IL219556A - A preparation containing a source of copper ions and at least one polyaminoamide additive and used for metallic coating by electricity - Google Patents
A preparation containing a source of copper ions and at least one polyaminoamide additive and used for metallic coating by electricityInfo
- Publication number
- IL219556A IL219556A IL219556A IL21955612A IL219556A IL 219556 A IL219556 A IL 219556A IL 219556 A IL219556 A IL 219556A IL 21955612 A IL21955612 A IL 21955612A IL 219556 A IL219556 A IL 219556A
- Authority
- IL
- Israel
- Prior art keywords
- polyaminoamide
- additive
- composition
- source
- copper ions
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/02—Polyamines
- C08G73/028—Polyamidoamines
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/02—Polyamines
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
- H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
- H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/01—Manufacture or treatment
- H10W20/031—Manufacture or treatment of conductive parts of the interconnections
- H10W20/056—Manufacture or treatment of conductive parts of the interconnections by filling conductive material into holes, grooves or trenches
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Electrochemistry (AREA)
- Engineering & Computer Science (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Polyamides (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electrodes Of Semiconductors (AREA)
- Electroplating Methods And Accessories (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US26470509P | 2009-11-27 | 2009-11-27 | |
| PCT/EP2010/067874 WO2011064154A2 (en) | 2009-11-27 | 2010-11-22 | Composition for metal electroplating comprising leveling agent |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IL219556A0 IL219556A0 (en) | 2012-06-28 |
| IL219556A true IL219556A (en) | 2016-12-29 |
Family
ID=43986721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL219556A IL219556A (en) | 2009-11-27 | 2012-05-03 | A preparation containing a source of copper ions and at least one polyaminoamide additive and used for metallic coating by electricity |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US9598540B2 (https=) |
| EP (2) | EP2504396B1 (https=) |
| JP (2) | JP5952738B2 (https=) |
| KR (1) | KR101072338B1 (https=) |
| CN (1) | CN102639639B (https=) |
| IL (1) | IL219556A (https=) |
| MY (1) | MY156200A (https=) |
| RU (1) | RU2585184C2 (https=) |
| TW (1) | TWI513862B (https=) |
| WO (1) | WO2011064154A2 (https=) |
Families Citing this family (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2504396B1 (en) * | 2009-11-27 | 2021-02-24 | Basf Se | Composition for copper electroplating comprising leveling agent |
| EP2655457B1 (en) | 2010-12-21 | 2019-04-10 | Basf Se | Composition for metal electroplating comprising leveling agent |
| CN103547631B (zh) | 2011-06-01 | 2016-07-06 | 巴斯夫欧洲公司 | 包含用于自下向上填充硅穿孔和互联件特征的添加剂的金属电镀用组合物 |
| US20130133243A1 (en) | 2011-06-28 | 2013-05-30 | Basf Se | Quaternized nitrogen compounds and use thereof as additives in fuels and lubricants |
