JP2013512333A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2013512333A5 JP2013512333A5 JP2012540374A JP2012540374A JP2013512333A5 JP 2013512333 A5 JP2013512333 A5 JP 2013512333A5 JP 2012540374 A JP2012540374 A JP 2012540374A JP 2012540374 A JP2012540374 A JP 2012540374A JP 2013512333 A5 JP2013512333 A5 JP 2013512333A5
- Authority
- JP
- Japan
- Prior art keywords
- acid
- composition
- alkyl
- hydrogen
- composition according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 claims 17
- 229910052739 hydrogen Inorganic materials 0.000 claims 7
- 239000001257 hydrogen Substances 0.000 claims 7
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims 5
- 150000002431 hydrogen Chemical class 0.000 claims 4
- 239000002184 metal Substances 0.000 claims 4
- 229910052751 metal Inorganic materials 0.000 claims 4
- 238000000034 method Methods 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims 3
- 125000003545 alkoxy group Chemical group 0.000 claims 3
- 238000000151 deposition Methods 0.000 claims 3
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims 2
- 230000010933 acylation Effects 0.000 claims 2
- 238000005917 acylation reaction Methods 0.000 claims 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims 2
- 229910021645 metal ion Inorganic materials 0.000 claims 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 claims 2
- 229920001281 polyalkylene Polymers 0.000 claims 2
- 229920000768 polyamine Polymers 0.000 claims 2
- 230000005588 protonation Effects 0.000 claims 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 claims 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 claims 2
- 239000000126 substance Substances 0.000 claims 2
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 claims 1
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 claims 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 claims 1
- HUDBNIFYBNWRJE-UHFFFAOYSA-N 3-n-(2-aminoethyl)propane-1,1,3-triamine Chemical compound NCCNCCC(N)N HUDBNIFYBNWRJE-UHFFFAOYSA-N 0.000 claims 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical group NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 claims 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 claims 1
- WHUUTDBJXJRKMK-UHFFFAOYSA-N Glutamic acid Natural products OC(=O)C(N)CCC(O)=O WHUUTDBJXJRKMK-UHFFFAOYSA-N 0.000 claims 1
- CKLJMWTZIZZHCS-REOHCLBHSA-N L-aspartic acid Chemical compound OC(=O)[C@@H](N)CC(O)=O CKLJMWTZIZZHCS-REOHCLBHSA-N 0.000 claims 1
- WHUUTDBJXJRKMK-VKHMYHEASA-N L-glutamic acid Chemical compound OC(=O)[C@@H](N)CCC(O)=O WHUUTDBJXJRKMK-VKHMYHEASA-N 0.000 claims 1
- 239000004698 Polyethylene Substances 0.000 claims 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 claims 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims 1
- 239000000654 additive Substances 0.000 claims 1
- 230000000996 additive effect Effects 0.000 claims 1
- 239000001361 adipic acid Substances 0.000 claims 1
- 235000011037 adipic acid Nutrition 0.000 claims 1
- 125000002947 alkylene group Chemical group 0.000 claims 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 claims 1
- 235000003704 aspartic acid Nutrition 0.000 claims 1
- OQFSQFPPLPISGP-UHFFFAOYSA-N beta-carboxyaspartic acid Natural products OC(=O)C(N)C(C(O)=O)C(O)=O OQFSQFPPLPISGP-UHFFFAOYSA-N 0.000 claims 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 claims 1
- 125000002837 carbocyclic group Chemical group 0.000 claims 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims 1
