JP2013538012A - 熱管理を伴う積層半導体チップデバイス - Google Patents

熱管理を伴う積層半導体チップデバイス Download PDF

Info

Publication number
JP2013538012A
JP2013538012A JP2013530242A JP2013530242A JP2013538012A JP 2013538012 A JP2013538012 A JP 2013538012A JP 2013530242 A JP2013530242 A JP 2013530242A JP 2013530242 A JP2013530242 A JP 2013530242A JP 2013538012 A JP2013538012 A JP 2013538012A
Authority
JP
Japan
Prior art keywords
semiconductor chip
circuit board
thermal management
management device
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013530242A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013538012A5 (enExample
Inventor
リファイ・アハメド ガマル
ブラック ブライアン
ゼット． スー マイケル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ATI Technologies ULC
Advanced Micro Devices Inc
Original Assignee
ATI Technologies ULC
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ATI Technologies ULC, Advanced Micro Devices Inc filed Critical ATI Technologies ULC
Publication of JP2013538012A publication Critical patent/JP2013538012A/ja
Publication of JP2013538012A5 publication Critical patent/JP2013538012A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
    • H01L25/0652—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00 the devices being arranged next and on each other, i.e. mixed assemblies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
    • H01L2224/1401—Structure
    • H01L2224/1403—Bump connectors having different sizes, e.g. different diameters, heights or widths
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
    • H01L2224/141—Disposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
    • H01L2224/141—Disposition
    • H01L2224/1418—Disposition being disposed on at least two different sides of the body, e.g. dual array
    • H01L2224/14181—On opposite sides of the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
    • H01L2224/1701—Structure
    • H01L2224/1703—Bump connectors having different sizes, e.g. different diameters, heights or widths
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
    • H01L2224/81192—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92222—Sequential connecting processes the first connecting process involving a bump connector
    • H01L2224/92225—Sequential connecting processes the first connecting process involving a bump connector the second connecting process involving a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes
    • H01L2225/04—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same main group of the same subclass of class H10
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06513—Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes
    • H01L2225/04—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same main group of the same subclass of class H10
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06517—Bump or bump-like direct electrical connections from device to substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes
    • H01L2225/04—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same main group of the same subclass of class H10
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/0652—Bump or bump-like direct electrical connections from substrate to substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes
    • H01L2225/04—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same main group of the same subclass of class H10
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06572—Auxiliary carrier between devices, the carrier having an electrical connection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes
    • H01L2225/04—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same main group of the same subclass of class H10
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06589—Thermal management, e.g. cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
    • H01L2924/15321—Connection portion the connection portion being formed on the die mounting surface of the substrate being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1056—Metal over component, i.e. metal plate over component mounted on or embedded in PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2013530242A 2010-09-24 2011-09-21 熱管理を伴う積層半導体チップデバイス Pending JP2013538012A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/889,590 2010-09-24
US12/889,590 US8472190B2 (en) 2010-09-24 2010-09-24 Stacked semiconductor chip device with thermal management
PCT/US2011/052466 WO2012040271A1 (en) 2010-09-24 2011-09-21 Stacked semiconductor chip device with thermal management

Publications (2)

Publication Number Publication Date
JP2013538012A true JP2013538012A (ja) 2013-10-07
JP2013538012A5 JP2013538012A5 (enExample) 2014-11-06

Family

ID=44741715

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013530242A Pending JP2013538012A (ja) 2010-09-24 2011-09-21 熱管理を伴う積層半導体チップデバイス

Country Status (6)

Country Link
US (1) US8472190B2 (enExample)
EP (1) EP2619795A1 (enExample)
JP (1) JP2013538012A (enExample)
KR (1) KR20130102052A (enExample)
CN (1) CN103098207A (enExample)
WO (1) WO2012040271A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017510076A (ja) * 2014-03-31 2017-04-06 マイクロン テクノロジー， インク． 改良された熱性能を有する積層半導体ダイアセンブリならびに関連するシステムおよび方法
US11191150B2 (en) 2019-08-09 2021-11-30 Samsung Electro-Mechanics Co., Ltd. Electronic component module and method for manufacturing the same
JP2024512861A (ja) * 2021-04-08 2024-03-21 インターナショナル・ビジネス・マシーンズ・コーポレーション 基板を越えるフィンを有するヒート・シンク

