RU2585184C2 - Композиция для электрического осаждения металла, содержащая выравнивающий агент - Google Patents

Композиция для электрического осаждения металла, содержащая выравнивающий агент Download PDF

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Publication number
RU2585184C2
RU2585184C2 RU2012126604/05A RU2012126604A RU2585184C2 RU 2585184 C2 RU2585184 C2 RU 2585184C2 RU 2012126604/05 A RU2012126604/05 A RU 2012126604/05A RU 2012126604 A RU2012126604 A RU 2012126604A RU 2585184 C2 RU2585184 C2 RU 2585184C2
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RU
Russia
Prior art keywords
acid
metal
copper
independently selected
polyaminoamide
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RU2012126604/05A
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English (en)
Russian (ru)
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RU2012126604A (ru
Inventor
Корнелиа РЕГЕР-ГЕПФЕРТ
Роман Бенедикт РЭТЭР
Дитер Майер
Шарлотте ЭМНЕТ
Марко АРНОЛЬД
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Басф Се
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/02—Polyamines
    • C08G73/028—Polyamidoamines
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/02—Polyamines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/056—Manufacture or treatment of conductive parts of the interconnections by filling conductive material into holes, grooves or trenches
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Polyamides (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
RU2012126604/05A 2009-11-27 2010-11-22 Композиция для электрического осаждения металла, содержащая выравнивающий агент RU2585184C2 (ru)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US26470509P 2009-11-27 2009-11-27
US61/264,705 2009-11-27
PCT/EP2010/067874 WO2011064154A2 (en) 2009-11-27 2010-11-22 Composition for metal electroplating comprising leveling agent

Publications (2)

Publication Number Publication Date
RU2012126604A RU2012126604A (ru) 2014-01-10
RU2585184C2 true RU2585184C2 (ru) 2016-05-27

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RU2012126604/05A RU2585184C2 (ru) 2009-11-27 2010-11-22 Композиция для электрического осаждения металла, содержащая выравнивающий агент

Country Status (10)

Country Link
US (1) US9598540B2 (https=)
EP (2) EP2504396B1 (https=)
JP (2) JP5952738B2 (https=)
KR (1) KR101072338B1 (https=)
CN (1) CN102639639B (https=)
IL (1) IL219556A (https=)
MY (1) MY156200A (https=)
RU (1) RU2585184C2 (https=)
TW (1) TWI513862B (https=)
WO (1) WO2011064154A2 (https=)

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US10190228B2 (en) * 2016-03-29 2019-01-29 Rohm And Haas Electronic Materials Llc Copper electroplating baths and electroplating methods capable of electroplating megasized photoresist defined features
WO2018073011A1 (en) 2016-10-20 2018-04-26 Basf Se Composition for metal plating comprising suppressing agent for void free submicron feature filling
US11926918B2 (en) 2016-12-20 2024-03-12 Basf Se Composition for metal plating comprising suppressing agent for void free filing
US11387108B2 (en) 2017-09-04 2022-07-12 Basf Se Composition for metal electroplating comprising leveling agent
KR102483615B1 (ko) * 2018-01-24 2023-01-03 삼성전기주식회사 비스-아릴 암모늄 화합물을 포함하는 도금용 평탄제 및 이를 이용한 구리 도금 방법
EP3781729B1 (en) * 2018-04-20 2024-09-25 Basf Se Composition for tin or tin alloy electroplating comprising suppressing agent
CN112218907B (zh) * 2018-06-06 2024-02-13 巴斯夫欧洲公司 作为分散剂的烷氧基化聚酰胺基胺
JP7208913B2 (ja) * 2018-08-28 2023-01-19 株式会社Jcu 硫酸銅めっき液およびこれを用いた硫酸銅めっき方法
WO2020263837A1 (en) * 2019-06-28 2020-12-30 Lam Research Corporation Electrodeposition of cobalt tungsten films
CN110284162B (zh) * 2019-07-22 2020-06-30 广州三孚新材料科技股份有限公司 一种光伏汇流焊带无氰碱性镀铜液及其制备方法
CN114450438A (zh) 2019-09-27 2022-05-06 巴斯夫欧洲公司 用于铜凸块电沉积的包含流平剂的组合物
EP4034696A1 (en) 2019-09-27 2022-08-03 Basf Se Composition for copper bump electrodeposition comprising a leveling agent
JP2023520530A (ja) 2020-04-03 2023-05-17 ビーエーエスエフ ソシエタス・ヨーロピア ポリアミノアミド型レベリング剤を含む銅バンプ電着用組成物
EP3922662A1 (en) 2020-06-10 2021-12-15 Basf Se Polyalkanolamine
EP4179132B1 (en) 2020-07-13 2024-09-25 Basf Se Composition for copper electroplating on a cobalt seed
CN113430596A (zh) * 2021-07-23 2021-09-24 赛莱克斯微系统科技（北京）有限公司 一种硅通孔铜电镀液及其电镀方法
KR20240070557A (ko) 2021-10-01 2024-05-21 바스프 에스이 폴리아미노아미드 타입 레벨링제를 포함하는 구리 전착용 조성물
CN114031769B (zh) * 2021-11-29 2024-03-26 广州市慧科高新材料科技有限公司 一种季铵盐类整平剂及其制备方法、含其的电镀液和电镀方法
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Also Published As

Publication number Publication date
JP2017002299A (ja) 2017-01-05
JP2013512333A (ja) 2013-04-11
JP6411405B2 (ja) 2018-10-24
EP2504396A2 (en) 2012-10-03
EP2504396B1 (en) 2021-02-24
IL219556A0 (en) 2012-06-28
CN102639639B (zh) 2015-06-03
TWI513862B (zh) 2015-12-21
US20120292193A1 (en) 2012-11-22
EP3848417B1 (en) 2025-01-08
KR20110063810A (ko) 2011-06-14
MY156200A (en) 2016-01-29
JP5952738B2 (ja) 2016-07-13
WO2011064154A2 (en) 2011-06-03
IL219556A (en) 2016-12-29
WO2011064154A3 (en) 2011-09-22
TW201126025A (en) 2011-08-01
KR101072338B1 (ko) 2011-10-11
CN102639639A (zh) 2012-08-15
RU2012126604A (ru) 2014-01-10
US9598540B2 (en) 2017-03-21
EP3848417A1 (en) 2021-07-14

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Effective date: 20161123