- 229920001577 copolymer Polymers 0.000 claims 1
- 229910001431 copper ion Inorganic materials 0.000 claims 1
- 230000008021 deposition Effects 0.000 claims 1
- 235000013922 glutamic acid Nutrition 0.000 claims 1
- 239000004220 glutamic acid Substances 0.000 claims 1
- 229910052736 halogen Inorganic materials 0.000 claims 1
- 150000002367 halogens Chemical class 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- 150000002466 imines Chemical class 0.000 claims 1
- NBZBKCUXIYYUSX-UHFFFAOYSA-N iminodiacetic acid Chemical compound OC(=O)CNCC(O)=O NBZBKCUXIYYUSX-UHFFFAOYSA-N 0.000 claims 1
- 239000003112 inhibitor Substances 0.000 claims 1
- GKQPCPXONLDCMU-CCEZHUSRSA-N lacidipine Chemical compound CCOC(=O)C1=C(C)NC(C)=C(C(=O)OCC)C1C1=CC=CC=C1\C=C\C(=O)OC(C)(C)C GKQPCPXONLDCMU-CCEZHUSRSA-N 0.000 claims 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims 1
- 239000011976 maleic acid Substances 0.000 claims 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 claims 1
- LSHROXHEILXKHM-UHFFFAOYSA-N n'-[2-[2-[2-(2-aminoethylamino)ethylamino]ethylamino]ethyl]ethane-1,2-diamine Chemical compound NCCNCCNCCNCCNCCN LSHROXHEILXKHM-UHFFFAOYSA-N 0.000 claims 1
- 235000006408 oxalic acid Nutrition 0.000 claims 1
- SCHTXWZFMCQMBH-UHFFFAOYSA-N pentane-1,3,5-triamine Chemical compound NCCC(N)CCN SCHTXWZFMCQMBH-UHFFFAOYSA-N 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- -1 polyethylene Polymers 0.000 claims 1
- 229920000573 polyethylene Polymers 0.000 claims 1
- 229920006395 saturated elastomer Polymers 0.000 claims 1
- 239000011975 tartaric acid Substances 0.000 claims 1
- 235000002906 tartaric acid Nutrition 0.000 claims 1
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 claims 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US26470509P | 2009-11-27 | 2009-11-27 | |
| US61/264,705 | 2009-11-27 | ||
| PCT/EP2010/067874 WO2011064154A2 (en) | 2009-11-27 | 2010-11-22 | Composition for metal electroplating comprising leveling agent |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016114981A Division JP6411405B2 (ja) | 2009-11-27 | 2016-06-09 | 平滑化剤を含む金属電気メッキのための組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013512333A JP2013512333A (ja) | 2013-04-11 |
| JP2013512333A5 true JP2013512333A5 (https=) | 2013-12-26 |
| JP5952738B2 JP5952738B2 (ja) | 2016-07-13 |
Family
ID=43986721
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012540374A Active JP5952738B2 (ja) | 2009-11-27 | 2010-11-22 | 平滑化剤を含む金属電気メッキのための組成物 |
| JP2016114981A Active JP6411405B2 (ja) | 2009-11-27 | 2016-06-09 | 平滑化剤を含む金属電気メッキのための組成物 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016114981A Active JP6411405B2 (ja) | 2009-11-27 | 2016-06-09 | 平滑化剤を含む金属電気メッキのための組成物 |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US9598540B2 (https=) |
| EP (2) | EP2504396B1 (https=) |
| JP (2) | JP5952738B2 (https=) |
| KR (1) | KR101072338B1 (https=) |
| CN (1) | CN102639639B (https=) |
| IL (1) | IL219556A (https=) |
| MY (1) | MY156200A (https=) |
| RU (1) | RU2585184C2 (https=) |
| TW (1) | TWI513862B (https=) |
| WO (1) | WO2011064154A2 (https=) |
Families Citing this family (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2504396B1 (en) * | 2009-11-27 | 2021-02-24 | Basf Se | Composition for copper electroplating comprising leveling agent |
| EP2655457B1 (en) | 2010-12-21 | 2019-04-10 | Basf Se | Composition for metal electroplating comprising leveling agent |
| CN103547631B (zh) | 2011-06-01 | 2016-07-06 | 巴斯夫欧洲公司 | 包含用于自下向上填充硅穿孔和互联件特征的添加剂的金属电镀用组合物 |