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5085534B2 (ja) 2005-04-27 2012-11-28 エイアー テスト システムズ 電子デバイスを試験するための装置
US7800382B2 (en) 2007-12-19 2010-09-21 AEHR Test Ststems System for testing an integrated circuit of a device and its method of use
US8030957B2 (en) 2009-03-25 2011-10-04 Aehr Test Systems System for testing an integrated circuit of a device and its method of use
CN202276549U (zh) * 2011-09-26 2012-06-13 番禺得意精密电子工业有限公司 电连接组件
JP5167516B1 (ja) * 2011-11-30 2013-03-21 株式会社フジクラ 部品内蔵基板及びその製造方法並びに部品内蔵基板実装体
US20130181359A1 (en) 2012-01-13 2013-07-18 TW Semiconductor Manufacturing Company, Ltd. Methods and Apparatus for Thinner Package on Package Structures
TWI508249B (zh) 2012-04-02 2015-11-11 矽品精密工業股份有限公司 封裝件、半導體封裝結構及其製法
US20130308274A1 (en) * 2012-05-21 2013-11-21 Triquint Semiconductor, Inc. Thermal spreader having graduated thermal expansion parameters
US9209106B2 (en) 2012-06-21 2015-12-08 Ati Technologies Ulc Thermal management circuit board for stacked semiconductor chip device
US9006908B2 (en) * 2012-08-01 2015-04-14 Marvell Israel (M.I.S.L) Ltd. Integrated circuit interposer and method of manufacturing the same
US9196575B1 (en) * 2013-02-04 2015-11-24 Altera Corporation Integrated circuit package with cavity in substrate
US9318464B2 (en) * 2013-05-21 2016-04-19 Advanced Micro Devices, Inc. Variable temperature solders for multi-chip module packaging and repackaging
US9653443B2 (en) * 2014-02-14 2017-05-16 Taiwan Semiconductor Manufacturing Company, Ltd. Thermal performance structure for semiconductor packages and method of forming same
US9391029B2 (en) * 2014-06-12 2016-07-12 Kabushiki Kaisha Toshiba Electronic device
US10192846B2 (en) 2014-11-05 2019-01-29 Infineon Technologies Austria Ag Method of inserting an electronic component into a slot in a circuit board
US10064287B2 (en) * 2014-11-05 2018-08-28 Infineon Technologies Austria Ag System and method of providing a semiconductor carrier and redistribution structure
US10553557B2 (en) 2014-11-05 2020-02-04 Infineon Technologies Austria Ag Electronic component, system and method
KR101640341B1 (ko) * 2015-02-04 2016-07-15 앰코 테크놀로지 코리아 주식회사 반도체 패키지
US9996120B1 (en) * 2015-05-22 2018-06-12 EMC IP Holding Company LLC PCB module for increased connectivity
US9779940B2 (en) * 2015-07-01 2017-10-03 Zhuahai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. Chip package
US9589920B2 (en) * 2015-07-01 2017-03-07 Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. Chip package
DE102015220676A1 (de) * 2015-10-22 2017-04-27 Zf Friedrichshafen Ag Leiterplatte und Anordnung mit einer Leiterplatte
US10854590B2 (en) * 2015-12-23 2020-12-01 Intel IP Corporation Semiconductor die package with more than one hanging die
KR102842851B1 (ko) 2016-01-08 2025-08-05 에어 테스트 시스템즈 일렉트로닉스 테스터 내의 디바이스들의 열 제어를 위한 방법 및 시스템
FR3050073B1 (fr) * 2016-04-12 2018-05-04 Mbda France Systeme electronique pourvu d'une pluralite de fonctions electroniques interconnectees
US10121766B2 (en) * 2016-06-30 2018-11-06 Micron Technology, Inc. Package-on-package semiconductor device assemblies including one or more windows and related methods and packages
KR102123252B1 (ko) * 2016-08-31 2020-06-16 가부시키가이샤 무라타 세이사쿠쇼 회로모듈 및 그 제조 방법
US10797039B2 (en) * 2016-12-07 2020-10-06 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming a 3D interposer system-in-package module
US10062634B2 (en) * 2016-12-21 2018-08-28 Micron Technology, Inc. Semiconductor die assembly having heat spreader that extends through underlying interposer and related technology
EP3553818A4 (en) * 2017-02-28 2019-12-25 Huawei Technologies Co., Ltd. PHOTOELECTRIC HYBRID HOUSING
EP4653878A2 (en) 2017-03-03 2025-11-26 AEHR Test Systems Electronics tester
US9899305B1 (en) * 2017-04-28 2018-02-20 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor package structure
US10269678B1 (en) * 2017-12-05 2019-04-23 Nxp Usa, Inc. Microelectronic components having integrated heat dissipation posts, systems including the same, and methods for the fabrication thereof
US11101145B2 (en) * 2018-08-14 2021-08-24 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor device with dummy micro bumps between stacking dies to improve flowability of underfill material
US11152333B2 (en) * 2018-10-19 2021-10-19 Micron Technology, Inc. Semiconductor device packages with enhanced heat management and related systems
US10973114B2 (en) * 2018-10-29 2021-04-06 L3 Technologies, Inc. Indium-based interface structures, apparatus, and methods for forming the same
US11553616B2 (en) * 2018-12-07 2023-01-10 Delta Electronics, Inc. Module with power device
CN116634659A (zh) * 2018-12-07 2023-08-22 台达电子工业股份有限公司 电源模块
US10943880B2 (en) 2019-05-16 2021-03-09 Advanced Micro Devices, Inc. Semiconductor chip with reduced pitch conductive pillars
CN114009153A (zh) * 2020-04-23 2022-02-01 鸿富锦精密工业(武汉)有限公司 堆叠式电路板
US20210391301A1 (en) * 2020-06-10 2021-12-16 Intel Corporation High speed memory system integration
KR102812686B1 (ko) * 2020-06-22 2025-05-27 엘지이노텍 주식회사 통신 모듈
US11769752B2 (en) 2020-07-24 2023-09-26 Micron Technology, Inc. Stacked semiconductor die assemblies with substrate heat sinks and associated systems and methods
JP7510817B2 (ja) * 2020-08-25 2024-07-04 新光電気工業株式会社 半導体装置及びその製造方法
CN120254561A (zh) 2020-10-07 2025-07-04 雅赫测试系统公司 电子测试器
US20220197806A1 (en) * 2020-12-23 2022-06-23 Intel Corporation High speed memory system integration
US11625079B2 (en) * 2020-12-23 2023-04-11 Quanta Computer Inc. Staggered arrangement graphite heat sink for liquid cooling cold plate
JP7447785B2 (ja) * 2020-12-25 2024-03-12 株式会社デンソー 電子装置
KR20230031713A (ko) 2021-08-27 2023-03-07 삼성전자주식회사 반도체 패키지
CN116053232A (zh) * 2022-12-20 2023-05-02 成都海光集成电路设计有限公司 一种电子封装、电子封装的制作方法及电子设备
US20240353634A1 (en) * 2023-04-20 2024-10-24 Ciena Corporation Managing relative thermal drift of carrier-mounted integrated circuits
US20250372585A1 (en) * 2023-06-09 2025-12-04 Advanced Micro Devices, Inc. Integrated system in package
US20250096051A1 (en) * 2023-09-20 2025-03-20 Qualcomm Incorporated Package comprising a substrate with cavity, and an integrated device located in the cavity of the substrate
DE102023131472A1 (de) * 2023-11-13 2025-05-15 Rolls-Royce Deutschland Ltd & Co Kg Leiterplattenanordnung