| RU2015121797A (ru) * | 2012-11-09 | 2017-01-10 | Басф Се | Композиция для электролитического осаждения металла, содержащая выравнивающий агент |
| CN103397354B (zh) * | 2013-08-08 | 2016-10-26 | 上海新阳半导体材料股份有限公司 | 一种用于减少硅通孔技术镀铜退火后空洞的添加剂 |
| JP6211185B2 (ja) * | 2013-11-06 | 2017-10-11 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ | レベラーとしての窒素含有ポリマー |
| KR101665617B1 (ko) * | 2014-07-31 | 2016-10-14 | 주식회사 필머티리얼즈 | 저열팽창 철-니켈-코발트 3원계 합금의 전주도금 조성물 및 이를 이용하여 전주도금된 저열팽창 철-니켈-코발트 3원계 합금 |
| US9783905B2 (en) * | 2014-12-30 | 2017-10-10 | Rohm and Haas Electronic Mateirals LLC | Reaction products of amino acids and epoxies |
| KR101713686B1 (ko) * | 2015-06-11 | 2017-03-09 | 서울대학교 산학협력단 | 실리콘 관통 비아의 무결함 필링용 평탄제 및 필링방법 |
| US10100421B2 (en) | 2015-08-06 | 2018-10-16 | Dow Global Technologies Llc | Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole and bisepoxide compounds |
| US9932684B2 (en) | 2015-08-06 | 2018-04-03 | Rohm And Haas Electronic Materials Llc | Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of alpha amino acids and bisepoxides |
| TWI608132B (zh) | 2015-08-06 | 2017-12-11 | 羅門哈斯電子材料有限公司 | 自含有吡啶基烷基胺及雙環氧化物之反應產物的銅電鍍覆浴液電鍍覆光阻劑限定之特徵的方法 |
| US10006136B2 (en) | 2015-08-06 | 2018-06-26 | Dow Global Technologies Llc | Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole compounds, bisepoxides and halobenzyl compounds |
| CN105401181A (zh) * | 2015-12-23 | 2016-03-16 | 苏州市金星工艺镀饰有限公司 | 一种环保无氰镀金电镀液的电镀方法 |
| US10190228B2 (en) * | 2016-03-29 | 2019-01-29 | Rohm And Haas Electronic Materials Llc | Copper electroplating baths and electroplating methods capable of electroplating megasized photoresist defined features |
| WO2018073011A1 (en) | 2016-10-20 | 2018-04-26 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
| US11926918B2 (en) | 2016-12-20 | 2024-03-12 | Basf Se | Composition for metal plating comprising suppressing agent for void free filing |
| US11387108B2 (en) | 2017-09-04 | 2022-07-12 | Basf Se | Composition for metal electroplating comprising leveling agent |
| KR102483615B1 (ko) * | 2018-01-24 | 2023-01-03 | 삼성전기주식회사 | 비스-아릴 암모늄 화합물을 포함하는 도금용 평탄제 및 이를 이용한 구리 도금 방법 |
| EP3781729B1 (en) * | 2018-04-20 | 2024-09-25 | Basf Se | Composition for tin or tin alloy electroplating comprising suppressing agent |
| CN112218907B (zh) * | 2018-06-06 | 2024-02-13 | 巴斯夫欧洲公司 | 作为分散剂的烷氧基化聚酰胺基胺 |
| JP7208913B2 (ja) * | 2018-08-28 | 2023-01-19 | 株式会社Jcu | 硫酸銅めっき液およびこれを用いた硫酸銅めっき方法 |
| WO2020263837A1 (en) * | 2019-06-28 | 2020-12-30 | Lam Research Corporation | Electrodeposition of cobalt tungsten films |
| CN110284162B (zh) * | 2019-07-22 | 2020-06-30 | 广州三孚新材料科技股份有限公司 | 一种光伏汇流焊带无氰碱性镀铜液及其制备方法 |
| CN114450438A (zh) | 2019-09-27 | 2022-05-06 | 巴斯夫欧洲公司 | 用于铜凸块电沉积的包含流平剂的组合物 |
| EP4034696A1 (en) | 2019-09-27 | 2022-08-03 | Basf Se | Composition for copper bump electrodeposition comprising a leveling agent |
| JP2023520530A (ja) | 2020-04-03 | 2023-05-17 | ビーエーエスエフ ソシエタス・ヨーロピア | ポリアミノアミド型レベリング剤を含む銅バンプ電着用組成物 |
| EP3922662A1 (en) | 2020-06-10 | 2021-12-15 | Basf Se | Polyalkanolamine |
| EP4179132B1 (en) | 2020-07-13 | 2024-09-25 | Basf Se | Composition for copper electroplating on a cobalt seed |
