JP2013524464A5 - - Google Patents

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Publication number
JP2013524464A5
JP2013524464A5 JP2013503804A JP2013503804A JP2013524464A5 JP 2013524464 A5 JP2013524464 A5 JP 2013524464A5 JP 2013503804 A JP2013503804 A JP 2013503804A JP 2013503804 A JP2013503804 A JP 2013503804A JP 2013524464 A5 JP2013524464 A5 JP 2013524464A5
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JP
Japan
Prior art keywords
target material
shroud
flow
path
chamber
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JP2013503804A
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Japanese (ja)
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JP5828887B2 (ja
JP2013524464A (ja
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Priority claimed from US13/075,500 external-priority patent/US8263953B2/en
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JP2013503804A 2010-04-09 2011-04-01 レーザ生成プラズマｅｕｖ光源におけるターゲット材料送出保護のためのシステム及び方法 Active JP5828887B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US34217910P 2010-04-09 2010-04-09
US61/342,179 2010-04-09
US13/075,500 2011-03-30
US13/075,500 US8263953B2 (en) 2010-04-09 2011-03-30 Systems and methods for target material delivery protection in a laser produced plasma EUV light source
PCT/US2011/030981 WO2011126949A1 (en) 2010-04-09 2011-04-01 Systems and method for target material delivery protection in a laser produced plasma euv light source

Publications (3)

Publication Number Publication Date
JP2013524464A JP2013524464A (ja) 2013-06-17
JP2013524464A5 true JP2013524464A5 (enExample) 2014-05-22
JP5828887B2 JP5828887B2 (ja) 2015-12-09

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JP2013503804A Active JP5828887B2 (ja) 2010-04-09 2011-04-01 レーザ生成プラズマｅｕｖ光源におけるターゲット材料送出保護のためのシステム及び方法

Country Status (8)

Country Link
US (1) US8263953B2 (enExample)
EP (1) EP2556514A4 (enExample)
JP (1) JP5828887B2 (enExample)
KR (1) KR101726281B1 (enExample)
CN (1) CN102822903B (enExample)
SG (1) SG184080A1 (enExample)
TW (1) TWI507089B (enExample)
WO (1) WO2011126949A1 (enExample)

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US10349491B2 (en) 2015-01-19 2019-07-09 Tetra Tech, Inc. Light emission power control apparatus and method
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CN108031975B (zh) * 2017-10-24 2020-02-21 广东工业大学 一种连续多层液滴包裹的激光诱导植入制备方法
US11013097B2 (en) 2017-11-15 2021-05-18 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for generating extreme ultraviolet radiation
US10631392B2 (en) * 2018-04-30 2020-04-21 Taiwan Semiconductor Manufacturing Company, Ltd. EUV collector contamination prevention
US10625760B2 (en) 2018-06-01 2020-04-21 Tetra Tech, Inc. Apparatus and method for calculating wooden crosstie plate cut measurements and rail seat abrasion measurements based on rail head height
US11377130B2 (en) 2018-06-01 2022-07-05 Tetra Tech, Inc. Autonomous track assessment system
US10807623B2 (en) 2018-06-01 2020-10-20 Tetra Tech, Inc. Apparatus and method for gathering data from sensors oriented at an oblique angle relative to a railway track
US10730538B2 (en) 2018-06-01 2020-08-04 Tetra Tech, Inc. Apparatus and method for calculating plate cut and rail seat abrasion based on measurements only of rail head elevation and crosstie surface elevation
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KR102680272B1 (ko) * 2018-11-06 2024-07-01 삼성전자주식회사 Euv 집광 장치 및 상기 euv 집광 장치를 포함하는 리소그래피 장치
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