JP2013527973A5 - - Google Patents
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- Publication number
- JP2013527973A5 JP2013527973A5 JP2012554405A JP2012554405A JP2013527973A5 JP 2013527973 A5 JP2013527973 A5 JP 2013527973A5 JP 2012554405 A JP2012554405 A JP 2012554405A JP 2012554405 A JP2012554405 A JP 2012554405A JP 2013527973 A5 JP2013527973 A5 JP 2013527973A5
- Authority
- JP
- Japan
- Prior art keywords
- electro
- coating
- electrical
- optic
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011248 coating agent Substances 0.000 claims 21
- 238000000576 coating method Methods 0.000 claims 21
- 210000002381 Plasma Anatomy 0.000 claims 20
- 239000000758 substrate Substances 0.000 claims 15
- 239000005002 finish coating Substances 0.000 claims 11
- 229920000642 polymer Polymers 0.000 claims 10
- CTQNGGLPUBDAKN-UHFFFAOYSA-N o-xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims 8
- 239000008096 xylene Substances 0.000 claims 8
- 238000006116 polymerization reaction Methods 0.000 claims 7
- 238000000151 deposition Methods 0.000 claims 5
- 230000000379 polymerizing Effects 0.000 claims 5
- 229910000679 solder Inorganic materials 0.000 claims 5
- 239000011810 insulating material Substances 0.000 claims 4
- 238000000034 method Methods 0.000 claims 3
- 230000003287 optical Effects 0.000 claims 3
- 229920001688 coating polymer Polymers 0.000 claims 2
- 239000004925 Acrylic resin Substances 0.000 claims 1
- 229920000178 Acrylic resin Polymers 0.000 claims 1
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive Effects 0.000 claims 1
- 230000000712 assembly Effects 0.000 claims 1
- 125000002057 carboxymethyl group Chemical group [H]OC(=O)C([H])([H])[*] 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- 229920000052 poly(p-xylylene) Polymers 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 229920002050 silicone resin Polymers 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB1003067.4 | 2010-02-23 | ||
| GBGB1003067.4A GB201003067D0 (en) | 2010-02-23 | 2010-02-23 | Plasma-polymerized polymer coating |
| PCT/GB2011/000238 WO2011104500A1 (en) | 2010-02-23 | 2011-02-21 | Plasma-polymerized polymer coating |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013527973A JP2013527973A (ja) | 2013-07-04 |
| JP2013527973A5 true JP2013527973A5 (zh) | 2014-03-06 |
| JP6085480B2 JP6085480B2 (ja) | 2017-02-22 |
Family
ID=42114258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012554405A Active JP6085480B2 (ja) | 2010-02-23 | 2011-02-21 | プラズマ重合ポリマーコーティング |
Country Status (8)
| Country | Link |
|---|---|
| EP (1) | EP2539392A1 (zh) |
| JP (1) | JP6085480B2 (zh) |
| KR (1) | KR101778820B1 (zh) |
| CN (2) | CN106916331A (zh) |
| BR (1) | BR112012021172A2 (zh) |
| GB (1) | GB201003067D0 (zh) |
| TW (1) | TWI547221B (zh) |
| WO (1) | WO2011104500A1 (zh) |
Families Citing this family (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5693515B2 (ja) * | 2012-01-10 | 2015-04-01 | エイチズィーオー・インコーポレーテッド | 内部耐水性被覆を備える電子デバイス |
| EP2822705B1 (en) * | 2012-03-06 | 2016-09-07 | Semblant Limited | Coated electrical assembly |
| GB2510213A (en) * | 2012-08-13 | 2014-07-30 | Europlasma Nv | Forming a protective polymer coating on a component |
| US10086584B2 (en) | 2012-12-13 | 2018-10-02 | Corning Incorporated | Glass articles and methods for controlled bonding of glass sheets with carriers |
| TWI617437B (zh) | 2012-12-13 | 2018-03-11 | 康寧公司 | 促進控制薄片與載體間接合之處理 |
| US9340443B2 (en) | 2012-12-13 | 2016-05-17 | Corning Incorporated | Bulk annealing of glass sheets |
| US10014177B2 (en) | 2012-12-13 | 2018-07-03 | Corning Incorporated | Methods for processing electronic devices |
| GB201305500D0 (en) * | 2013-03-26 | 2013-05-08 | Semblant Ltd | Coated electrical assembly |
| US10510576B2 (en) | 2013-10-14 | 2019-12-17 | Corning Incorporated | Carrier-bonding methods and articles for semiconductor and interposer processing |
| CN103701963B (zh) * | 2013-12-30 | 2017-05-10 | 惠州Tcl移动通信有限公司 | 一种移动终端的防水处理方法及移动终端 |