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07240496A (ja) * 1994-02-28 1995-09-12 Mitsubishi Electric Corp 半導体装置、その製造方法、半導体素子のテスト方法、そのテスト基板およびそのテスト基板の製造方法
US5567654A (en) * 1994-09-28 1996-10-22 International Business Machines Corporation Method and workpiece for connecting a thin layer to a monolithic electronic module's surface and associated module packaging
US6580611B1 (en) * 2001-12-21 2003-06-17 Intel Corporation Dual-sided heat removal system
JP2003243565A (ja) * 2002-02-07 2003-08-29 Motorola Inc パッケージ化半導体装置およびその製作方法
JP2006054274A (ja) * 2004-08-11 2006-02-23 Sony Corp 電子回路装置
JP2007123457A (ja) * 2005-10-27 2007-05-17 Nec Electronics Corp 半導体モジュール
US20070297155A1 (en) * 2006-06-27 2007-12-27 Lenovo (Singapore) Pte. Ltd. Integrated circuit chip thermal solution
US20080150125A1 (en) * 2006-12-20 2008-06-26 Henning Braunisch Thermal management of dies on a secondary side of a package

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5856911A (en) * 1996-11-12 1999-01-05 National Semiconductor Corporation Attachment assembly for integrated circuits
US6060777A (en) * 1998-07-21 2000-05-09 Intel Corporation Underside heat slug for ball grid array packages
US6853070B2 (en) * 2001-02-15 2005-02-08 Broadcom Corporation Die-down ball grid array package with die-attached heat spreader and method for making the same
TW502417B (en) 2001-06-26 2002-09-11 Siliconware Precision Industries Co Ltd Chip-embedded-type semiconductor package with high heat dissipation
TW502406B (en) * 2001-08-01 2002-09-11 Siliconware Precision Industries Co Ltd Ultra-thin package having stacked die
US6712621B2 (en) * 2002-01-23 2004-03-30 High Connection Density, Inc. Thermally enhanced interposer and method
US6861750B2 (en) * 2002-02-01 2005-03-01 Broadcom Corporation Ball grid array package with multiple interposers
US6906415B2 (en) 2002-06-27 2005-06-14 Micron Technology, Inc. Semiconductor device assemblies and packages including multiple semiconductor devices and methods
JP3967263B2 (ja) * 2002-12-26 2007-08-29 セイコーインスツル株式会社 半導体装置及び表示装置
TWI225299B (en) 2003-05-02 2004-12-11 Advanced Semiconductor Eng Stacked flip chip package
US7122906B2 (en) 2004-01-29 2006-10-17 Micron Technology, Inc. Die-wafer package and method of fabricating same
US20100181594A1 (en) * 2008-03-25 2010-07-22 Lin Charles W C Semiconductor chip assembly with post/base heat spreader and cavity over post