| CN113430596A (zh) * | 2021-07-23 | 2021-09-24 | 赛莱克斯微系统科技（北京）有限公司 | 一种硅通孔铜电镀液及其电镀方法 |
| KR20240070557A (ko) | 2021-10-01 | 2024-05-21 | 바스프 에스이 | 폴리아미노아미드 타입 레벨링제를 포함하는 구리 전착용 조성물 |
| CN114031769B (zh) * | 2021-11-29 | 2024-03-26 | 广州市慧科高新材料科技有限公司 | 一种季铵盐类整平剂及其制备方法、含其的电镀液和电镀方法 |
| MX2024007407A (es) * | 2021-12-17 | 2024-07-04 | Basf Se | Composiciones y sus aplicaciones. |
| US20250388725A1 (en) | 2022-07-07 | 2025-12-25 | Basf Se | Use of a composition comprising a polyaminoamide type compound for copper nanotwin electrodeposition |
| WO2024132828A1 (en) | 2022-12-19 | 2024-06-27 | Basf Se | A composition for copper nanotwin electrodeposition |
| CN121693598A (zh) | 2023-08-03 | 2026-03-17 | 巴斯夫欧洲公司 | 用于在金属晶种上进行铜电镀的组合物 |
| WO2026037751A1 (en) | 2024-08-16 | 2026-02-19 | Basf Se | Composition for metal electroplating comprising an additive for defect-free filling of features on electronic substrates |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1218394A (en) | 1967-03-08 | 1971-01-06 | Toho Kagaku Kogyo Kabushiki Ka | Process for producing water-soluble thermosetting polymer |
| NL7004910A (https=) | 1969-05-03 | 1970-11-05 | ||
| DE2733973A1 (de) | 1977-07-28 | 1979-02-15 | Basf Ag | Wasserloesliche, vernetzte stickstoffhaltige kondensationsprodukte |
| DE3111713A1 (de) * | 1981-03-25 | 1982-10-07 | Basf Ag, 6700 Ludwigshafen | Wasserloesliche benzylierte polyamidoamine |
| US5917811A (en) | 1996-05-22 | 1999-06-29 | Qualcomm Incorporated | Method and apparatus for measurement directed hard handoff in a CDMA system |
| DE19625991A1 (de) | 1996-06-28 | 1998-01-02 | Philips Patentverwaltung | Bildschirm mit haftungsvermittelnder Silikatschicht |
| US6004681A (en) | 1996-08-02 | 1999-12-21 | The Ohio State University Research Foundation | Light-emitting devices containing network electrode polymers in electron blocking layer |
| DE19643091B4 (de) | 1996-10-18 | 2006-11-23 | Raschig Gmbh | Verwendung von wasserlöslichen Reaktionsprodukten aus Polyamidoaminen, Polyaminen und Epihalogenhydrin in galvanischen Bädern sowie Verfahren zu ihrer Herstellung und galvanische Bäder, die diese enthalten |
| US6024857A (en) | 1997-10-08 | 2000-02-15 | Novellus Systems, Inc. | Electroplating additive for filling sub-micron features |
| DE19758121C2 (de) * | 1997-12-17 | 2000-04-06 | Atotech Deutschland Gmbh | Wäßriges Bad und Verfahren zum elektrolytischen Abscheiden von Kupferschichten |
| FR2788973B1 (fr) | 1999-02-03 | 2002-04-05 | Oreal | Composition cosmetique comprenant un tensioactif anionique, un tensioactif amphotere, une huile de type polyolefine, un polymere cationique et un sel ou un alcool hydrosoluble, utilisation et procede |
| JP2001073182A (ja) | 1999-07-15 | 2001-03-21 | Boc Group Inc:The | 改良された酸性銅電気メッキ用溶液 |
| JP2001279228A (ja) * | 2000-03-31 | 2001-10-10 | Ajinomoto Co Inc | 新規なキレート剤 |
| FR2814363B1 (fr) | 2000-09-28 | 2004-05-07 | Oreal | Composition de lavage contenant des alkylamidoethersulfates, des tensiocatifs anioniques et des polymeres cationiques |
| US6610192B1 (en) | 2000-11-02 | 2003-08-26 | Shipley Company, L.L.C. | Copper electroplating |
