JP2013530530A - 単結晶シートの製造のための方法およびデバイス - Google Patents
単結晶シートの製造のための方法およびデバイス Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 75
- 239000013078 crystal Substances 0.000 title claims abstract description 68
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 27
- 239000000956 alloy Substances 0.000 claims abstract description 75
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 73
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 66
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 66
- 239000010703 silicon Substances 0.000 claims abstract description 66
- 239000002243 precursor Substances 0.000 claims abstract description 36
- 230000006911 nucleation Effects 0.000 claims abstract description 29
- 238000010899 nucleation Methods 0.000 claims abstract description 29
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims description 40
- 239000000463 material Substances 0.000 claims description 39
- 239000004065 semiconductor Substances 0.000 claims description 31
- 239000007789 gas Substances 0.000 claims description 21
- 229910052732 germanium Inorganic materials 0.000 claims description 8
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 8
- 239000000460 chlorine Substances 0.000 claims description 7
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 6
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052794 bromium Inorganic materials 0.000 claims description 6
- 229910052799 carbon Inorganic materials 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 229910052733 gallium Inorganic materials 0.000 claims description 6
- 229910052738 indium Inorganic materials 0.000 claims description 6
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 6
- 229910052698 phosphorus Inorganic materials 0.000 claims description 6
- 239000011574 phosphorus Substances 0.000 claims description 6
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 5
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims description 5
- 229910052785 arsenic Inorganic materials 0.000 claims description 5
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 claims description 5
- 229910052801 chlorine Inorganic materials 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 5
- 239000011737 fluorine Substances 0.000 claims description 5
- 229910052731 fluorine Inorganic materials 0.000 claims description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 4
- 150000004678 hydrides Chemical class 0.000 claims description 4
- 150000002902 organometallic compounds Chemical class 0.000 claims description 4
- 230000001681 protective effect Effects 0.000 claims description 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 3
- 229910052796 boron Inorganic materials 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 2
- 239000006023 eutectic alloy Substances 0.000 claims description 2
- 229910044991 metal oxide Inorganic materials 0.000 claims description 2
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- 229910052757 nitrogen Inorganic materials 0.000 claims description 2
- 229910052717 sulfur Inorganic materials 0.000 claims description 2
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- 238000004804 winding Methods 0.000 claims 1
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- OFLYIWITHZJFLS-UHFFFAOYSA-N [Si].[Au] Chemical compound [Si].[Au] OFLYIWITHZJFLS-UHFFFAOYSA-N 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 229910021417 amorphous silicon Inorganic materials 0.000 description 3
- 229910021419 crystalline silicon Inorganic materials 0.000 description 3
- 230000005496 eutectics Effects 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
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- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 2
- 229910000673 Indium arsenide Inorganic materials 0.000 description 2