| US20130133243A1 (en) | 2011-06-28 | 2013-05-30 | Basf Se | Quaternized nitrogen compounds and use thereof as additives in fuels and lubricants |
| RU2015121797A (ru) * | 2012-11-09 | 2017-01-10 | Басф Се | Композиция для электролитического осаждения металла, содержащая выравнивающий агент |
| CN103397354B (zh) * | 2013-08-08 | 2016-10-26 | 上海新阳半导体材料股份有限公司 | 一种用于减少硅通孔技术镀铜退火后空洞的添加剂 |
| JP6211185B2 (ja) * | 2013-11-06 | 2017-10-11 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ | レベラーとしての窒素含有ポリマー |
| KR101665617B1 (ko) * | 2014-07-31 | 2016-10-14 | 주식회사 필머티리얼즈 | 저열팽창 철-니켈-코발트 3원계 합금의 전주도금 조성물 및 이를 이용하여 전주도금된 저열팽창 철-니켈-코발트 3원계 합금 |
| US9783905B2 (en) * | 2014-12-30 | 2017-10-10 | Rohm and Haas Electronic Mateirals LLC | Reaction products of amino acids and epoxies |
| KR101713686B1 (ko) * | 2015-06-11 | 2017-03-09 | 서울대학교 산학협력단 | 실리콘 관통 비아의 무결함 필링용 평탄제 및 필링방법 |
| US10100421B2 (en) | 2015-08-06 | 2018-10-16 | Dow Global Technologies Llc | Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole and bisepoxide compounds |
| US9932684B2 (en) | 2015-08-06 | 2018-04-03 | Rohm And Haas Electronic Materials Llc | Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of alpha amino acids and bisepoxides |
| TWI608132B (zh) | 2015-08-06 | 2017-12-11 | 羅門哈斯電子材料有限公司 | 自含有吡啶基烷基胺及雙環氧化物之反應產物的銅電鍍覆浴液電鍍覆光阻劑限定之特徵的方法 |
| US10006136B2 (en) | 2015-08-06 | 2018-06-26 | Dow Global Technologies Llc | Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole compounds, bisepoxides and halobenzyl compounds |
| CN105401181A (zh) * | 2015-12-23 | 2016-03-16 | 苏州市金星工艺镀饰有限公司 | 一种环保无氰镀金电镀液的电镀方法 |
| US10190228B2 (en) * | 2016-03-29 | 2019-01-29 | Rohm And Haas Electronic Materials Llc | Copper electroplating baths and electroplating methods capable of electroplating megasized photoresist defined features |
| WO2018073011A1 (en) | 2016-10-20 | 2018-04-26 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
| US11926918B2 (en) | 2016-12-20 | 2024-03-12 | Basf Se | Composition for metal plating comprising suppressing agent for void free filing |
| US11387108B2 (en) | 2017-09-04 | 2022-07-12 | Basf Se | Composition for metal electroplating comprising leveling agent |
| KR102483615B1 (ko) * | 2018-01-24 | 2023-01-03 | 삼성전기주식회사 | 비스-아릴 암모늄 화합물을 포함하는 도금용 평탄제 및 이를 이용한 구리 도금 방법 |
| EP3781729B1 (en) * | 2018-04-20 | 2024-09-25 | Basf Se | Composition for tin or tin alloy electroplating comprising suppressing agent |
| CN112218907B (zh) * | 2018-06-06 | 2024-02-13 | 巴斯夫欧洲公司 | 作为分散剂的烷氧基化聚酰胺基胺 |
| JP7208913B2 (ja) * | 2018-08-28 | 2023-01-19 | 株式会社Jcu | 硫酸銅めっき液およびこれを用いた硫酸銅めっき方法 |
| WO2020263837A1 (en) * | 2019-06-28 | 2020-12-30 | Lam Research Corporation | Electrodeposition of cobalt tungsten films |
| CN110284162B (zh) * | 2019-07-22 | 2020-06-30 | 广州三孚新材料科技股份有限公司 | 一种光伏汇流焊带无氰碱性镀铜液及其制备方法 |
| CN114450438A (zh) | 2019-09-27 | 2022-05-06 | 巴斯夫欧洲公司 | 用于铜凸块电沉积的包含流平剂的组合物 |
| EP4034696A1 (en) | 2019-09-27 | 2022-08-03 | Basf Se | Composition for copper bump electrodeposition comprising a leveling agent |
| JP2023520530A (ja) | 2020-04-03 | 2023-05-17 | ビーエーエスエフ ソシエタス・ヨーロピア | ポリアミノアミド型レベリング剤を含む銅バンプ電着用組成物 |
| EP3922662A1 (en) | 2020-06-10 | 2021-12-15 | Basf Se | Polyalkanolamine |
| EP4179132B1 (en) | 2020-07-13 | 2024-09-25 | Basf Se | Composition for copper electroplating on a cobalt seed |
| CN113430596A (zh) * | 2021-07-23 | 2021-09-24 | 赛莱克斯微系统科技（北京）有限公司 | 一种硅通孔铜电镀液及其电镀方法 |
| KR20240070557A (ko) | 2021-10-01 | 2024-05-21 | 바스프 에스이 | 폴리아미노아미드 타입 레벨링제를 포함하는 구리 전착용 조성물 |