| DE10160993A1 (de) | 2001-12-12 | 2003-06-18 | Basf Ag | Stickstoffhaltige Polymere umfassende Reinigungsmittelzusammensetzungen |
| US7316772B2 (en) | 2002-03-05 | 2008-01-08 | Enthone Inc. | Defect reduction in electrodeposited copper for semiconductor applications |
| US8002962B2 (en) * | 2002-03-05 | 2011-08-23 | Enthone Inc. | Copper electrodeposition in microelectronics |
| DE10243361A1 (de) | 2002-09-18 | 2004-04-01 | Basf Ag | Alkoxylatgemische und diese enthaltende Waschmittel |
| JP2004250777A (ja) | 2002-06-03 | 2004-09-09 | Shipley Co Llc | レベラー化合物 |
| TW200613586A (en) | 2004-07-22 | 2006-05-01 | Rohm & Haas Elect Mat | Leveler compounds |
| CA2612134C (en) * | 2005-06-30 | 2010-03-30 | Akzo Nobel N.V. | Chemical process |
| JP2007107074A (ja) * | 2005-10-17 | 2007-04-26 | Okuno Chem Ind Co Ltd | 酸性電気銅めっき液及び電気銅めっき方法 |
| EP1978051B1 (en) * | 2007-04-03 | 2012-02-22 | Rohm and Haas Electronic Materials, L.L.C. | Metal plating compositions and methods |
| JP5558675B2 (ja) * | 2007-04-03 | 2014-07-23 | ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． | 金属メッキ組成物 |
| EP2199315B1 (en) | 2008-12-19 | 2013-12-11 | Basf Se | Composition for metal electroplating comprising leveling agent |
| EP2504396B1 (en) * | 2009-11-27 | 2021-02-24 | Basf Se | Composition for copper electroplating comprising leveling agent |
-
2010
- 2010-11-22 EP EP10782262.9A patent/EP2504396B1/en active Active
- 2010-11-22 JP JP2012540374A patent/JP5952738B2/ja active Active
- 2010-11-22 EP EP21152561.3A patent/EP3848417B1/en active Active
- 2010-11-22 KR KR1020117007705A patent/KR101072338B1/ko active Active
- 2010-11-22 RU RU2012126604/05A patent/RU2585184C2/ru not_active IP Right Cessation
- 2010-11-22 MY MYPI2012002167A patent/MY156200A/en unknown
- 2010-11-22 CN CN201080053395.1A patent/CN102639639B/zh active Active
- 2010-11-22 WO PCT/EP2010/067874 patent/WO2011064154A2/en not_active Ceased
- 2010-11-22 US US13/510,328 patent/US9598540B2/en active Active
- 2010-11-26 TW TW099141069A patent/TWI513862B/zh active
-
2012
- 2012-05-03 IL IL219556A patent/IL219556A/en active IP Right Grant
-
2016
- 2016-06-09 JP JP2016114981A patent/JP6411405B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2017002299A (ja) | 2017-01-05 |
| JP2013512333A (ja) | 2013-04-11 |
| JP6411405B2 (ja) | 2018-10-24 |
| EP2504396A2 (en) | 2012-10-03 |
| EP2504396B1 (en) | 2021-02-24 |
| IL219556A0 (en) | 2012-06-28 |
| RU2585184C2 (ru) | 2016-05-27 |
| CN102639639B (zh) | 2015-06-03 |
| TWI513862B (zh) | 2015-12-21 |
| US20120292193A1 (en) | 2012-11-22 |
| EP3848417B1 (en) | 2025-01-08 |
| KR20110063810A (ko) | 2011-06-14 |
| MY156200A (en) | 2016-01-29 |
| JP5952738B2 (ja) | 2016-07-13 |
| WO2011064154A2 (en) | 2011-06-03 |
| WO2011064154A3 (en) | 2011-09-22 |
| TW201126025A (en) | 2011-08-01 |
| KR101072338B1 (ko) | 2011-10-11 |
| CN102639639A (zh) | 2012-08-15 |
| RU2012126604A (ru) | 2014-01-10 |
| US9598540B2 (en) | 2017-03-21 |
| EP3848417A1 (en) | 2021-07-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FF | Patent granted | ||
| KB | Patent renewed | ||
| KB | Patent renewed |