- 239000012459 cleaning agent Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical compound [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- FDNAPBUWERUEDA-UHFFFAOYSA-N silicon tetrachloride Chemical compound Cl[Si](Cl)(Cl)Cl FDNAPBUWERUEDA-UHFFFAOYSA-N 0.000 description 2
- 239000011343 solid material Substances 0.000 description 2
- 229910005540 GaP Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 1
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- 229910003902 SiCl 4 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000374 eutectic mixture Substances 0.000 description 1
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 description 1
- 239000008240 homogeneous mixture Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- C30B11/00—Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method
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Abstract
【解決手段】
単結晶シート(11)、特にシリコン・シート(11)を製造するための方法は、間にギャップ(3)を形成する少なくとも2つの開口要素(1、2)を提供するステップと、当該少なくとも2つの開口要素(1、2)間のギャップ(3)内に、シリコンを含む溶融合金(4)を提供するステップと、溶融合金(4)の近傍にシリコンを含む気体前駆媒体(5)を提供するステップと、溶融合金(4)の近傍にシリコン核形成結晶(6)を提供するステップと、当該シリコン核形成結晶(6)および溶融合金(4)を接触させるステップとを含む。
単結晶シート(11)、特にシリコン・シート(11)を製造するためのデバイス(10、20)は、互いに所定の距離(D)にあり、それによってギャップ(3)を形成し、開口要素(1、2)間の前記ギャップ(3)内の表面張力によってシリコンを含む溶融合金(4)を保持するために加熱されるように適合された、少なくとも2つの開口要素(1、2)と、溶融合金(4)の近傍にシリコンを含む気体前駆媒体(5)を供給するための手段(15)と、溶融合金(4)の近傍に核形成結晶(6)を保持および移動するための位置決め手段(16)とを備える。
【選択図】 図8
Description
間にギャップを形成する少なくとも2つの開口要素を提供するステップと、
当該少なくとも2つの開口要素間のギャップ内に、当該半導体材料を含む溶融合金を提供するステップと、
溶融合金の近傍に半導体材料を含む気体前駆媒体(gaseous precursor medium)を提供するステップと、
溶融合金の近傍に当該半導体材料の核形成結晶を提供するステップと、
当該核形成結晶および溶融合金を接触させるステップと、
を含む。
間にギャップを形成する少なくとも2つの開口要素を提供するステップと、
当該少なくとも2つの開口要素間のギャップ内に、シリコンを含む溶融合金を提供するステップと、
溶融合金の近傍にシリコンを含む気体前駆媒体を提供するステップと、
溶融合金の近傍にシリコン核形成結晶を提供するステップと、
当該シリコン核形成結晶および溶融合金を接触させるステップと、
を含む。
Claims (22)
- 半導体材料の単結晶シート(11)を製造するための方法であって、
間にギャップ(3)を形成する少なくとも2つの開口要素(1、2)を提供するステップと、
前記少なくとも2つの開口要素(1、2)間の前記ギャップ(3)内に、前記半導体材料を含む溶融合金(4)を提供するステップと、
前記溶融合金(4)の近傍に前記半導体材料を送達する気体前駆媒体(5)を提供するステップと、
前記溶融合金(4)の近傍に核形成結晶(6)を提供するステップと、
前記核形成結晶(6)および前記溶融合金(4)を接触させるステップと、
を含む、方法。 - 前記溶融合金(4)が前記開口要素(1、2)の間に表面張力によって保持されるように、前記開口要素(1、2)および前記溶融合金(4)を位置決めするステップを含む、請求項1に記載の方法。
- 前記核形成結晶(6)を前記溶融合金(4)から徐々に後退させるステップを含む、請求項1または2に記載の方法。
- 前記開口要素(1、2)を加熱するステップを含む、請求項1から3のいずれか一項に記載の方法。
- 前記半導体材料が、前記半導体材料を含む前記気体前駆媒体(5)から前記溶融合金(4)内へと放出され、それによって前記半導体材料で前記溶融合金(4)を過飽和にする、請求項1から4のいずれか一項に記載の方法。
- 前記方法が保護大気の下で実行される、請求項1から5のいずれか一項に記載の方法。
- 前記溶融合金(4)が共晶合金である、請求項1から6のいずれか一項に記載の方法。
- 前記気体前駆媒体(5)が、少なくともシリコン、ゲルマニウム、インジウム、ヒ素、リン、窒素、またはガリウムからの、塩化物、水素化物、有機金属化合物のグループのうちの、少なくとも1つを含む、請求項1から7のいずれか一項に記載の方法。
- 前記開口要素(1、2)が摂氏350度から1000度の間の温度を有する、請求項1から8のいずれか一項に記載の方法。
- シリコン、リン、ヒ素、炭素、硫黄、ホウ素、あるいは、シリコンまたは臭素を含む分子のグループのうちの少なくとも1つを含むドーピング・ガスを提供するステップを含む、請求項1から9のいずれか一項に記載の方法。
- 塩素、フッ素、臭素、あるいは、塩素、フッ素、または臭素を含む分子のグループのうちの少なくとも1つを含むエッチング・ガスを提供するステップを含む、請求項1から10のいずれか一項に記載の方法。
- 前記少なくとも2つの開口要素間の前記ギャップ(3)が細長いスリットである、請求項1から11のいずれか一項に記載の方法。
- 前記核形成結晶(6)と接触させる前に、<111>成長方向に沿って前記核形成結晶(6)を切断するステップを含む、請求項1から12のいずれか一項に記載の方法。
- 前記気体前駆媒体(5)が前記溶融合金(4)に対して前記開口要素(1、2)の第1の側(T)に提供され、前記核形成結晶(6)が前記溶融合金(4)に対して前記開口要素(1、2)の第2の側に提供される、請求項1から13のいずれか一項に記載の方法。
- さらなる処理のために、前記単結晶シリコン・シート(11)をロール(9)に巻き上げるステップを含む、請求項1から14のいずれか一項に記載の方法。
- 請求項1から15のいずれか一項に記載の方法によって製造される、単結晶シリコン・シート(11)。
- 請求項1から15のいずれか一項に記載の方法によって製造される単結晶シート(11)を備え、前記単結晶シート(11)はフィーチャpまたはnタイプの導電性に関してドーピングされる、太陽電池配置構成(12)。
- 単結晶半導体シート(11)を製造するためのデバイス(10、20)であって、
互いに所定の距離(D)にあり、それによってギャップ(3)を形成し、開口要素(1、2)間の前記ギャップ(3)内の表面張力によって半導体材料を含む溶融合金(4)を保持するために加熱されるように適合された、少なくとも2つの開口要素(1、2)と、
前記溶融合金(4)の近傍に前記半導体材料を含む気体前駆媒体(5)を送達するための手段(15)と、
前記溶融合金(4)の近傍に核形成結晶(6)を保持および移動するための位置決め手段(16)と、
を備える、デバイス(10、20)。 - 前記2つの開口要素(1、2)がv字形または溝付きのセクション(1A、2A)を有する、請求項18に記載のデバイス(10、20)。
- 前記2つの開口要素(1、2)が、金属酸化物または炭素被覆を含む被覆を有する、請求項18または19に記載のデバイス(10、20)。
- 前記所定の距離(D)が200マイクロメータ未満である、請求項18から20のいずれか一項に記載のデバイス(10、20)。
- 前記デバイス(10、20)が、請求項1から15のいずれか一項に記載の方法を実行するように適合された、請求項18から21のいずれか一項に記載のデバイス(10、20)。
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US10066312B2 (en) | 2018-09-04 |
US20130058827A1 (en) | 2013-03-07 |
CN102906315A (zh) | 2013-01-30 |
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