| CN114031769B (zh) * | 2021-11-29 | 2024-03-26 | 广州市慧科高新材料科技有限公司 | 一种季铵盐类整平剂及其制备方法、含其的电镀液和电镀方法 |
| MX2024007407A (es) * | 2021-12-17 | 2024-07-04 | Basf Se | Composiciones y sus aplicaciones. |
| US20250388725A1 (en) | 2022-07-07 | 2025-12-25 | Basf Se | Use of a composition comprising a polyaminoamide type compound for copper nanotwin electrodeposition |
| WO2024132828A1 (en) | 2022-12-19 | 2024-06-27 | Basf Se | A composition for copper nanotwin electrodeposition |
| CN121693598A (zh) | 2023-08-03 | 2026-03-17 | 巴斯夫欧洲公司 | 用于在金属晶种上进行铜电镀的组合物 |
| WO2026037751A1 (en) | 2024-08-16 | 2026-02-19 | Basf Se | Composition for metal electroplating comprising an additive for defect-free filling of features on electronic substrates |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1218394A (en) | 1967-03-08 | 1971-01-06 | Toho Kagaku Kogyo Kabushiki Ka | Process for producing water-soluble thermosetting polymer |
| NL7004910A (https=) | 1969-05-03 | 1970-11-05 | ||
| DE2733973A1 (de) | 1977-07-28 | 1979-02-15 | Basf Ag | Wasserloesliche, vernetzte stickstoffhaltige kondensationsprodukte |
| DE3111713A1 (de) * | 1981-03-25 | 1982-10-07 | Basf Ag, 6700 Ludwigshafen | Wasserloesliche benzylierte polyamidoamine |
| US5917811A (en) | 1996-05-22 | 1999-06-29 | Qualcomm Incorporated | Method and apparatus for measurement directed hard handoff in a CDMA system |
| DE19625991A1 (de) | 1996-06-28 | 1998-01-02 | Philips Patentverwaltung | Bildschirm mit haftungsvermittelnder Silikatschicht |
| US6004681A (en) | 1996-08-02 | 1999-12-21 | The Ohio State University Research Foundation | Light-emitting devices containing network electrode polymers in electron blocking layer |
| DE19643091B4 (de) | 1996-10-18 | 2006-11-23 | Raschig Gmbh | Verwendung von wasserlöslichen Reaktionsprodukten aus Polyamidoaminen, Polyaminen und Epihalogenhydrin in galvanischen Bädern sowie Verfahren zu ihrer Herstellung und galvanische Bäder, die diese enthalten |
| US6024857A (en) | 1997-10-08 | 2000-02-15 | Novellus Systems, Inc. | Electroplating additive for filling sub-micron features |
| DE19758121C2 (de) * | 1997-12-17 | 2000-04-06 | Atotech Deutschland Gmbh | Wäßriges Bad und Verfahren zum elektrolytischen Abscheiden von Kupferschichten |
| FR2788973B1 (fr) | 1999-02-03 | 2002-04-05 | Oreal | Composition cosmetique comprenant un tensioactif anionique, un tensioactif amphotere, une huile de type polyolefine, un polymere cationique et un sel ou un alcool hydrosoluble, utilisation et procede |
| JP2001073182A (ja) | 1999-07-15 | 2001-03-21 | Boc Group Inc:The | 改良された酸性銅電気メッキ用溶液 |
| JP2001279228A (ja) * | 2000-03-31 | 2001-10-10 | Ajinomoto Co Inc | 新規なキレート剤 |
| FR2814363B1 (fr) | 2000-09-28 | 2004-05-07 | Oreal | Composition de lavage contenant des alkylamidoethersulfates, des tensiocatifs anioniques et des polymeres cationiques |
| US6610192B1 (en) | 2000-11-02 | 2003-08-26 | Shipley Company, L.L.C. | Copper electroplating |
| DE10160993A1 (de) | 2001-12-12 | 2003-06-18 | Basf Ag | Stickstoffhaltige Polymere umfassende Reinigungsmittelzusammensetzungen |
| US7316772B2 (en) | 2002-03-05 | 2008-01-08 | Enthone Inc. | Defect reduction in electrodeposited copper for semiconductor applications |
| US8002962B2 (en) * | 2002-03-05 | 2011-08-23 | Enthone Inc. | Copper electrodeposition in microelectronics |
| DE10243361A1 (de) | 2002-09-18 | 2004-04-01 | Basf Ag | Alkoxylatgemische und diese enthaltende Waschmittel |