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07240496A (ja) * 1994-02-28 1995-09-12 Mitsubishi Electric Corp 半導体装置、その製造方法、半導体素子のテスト方法、そのテスト基板およびそのテスト基板の製造方法
US5567654A (en) * 1994-09-28 1996-10-22 International Business Machines Corporation Method and workpiece for connecting a thin layer to a monolithic electronic module's surface and associated module packaging
US6580611B1 (en) * 2001-12-21 2003-06-17 Intel Corporation Dual-sided heat removal system
JP2003243565A (ja) * 2002-02-07 2003-08-29 Motorola Inc パッケージ化半導体装置およびその製作方法
JP2006054274A (ja) * 2004-08-11 2006-02-23 Sony Corp 電子回路装置
JP2007123457A (ja) * 2005-10-27 2007-05-17 Nec Electronics Corp 半導体モジュール
US20070297155A1 (en) * 2006-06-27 2007-12-27 Lenovo (Singapore) Pte. Ltd. Integrated circuit chip thermal solution
US20080150125A1 (en) * 2006-12-20 2008-06-26 Henning Braunisch Thermal management of dies on a secondary side of a package

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017510076A (ja) * 2014-03-31 2017-04-06 マイクロン テクノロジー， インク． 改良された熱性能を有する積層半導体ダイアセンブリならびに関連するシステムおよび方法
US10461059B2 (en) 2014-03-31 2019-10-29 Micron Technology, Inc. Stacked semiconductor die assemblies with improved thermal performance and associated systems and methods
US11191150B2 (en) 2019-08-09 2021-11-30 Samsung Electro-Mechanics Co., Ltd. Electronic component module and method for manufacturing the same
JP2024512861A (ja) * 2021-04-08 2024-03-21 インターナショナル・ビジネス・マシーンズ・コーポレーション 基板を越えるフィンを有するヒート・シンク
JP7776240B2 (ja) 2021-04-08 2025-11-26 インターナショナル・ビジネス・マシーンズ・コーポレーション 基板を越えるフィンを有するヒート・シンク

Also Published As

Publication number Publication date
KR20130102052A (ko) 2013-09-16
WO2012040271A1 (en) 2012-03-29
CN103098207A (zh) 2013-05-08
US8472190B2 (en) 2013-06-25
EP2619795A1 (en) 2013-07-31
US20120075807A1 (en) 2012-03-29

Similar Documents

Publication Publication Date Title
JP2013538012A (ja) 熱管理を伴う積層半導体チップデバイス
US6864165B1 (en) Method of fabricating integrated electronic chip with an interconnect device
JP6679748B2 (ja) バックサイドドリリング埋込みダイ基板
TWI614865B (zh) 用以與上ｉｃ封裝體耦合以形成封裝體疊加（ｐｏｐ）總成的下ｉｃ封裝體結構，以及包含如是下ｉｃ封裝體結構的封裝體疊加（ｐｏｐ）總成
JP5639368B2 (ja) スタック式ダイ埋め込み型チップビルドアップのためのシステム及び方法
CN104851842B (zh) 包括嵌入式表面安装器件的半导体器件及其形成方法
US9437561B2 (en) Semiconductor chip with redundant thru-silicon-vias
CN102867800B (zh) 将功能芯片连接至封装件以形成层叠封装件
US10211160B2 (en) Microelectronic assembly with redistribution structure formed on carrier
US8704353B2 (en) Thermal management of stacked semiconductor chips with electrically non-functional interconnects
US11967587B2 (en) IC package with top-side memory module
TW201701432A (zh) 具有高佈線密度補片的半導體封裝
CN105097726A (zh) 封装结构及封装方法
KR20100102635A (ko) 언더 범프 라우팅 층 방법 및 장치
TW201533882A (zh) 覆晶堆疊封裝
US8546187B2 (en) Electronic part and method of manufacturing the same
CN114864508A (zh) 一种陶瓷外壳倒装芯片封装叠层结构及装配方法
JP2003069181A (ja) 電子機器装置及びその製造方法
US20240096838A1 (en) Component-embedded packaging structure
CN103098204B (zh) 具有冗余穿硅通孔的半导体芯片
CN119767684A (zh) 半导体封装及封装方法
CN119297154A (zh) 多芯片互连封装结构的制备方法及多芯片互连封装结构
CN118712160A (zh) 半导体结构及其制造方法
JP2000311965A (ja) 半導体装置及びその製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140919

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140919

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20140919

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20141014

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20141021

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150120

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20150217