JP2013511140A - 電子回路用の保護素子 - Google Patents
電子回路用の保護素子 Download PDFInfo
- Publication number
- JP2013511140A JP2013511140A JP2012538254A JP2012538254A JP2013511140A JP 2013511140 A JP2013511140 A JP 2013511140A JP 2012538254 A JP2012538254 A JP 2012538254A JP 2012538254 A JP2012538254 A JP 2012538254A JP 2013511140 A JP2013511140 A JP 2013511140A
- Authority
- JP
- Japan
- Prior art keywords
- diode
- trench
- layer
- doped
- schottky diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000004888 barrier function Effects 0.000 claims abstract description 15
- 230000001681 protective effect Effects 0.000 claims abstract description 12
- IYYIVELXUANFED-UHFFFAOYSA-N bromo(trimethyl)silane Chemical compound C[Si](C)(C)Br IYYIVELXUANFED-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000004065 semiconductor Substances 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 claims abstract description 9
- 238000004519 manufacturing process Methods 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims abstract description 4
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 238000007796 conventional method Methods 0.000 claims description 2
- 238000005468 ion implantation Methods 0.000 claims description 2
- 238000000151 deposition Methods 0.000 claims 1
- 238000010276 construction Methods 0.000 abstract 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 238000001465 metallisation Methods 0.000 description 4
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 4
- 229920005591 polysilicon Polymers 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910008484 TiSi Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
- H01L29/866—Zener diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
- H01L29/872—Schottky diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
- H01L29/872—Schottky diodes
- H01L29/8725—Schottky diodes of the trench MOS barrier type [TMBS]
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
- Semiconductor Integrated Circuits (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Abstract
Description
Claims (10)
- 少なくも1つのショットキーダイオード(S)と少なくとも1つのツェナーダイオード(Z)とを有し、電流供給部と電子回路との間に接続される保護素子であって、
前記ショットキーダイオード(S)のアノードが電流供給部と接続されており、前記ショットキーダイオード(S)のカソードが電子回路および前記ツェナーダイオードのカソードと接続されており、該ツェナーダイオードのアノードがアースと接続されている保護素子において、
ショットキーダイオード(S)は、トレンチ・MOS・バリア・ジャンクション・ダイオードまたはトレンチ・MOS・バリア・ショットキーダイオード(TMBSダイオード)またはトレンチ・ジャンクション・バリア・ショットキーダイオード(TJBSダイオード)である、ことを特徴とする保護素子。 - 少なくとも1つのトレンチ・MOS・バリア・ショットキーダイオードと、ツェナーダイオード(Z)のアノードとして用いられるpドープ基板とを有する集積半導体構成体を含む、ことを特徴とする請求項1記載の保護素子。
- 埋込層(22)を有する、ことを特徴とする請求項2記載の保護素子。
- トレンチ・ジャンクション・バリア・ショットキーダイオードと、ツェナーダイオード(Z)のアノードとして用いられるpドープ基板とを有する、ことを特徴とする請求項1記載の保護素子。
- すべてのドーピングが反対の導電型である、ことを特徴とする請求項1から4までのいずれか1項に記載の保護素子。
- トレンチ(3)が設けられており、該トレンチ(3)は長方形、U字形、またはその他の形状を有する、ことを特徴とする請求項2から5までのいずれか1項に記載の保護素子。
- 前記トレンチ(3)はストライプ状に、またはアイランドとして配置されており、該アイランドはとりわけ円形または六角形、またはその他に構成されている、ことを特徴とする請求項1から6までのいずれか1項に記載の保護素子。
- 金属層が設けられており、複数またはすべての金属層はロウ付け可能に構成されており、とりわけ集積保護素子が金属本体の上、または金属本体の間にロウ付けされている、ことを特徴とする請求項2から7までのいずれか1項に記載の保護素子。
- 埋込層(22)として用いられる高濃度で厚いnドープ基板ウェハの両側の上にnドープ・エピタキシャル層(2)または(23)を取り付け、
前記nドープ・エピタキシャル層(23)の上に別のpドープ・エピタキシャル層(1)を析出し、
これに続いてトレンチ(3)と別の層または構造体を取り付ける、ことを特徴とする、とりわけ請求項2から8までのいずれか1項に記載の保護素子の製造方法。 - 埋込層(22)として用いられる高濃度で厚いnドープ基板ウェハの両側の上にnドープ・エピタキシャル層(2)または(23)を取り付け、
前記nドープ層(23)にpドープ層(1)をイオン打ち込みによって、またはその他の通常の方法によって取り付け、
トレンチ(3)および別の層または構造体を取り付ける、ことを特徴とする、とりわけ請求項2から8までのいずれか1項に記載の保護素子の製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102009046606A DE102009046606A1 (de) | 2009-11-11 | 2009-11-11 | Schutzelement für elektronische Schaltungen |