| JP2004250777A (ja) | 2002-06-03 | 2004-09-09 | Shipley Co Llc | レベラー化合物 |
| TW200613586A (en) | 2004-07-22 | 2006-05-01 | Rohm & Haas Elect Mat | Leveler compounds |
| CA2612134C (en) * | 2005-06-30 | 2010-03-30 | Akzo Nobel N.V. | Chemical process |
| JP2007107074A (ja) * | 2005-10-17 | 2007-04-26 | Okuno Chem Ind Co Ltd | 酸性電気銅めっき液及び電気銅めっき方法 |
| EP1978051B1 (en) * | 2007-04-03 | 2012-02-22 | Rohm and Haas Electronic Materials, L.L.C. | Metal plating compositions and methods |
| JP5558675B2 (ja) * | 2007-04-03 | 2014-07-23 | ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． | 金属メッキ組成物 |
| EP2199315B1 (en) | 2008-12-19 | 2013-12-11 | Basf Se | Composition for metal electroplating comprising leveling agent |
| EP2504396B1 (en) * | 2009-11-27 | 2021-02-24 | Basf Se | Composition for copper electroplating comprising leveling agent |
-
2010
- 2010-11-22 EP EP10782262.9A patent/EP2504396B1/en active Active
- 2010-11-22 JP JP2012540374A patent/JP5952738B2/ja active Active
- 2010-11-22 EP EP21152561.3A patent/EP3848417B1/en active Active
- 2010-11-22 KR KR1020117007705A patent/KR101072338B1/ko active Active
- 2010-11-22 RU RU2012126604/05A patent/RU2585184C2/ru not_active IP Right Cessation
- 2010-11-22 MY MYPI2012002167A patent/MY156200A/en unknown
- 2010-11-22 CN CN201080053395.1A patent/CN102639639B/zh active Active
- 2010-11-22 WO PCT/EP2010/067874 patent/WO2011064154A2/en not_active Ceased
- 2010-11-22 US US13/510,328 patent/US9598540B2/en active Active
- 2010-11-26 TW TW099141069A patent/TWI513862B/zh active
-
2012
- 2012-05-03 IL IL219556A patent/IL219556A/en active IP Right Grant
-
2016
- 2016-06-09 JP JP2016114981A patent/JP6411405B2/ja active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2013512333A5 (https=) | ||
| RU2012126604A (ru) | Композиция для электрического осаждеия металла, содержащая выравнивающий агент | |
| RU2013158459A (ru) | Композиция для электроосаждения металла, содержащая добавку для заполнения снизу вверх переходных отверстий в кремнии и межсоединительных элементов | |
| JP2013527325A5 (https=) | ||
| TW201231736A (en) | Method of electroplating uniform copper layers | |
| JP2013500394A5 (https=) | ||
| KR102641595B1 (ko) | 평탄화 제제를 포함하는 금속 전기 도금용 조성물 | |
| RU2011144618A (ru) | Композиция для нанесения металлического покрытия, содержащая подавляющий агент, для беспустотного заполнения субмикронных элементов поверхности | |
| RU2011144619A (ru) | Композиция для нанесения металлического покрытия, содержащая подавляющий агент, для беспустотного заполнения субмикронных элементов поверхности | |
| JP2009541581A (ja) | 亜鉛合金被覆の電気的析出のための、シアン化物を含有しない水性アルカリ性の浴 | |
| JP2012522898A5 (https=) | ||
| Zhao et al. | Hierarchical metal-phenolic-polyplex assembly toward superwetting membrane for high-flux and antifouling oil-water separation | |
| TW201204776A (en) | Use of cyclic carbonates in epoxy resin compositions | |
| KR102474143B1 (ko) | 폴리이미드 수지 상의 금속 피막 형성 방법 | |
| JP2008192610A5 (https=) | ||
| JP2011505463A5 (https=) | ||
| WO2005073357A3 (de) | Polymer für die behandlung von oberflächen | |
| JP2020513047A5 (https=) | ||
| CN107709619A (zh) | 含有聚酰胺‑胺聚合物的薄防腐蚀涂层 | |
| CN104762625A (zh) | 一类聚合型咪唑啉缓蚀剂及其制备方法 | |
| JP2018502174A5 (https=) | ||
| JP5477219B2 (ja) | 金属の酸洗浄に用いる腐食抑制剤、洗浄液組成物及び金属の洗浄方法 | |
| JP2020535322A (ja) | 表面活性化ポリマー | |
| RU2016129964A (ru) | Способ уменьшения количества твердых отложений в способе байера | |
| JP2017154066A (ja) | ニッケル含有水溶液用浄化剤及びニッケル含有水溶液の浄化方法 |