| SG11201608442TA (en) | 2014-04-09 | 2016-11-29 | Corning Inc | Device modified substrate article and methods for making |
| CN104320920B (zh) * | 2014-10-13 | 2017-05-10 | 北京卫星制造厂 | 一种基于低内应力的电子产品涂覆方法 |
| WO2016187186A1 (en) | 2015-05-19 | 2016-11-24 | Corning Incorporated | Articles and methods for bonding sheets with carriers |
| GB2557043A (en) * | 2015-06-09 | 2018-06-13 | P2I Ltd | Coating |
| GB2539231B (en) * | 2015-06-10 | 2017-08-23 | Semblant Ltd | Coated electrical assembly |
| CN117534339A (zh) | 2015-06-26 | 2024-02-09 | 康宁股份有限公司 | 包含板材和载体的方法和制品 |
| GB201601221D0 (en) * | 2016-01-22 | 2016-03-09 | Semblant Ltd | Coated electrical assembly |
| JP6750252B2 (ja) * | 2016-02-29 | 2020-09-02 | 日亜化学工業株式会社 | 発光装置の製造方法 |
| TW202216444A (zh) | 2016-08-30 | 2022-05-01 | 美商康寧公司 | 用於片材接合的矽氧烷電漿聚合物 |
| TWI810161B (zh) | 2016-08-31 | 2023-08-01 | 美商康寧公司 | 具以可控制式黏結的薄片之製品及製作其之方法 |
| GB201621177D0 (en) | 2016-12-13 | 2017-01-25 | Semblant Ltd | Protective coating |
| US10770238B2 (en) | 2017-07-03 | 2020-09-08 | Avx Corporation | Solid electrolytic capacitor assembly with hydrophobic coatings |
| JP7181902B2 (ja) | 2017-07-03 | 2022-12-01 | キョーセラ・エイブイエックス・コンポーネンツ・コーポレーション | ナノ被覆を含む固体電解キャパシタ |
| US11389825B2 (en) | 2017-08-23 | 2022-07-19 | Jiangsu Favored Nanotechnology Co., LTD | Methods for preparing nano-protective coating with a modulation structure |
| CN107686986B (zh) * | 2017-08-23 | 2018-12-18 | 江苏菲沃泰纳米科技有限公司 | 一种调制结构的有机硅纳米防护涂层的制备方法 |
| CN107587120B (zh) * | 2017-08-23 | 2018-12-18 | 江苏菲沃泰纳米科技有限公司 | 一种具有调制结构的高绝缘纳米防护涂层的制备方法 |
| CN107587119B (zh) * | 2017-08-23 | 2018-11-13 | 江苏菲沃泰纳米科技有限公司 | 一种复合结构高绝缘硬质纳米防护涂层的制备方法 |
| CN109686672A (zh) * | 2017-10-18 | 2019-04-26 | 上海稷以科技有限公司 | 在物体表面形成保护层的方法及表面形成有保护层的产品 |
| JP7431160B2 (ja) | 2017-12-15 | 2024-02-14 | コーニング インコーポレイテッド | 基板を処理するための方法および結合されたシートを含む物品を製造するための方法 |
| CN109686802A (zh) * | 2018-11-09 | 2019-04-26 | 惠州凯珑光电有限公司 | 一种电子元器件和模组的封装工艺 |
| CN110665768B (zh) * | 2019-07-26 | 2022-04-26 | 江苏菲沃泰纳米科技股份有限公司 | 防水纳米膜及其制备方法、应用和产品 |
| KR102362271B1 (ko) * | 2019-10-16 | 2022-02-14 | 이정훈 | 회로 기판용 보호 코팅 조성물 |
| EP4163417A1 (en) * | 2020-06-09 | 2023-04-12 | Jiangsu Favored Nanotechnology Co., Ltd. | Protective coating and preparation method therefor |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63311793A (ja) * | 1987-06-12 | 1988-12-20 | Sumitomo Electric Ind Ltd | フレキシブル配線板の製造方法 |
| JPS6489389A (en) * | 1987-09-29 | 1989-04-03 | Sumitomo Electric Industries | Manufacture of flexible printed wiring board |
| JPH06244316A (ja) * | 1993-02-19 | 1994-09-02 | Sony Corp | 半導体装置、その製造方法及びその製造装置 |
| FR2726151B1 (fr) * | 1994-10-25 | 1996-11-29 | Europ Composants Electron | Procede et dispositif de protection hermetique de circuit electronique |
| DE10114897A1 (de) * | 2001-03-26 | 2002-10-24 | Infineon Technologies Ag | Elektronisches Bauteil |
| CN1770340A (zh) * | 2004-11-05 | 2006-05-10 | 力毅国际有限公司 | 电子元件本体的绝缘结构及其形成方法 |
| GB0703172D0 (en) | 2007-02-19 | 2007-03-28 | Pa Knowledge Ltd | Printed circuit boards |
| GB2462824A (en) * | 2008-08-18 | 2010-02-24 | Crombie 123 Ltd | Printed circuit board encapsulation |
| CA2733765C (en) * | 2008-08-18 | 2017-03-28 | Semblant Global Limited | Halo-hydrocarbon polymer coating |
-
2010
- 2010-02-23 GB GBGB1003067.4A patent/GB201003067D0/en not_active Ceased
-
2011
- 2011-02-21 JP JP2012554405A patent/JP6085480B2/ja active Active
- 2011-02-21 CN CN201610837103.2A patent/CN106916331A/zh active Pending
- 2011-02-21 WO PCT/GB2011/000238 patent/WO2011104500A1/en active Application Filing
- 2011-02-21 KR KR1020127024623A patent/KR101778820B1/ko active IP Right Grant
- 2011-02-21 CN CN2011800107855A patent/CN102791779A/zh active Pending
- 2011-02-21 BR BR112012021172A patent/BR112012021172A2/pt not_active Application Discontinuation
- 2011-02-21 EP EP11705228A patent/EP2539392A1/en not_active Withdrawn
- 2011-02-23 TW TW100106073A patent/TWI547221B/zh not_active IP Right Cessation
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