DE102009046606.1 | 2009-11-11 | ||
PCT/EP2010/063849 WO2011057841A1 (de) | 2009-11-11 | 2010-09-21 | Schutzelement für elektronische schaltungen |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013511140A true JP2013511140A (ja) | 2013-03-28 |
JP5550737B2 JP5550737B2 (ja) | 2014-07-16 |
Family
ID=43216292
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012538254A Active JP5550737B2 (ja) | 2009-11-11 | 2010-09-21 | 電子回路用の保護素子 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8816466B2 (ja) |
EP (1) | EP2499669B1 (ja) |
JP (1) | JP5550737B2 (ja) |
CN (1) | CN102598264B (ja) |
DE (1) | DE102009046606A1 (ja) |
TW (1) | TWI525783B (ja) |
WO (1) | WO2011057841A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116932448A (zh) * | 2023-09-14 | 2023-10-24 | 厦门优迅高速芯片有限公司 | 一种i2c总线隔离电路 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102011089590A1 (de) | 2011-01-31 | 2012-08-02 | Continental Automotive Gmbh | Verfahren zur Funktionsüberwachung einer Sicherheitsüberwachung einer Steuereinheit |
CN105140119A (zh) * | 2015-09-16 | 2015-12-09 | 江苏中科君芯科技有限公司 | 混合pin肖特基二极管的制备方法 |
CN113066856A (zh) * | 2021-04-27 | 2021-07-02 | 厦门吉顺芯微电子有限公司 | 具有双层外延结构的Trench MOS肖特基整流器件及制造方法 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06205533A (ja) * | 1992-01-31 | 1994-07-22 | Sgs Thomson Microelectron Sa | 保護モノリシック半導体部品 |
JPH08107222A (ja) * | 1994-10-05 | 1996-04-23 | Rohm Co Ltd | ツェナーダイオード |
JPH08213619A (ja) * | 1994-10-19 | 1996-08-20 | Siliconix Inc | 過大な入力電圧に対する負荷の保護回路を含む装置及び過大な入力電圧に対する負荷の保護方法 |
JPH08223935A (ja) * | 1995-02-15 | 1996-08-30 | Matsushita Electric Works Ltd | 電源装置 |
JPH10174309A (ja) * | 1996-12-13 | 1998-06-26 | Asahi Glass Co Ltd | 非水電解液二次電池の充電装置 |
JPH11154748A (ja) * | 1997-08-27 | 1999-06-08 | Siliconix Inc | 双方向電圧クランピングを有するトレンチゲート形mosfet |
JP2003124324A (ja) * | 2001-10-11 | 2003-04-25 | Toshiba Corp | 逆電圧保護機能を有する半導体回路 |
JP2003124325A (ja) * | 2001-10-11 | 2003-04-25 | Toshiba Corp | 逆電圧保護機能を有する半導体回路 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5164615A (en) * | 1991-06-03 | 1992-11-17 | Microsemi Corp. | Method and apparatus for zero temperature coefficient reference voltage devices |
FR2689317B1 (fr) * | 1992-03-26 | 1994-06-17 | Sgs Thomson Microelectronics | Circuit integre constituant un reseau de diodes de protection. |
JP2837033B2 (ja) * | 1992-07-21 | 1998-12-14 | 三菱電機株式会社 | 半導体装置及びその製造方法 |
US5365102A (en) | 1993-07-06 | 1994-11-15 | North Carolina State University | Schottky barrier rectifier with MOS trench |
US5962893A (en) * | 1995-04-20 | 1999-10-05 | Kabushiki Kaisha Toshiba | Schottky tunneling device |
DE102004056663A1 (de) * | 2004-11-24 | 2006-06-01 | Robert Bosch Gmbh | Halbleitereinrichtung und Gleichrichteranordnung |
JP4944460B2 (ja) * | 2005-03-30 | 2012-05-30 | オンセミコンダクター・トレーディング・リミテッド | 半導体装置 |
DE202005017287U1 (de) * | 2005-11-01 | 2006-02-16 | Kinyanjui, Thama-ini, Dr. | Ein auf die Batterie-Pole aufsteckbarer Laderegler mit selbstregulierendem Rückstrom-, Überlade-, Tiefentlade- und Überspannungs-Schutz |
US20080211552A1 (en) * | 2007-03-01 | 2008-09-04 | Chao-Cheng Lu | Controllable synchronous rectifier |
DE102007045185A1 (de) * | 2007-09-21 | 2009-04-02 | Robert Bosch Gmbh | Halbleitervorrichtung und Verfahren zu deren Herstellung |
-
2009
- 2009-11-11 DE DE102009046606A patent/DE102009046606A1/de not_active Withdrawn
-
2010
- 2010-09-21 JP JP2012538254A patent/JP5550737B2/ja active Active
- 2010-09-21 US US13/505,534 patent/US8816466B2/en active Active
- 2010-09-21 EP EP10759852.6A patent/EP2499669B1/de active Active
