2024-10-21 美商杜邦電子材料國際有限責任公司 光電裝置及其製造方法、以及其用途
US11015082B2 (en) * 2017-12-19 2021-05-25 Honeywell International Inc. Crack-resistant polysiloxane dielectric planarizing compositions, methods and films
WO2019177689A1 (en) 2018-03-16 2019-09-19 Dow Silicones Corporation Curable polysiloxane composition
TWI794401B (zh) 2018-03-21 2023-03-01 美商陶氏有機矽公司 可室溫固化有機聚矽氧烷組成物及電氣/電子設備
US11674000B2 (en) 2018-08-24 2023-06-13 Wacker Chemie Ag Process for preparing branched organopolysiloxanes
EP4011992A1 (de) 2020-12-09 2022-06-15 Evonik Operations GmbH Härtbare kondensationsverbindungen auf basis von alkoxyfunktionellen polysiloxanen
CA3180684A1 (en) 2021-11-25 2023-05-25 Evonik Operations Gmbh Curable condensation compounds based on alkoxy-functional polysiloxanes
CN115716900B (zh) * 2022-03-21 2025-02-07 天津大学 一种基于硅醚键的高性能聚硅氧烷弹性体及其制备方法
WO2025170712A1 (en) 2024-02-07 2025-08-14 Dow Silicones Corporation Epoxy-functional resin-linear polyorganosiloxane copolymer, composition containing the copolymer, and methods for their preparation and use
WO2025178717A1 (en) 2024-02-20 2025-08-28 Dow Silicones Corporation Alkenyl ester – functional resin – linear polyorganosiloxane block copolymer, composition containing the copolymer, and methods for their preparation and use

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4944937B1 (OSRAM) * 1969-12-01 1974-11-30
JPS5036256B1 (OSRAM) * 1969-12-01 1975-11-22
JPS5483957A (en) * 1977-12-16 1979-07-04 Japan Synthetic Rubber Co Ltd Silicone resin composition

Family Cites Families (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3294737A (en) 1963-12-23 1966-12-27 Gen Electric Organopolysiloxanes
US3294718A (en) 1964-04-20 1966-12-27 Dow Corning Method for preparing block copolymers
US3328481A (en) * 1964-04-20 1967-06-27 Dow Corning Organosilicon resins
US3308203A (en) 1964-06-24 1967-03-07 Dow Corning Polysiloxane block copolymer rubber and process for making same
US3436439A (en) 1965-08-13 1969-04-01 Dow Corning Preparation of siloxane block copolymers
US3440262A (en) 1965-08-23 1969-04-22 Dow Corning Fluid aromatic siloxane block copolymers
US3619229A (en) * 1968-09-05 1971-11-09 Dow Corning Reinforced polystyrene and its copolymers
JPS4842720B1 (OSRAM) * 1969-02-21 1973-12-14
US3632793A (en) 1969-02-25 1972-01-04 Dow Corning Acetoxy functional copolymers composed of monomethylsiloxane units and diphenylsiloxane units
BE759623A (fr) * 1969-12-01 1971-06-01 Dow Corning Copolymeres sequences vulcanisables a la temperature ambiante comprenant des mailles acetoxy-siloxanes de blocage terminal
BE759621A (fr) * 1969-12-01 1971-06-01 Dow Corning Copolymeres sequences d'organosiloxanes non corrosifs, vulcanisables a la temperature ambiante
BE759618A (fr) * 1969-12-01 1971-06-01 Dow Corning Procede pour promouvoir la reaction entre un radical hydroxyle lie au silicium et un radical alcoxy lie au silicium
US3670649A (en) * 1970-08-13 1972-06-20 Dow Corning Combustible cartridges
JPS56827A (en) * 1979-06-15 1981-01-07 Japan Synthetic Rubber Co Ltd Production of block copolymer
DE3003116A1 (de) 1980-01-29 1981-08-06 Wacker-Chemie GmbH, 8000 München Verfahren zur herstellung von organosiloxanblockmischpolymerisat
US4340709A (en) 1980-07-16 1982-07-20 General Electric Company Addition curing silicone compositions
US4419402A (en) * 1982-02-16 1983-12-06 Dow Corning Corporation Flame retardant polyorganopolysiloxane resin compositions
US4443502A (en) * 1983-04-12 1984-04-17 Dow Corning Corporation Liquid organosiloxane resin compositions
US4508887A (en) 1983-08-01 1985-04-02 Dow Corning Corporation Method and novel catalyst compositions for preparing polyorganosiloxanes
US4585670A (en) 1985-01-03 1986-04-29 General Electric Company UV curable silicone block copolymers
US4766023A (en) 1987-01-16 1988-08-23 Minnesota Mining And Manufacturing Company Method for making a flexible louvered plastic film with protective coatings and film produced thereby
US5145933A (en) 1987-12-18 1992-09-08 Dow Corning France S.A. Organosiloxane gel-forming compositions and use thereof
US5075103A (en) 1990-07-06 1991-12-24 Dow Corning Corporation Hair fixatives comprising nonpolar silsesquioxanes
JPH05271400A (ja) * 1992-01-29 1993-10-19 Daicel Chem Ind Ltd 分岐状ポリカーボネート及びその製造法
JP3445831B2 (ja) 1994-06-28 2003-09-08 ジーイー東芝シリコーン株式会社 シリコーン樹脂組成物
DE69620575T2 (de) 1995-08-15 2002-10-31 Dow Corning Asia, Ltd. Härtbare polymethylsilsesquioxanzusammensetzung
US5830950A (en) 1996-12-31 1998-11-03 Dow Corning Corporation Method of making rubber-modified rigid silicone resins and composites produced therefrom
JP3635180B2 (ja) 1997-02-24 2005-04-06 ダウ コーニング アジア株式会社 シリル化ポリメチルシルセスキオキサン、その製造方法、それを用いた組成物
JP4408458B2 (ja) * 1997-06-30 2010-02-03 ダウ コ−ニング コ−ポレ−ション 硬化性シリコーンレジン及び硬化物の各製造方法
US6020409A (en) 1997-09-19 2000-02-01 Dow Corning Corporation Routes to dielectric gel for protection of electronic modules
US6803409B2 (en) 2002-05-29 2004-10-12 John Robert Keryk Organopolysiloxane copolymer and method of preparing
US6842577B2 (en) * 2002-12-02 2005-01-11 Shipley Company L.L.C. Photoimageable waveguide composition and waveguide formed therefrom
US7846550B2 (en) * 2003-12-23 2010-12-07 Momentive Performance Materials Gmbh Curable siloxane composition with modified surface properties
JP4742216B2 (ja) 2004-07-08 2011-08-10 Jnc株式会社 ケイ素化合物
JP2006206721A (ja) 2005-01-27 2006-08-10 Kansai Electric Power Co Inc:The 高耐熱合成高分子化合物及びこれで被覆した高耐電圧半導体装置
US7312008B2 (en) * 2005-02-10 2007-12-25 Xerox Corporation High-performance surface layer for photoreceptors
US20070299239A1 (en) * 2006-06-27 2007-12-27 Air Products And Chemicals, Inc. Curing Dielectric Films Under A Reducing Atmosphere
JP5586820B2 (ja) * 2006-07-21 2014-09-10 東京応化工業株式会社 高屈折率材料
GB0623232D0 (en) * 2006-11-22 2007-01-03 Dow Corning Cementitious materials
CN102017066B (zh) 2008-03-14 2012-11-21 陶氏康宁公司 形成光伏电池模块的方法
JP2010100667A (ja) * 2008-10-21 2010-05-06 Shin-Etsu Chemical Co Ltd 縮合硬化性オルガノポリシロキサン組成物
JP2012507869A (ja) 2008-10-31 2012-03-29 ダウ コーニング コーポレーション 光電池モジュールおよび形成方法
JP5610379B2 (ja) 2008-11-12 2014-10-22 Jnc株式会社 シロキサンポリマー、シロキサン系の架橋性組成物及びシリコーン膜
US8222352B2 (en) 2008-12-24 2012-07-17 Nitto Denko Corporation Silicone resin composition
JP2011190413A (ja) 2010-03-16 2011-09-29 Kumamoto Univ シロキサンポリマー架橋硬化物
EP2619248B1 (en) 2010-09-22 2014-08-13 Dow Corning Corporation Thermally stable compositions containing resin-linear organosiloxane block copolymers
KR101807163B1 (ko) 2010-09-22 2017-12-08 다우 코닝 코포레이션 유기실록산 블록 공중합체
EP2619249B1 (en) 2010-09-22 2014-05-14 Dow Corning Corporation High refractive index compositions containing resin-linear organosiloxane block copolymers
EP2619245B1 (en) 2010-09-22 2017-07-12 Dow Corning Corporation Process for preparing resin-linear organosiloxane block copolymers

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4944937B1 (OSRAM) * 1969-12-01 1974-11-30
JPS5036256B1 (OSRAM) * 1969-12-01 1975-11-22
JPS5483957A (en) * 1977-12-16 1979-07-04 Japan Synthetic Rubber Co Ltd Silicone resin composition

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015518062A (ja) * 2012-03-21 2015-06-25 ダウ コーニング コーポレーションDow Corning Corporation 樹脂−直鎖状オルガノシロキサンブロックコポリマーの組成物

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