- 2010-09-21 CN CN201080051064.4A patent/CN102598264B/zh active Active
- 2010-09-21 WO PCT/EP2010/063849 patent/WO2011057841A1/de active Application Filing
- 2010-11-09 TW TW099138471A patent/TWI525783B/zh active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06205533A (ja) * | 1992-01-31 | 1994-07-22 | Sgs Thomson Microelectron Sa | 保護モノリシック半導体部品 |
JPH08107222A (ja) * | 1994-10-05 | 1996-04-23 | Rohm Co Ltd | ツェナーダイオード |
JPH08213619A (ja) * | 1994-10-19 | 1996-08-20 | Siliconix Inc | 過大な入力電圧に対する負荷の保護回路を含む装置及び過大な入力電圧に対する負荷の保護方法 |
JPH08223935A (ja) * | 1995-02-15 | 1996-08-30 | Matsushita Electric Works Ltd | 電源装置 |
JPH10174309A (ja) * | 1996-12-13 | 1998-06-26 | Asahi Glass Co Ltd | 非水電解液二次電池の充電装置 |
JPH11154748A (ja) * | 1997-08-27 | 1999-06-08 | Siliconix Inc | 双方向電圧クランピングを有するトレンチゲート形mosfet |
JP2003124324A (ja) * | 2001-10-11 | 2003-04-25 | Toshiba Corp | 逆電圧保護機能を有する半導体回路 |
JP2003124325A (ja) * | 2001-10-11 | 2003-04-25 | Toshiba Corp | 逆電圧保護機能を有する半導体回路 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116932448A (zh) * | 2023-09-14 | 2023-10-24 | 厦门优迅高速芯片有限公司 | 一种i2c总线隔离电路 |
CN116932448B (zh) * | 2023-09-14 | 2024-01-23 | 厦门优迅高速芯片有限公司 | 一种i2c总线隔离电路 |
Also Published As
Publication number | Publication date |
---|---|
TWI525783B (zh) | 2016-03-11 |
US20120280353A1 (en) | 2012-11-08 |
EP2499669A1 (de) | 2012-09-19 |
TW201140789A (en) | 2011-11-16 |
JP5550737B2 (ja) | 2014-07-16 |
DE102009046606A1 (de) | 2011-05-12 |
CN102598264A (zh) | 2012-07-18 |
EP2499669B1 (de) | 2014-03-05 |
US8816466B2 (en) | 2014-08-26 |
CN102598264B (zh) | 2016-02-03 |
WO2011057841A1 (de) | 2011-05-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20060220138A1 (en) | ESD protection circuit with scalable current capacity and voltage capacity | |
TWI405323B (zh) | 使用溝槽隔離之無閉鎖垂直暫態電壓抑制二極體陣列結構及其製造方法 | |
US9257448B2 (en) | Integrated semiconductor device having an insulating structure and a manufacturing method | |
US9263515B2 (en) | Super-junction schottky PIN diode | |
US10050140B2 (en) | Rectifier diode | |
US9082628B2 (en) | Trench schottky diode | |
US20090020844A1 (en) | Semiconductor device having electrostatic discharge protection circuit and method of manufacturing the same | |
JP2010539719A (ja) | 半導体装置 | |
JP5550737B2 (ja) | 電子回路用の保護素子 | |
US9263597B2 (en) | Semiconductor arrangement having a Schottky diode | |
KR20240078639A (ko) | SiC 기반 보호 디바이스를 위한 구조 및 방법 | |
US7859010B2 (en) | Bi-directional semiconductor ESD protection device | |
CN108470732B (zh) | 半导体装置 | |
JP5389033B2 (ja) | 半導体装置および同半導体装置の製造方法 | |
CN107293533B (zh) | 瞬态电压抑制器及其制造方法 | |
US20120161298A1 (en) | Diode and electrostatic discharge protection circuit including the same | |
US6768176B1 (en) | Electrostatic discharge protection circuit | |
JP5529414B2 (ja) | 静電破壊保護回路 | |
CN103531585A (zh) | 二极管串 | |
JP5310100B2 (ja) | 静電気保護回路および半導体装置 | |
CN216389366U (zh) | 半导体组件和电子电路 | |
US8557640B2 (en) | Low voltage PNPN protection device | |
CN218568842U (zh) | 一种自保护nldmos结构 | |
CN215955287U (zh) | 一种半导体放电管及过电压保护装置 | |
JP2013207047A (ja) | 半導体装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130805 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20131029 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20131106 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140122 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20140421 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20140520 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5550737 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |