JP2013256610A5 - - Google Patents
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- Publication number
- JP2013256610A5 JP2013256610A5 JP2012134189A JP2012134189A JP2013256610A5 JP 2013256610 A5 JP2013256610 A5 JP 2013256610A5 JP 2012134189 A JP2012134189 A JP 2012134189A JP 2012134189 A JP2012134189 A JP 2012134189A JP 2013256610 A5 JP2013256610 A5 JP 2013256610A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- manufacturing
- adhesive layer
- adhesive
- temporary adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 claims description 30
- 239000004065 semiconductor Substances 0.000 claims description 30
- 239000000853 adhesive Substances 0.000 claims description 20
- 230000001070 adhesive effect Effects 0.000 claims description 19
- 239000012790 adhesive layer Substances 0.000 claims description 18
- 150000001875 compounds Chemical class 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 10
- 239000002253 acid Substances 0.000 claims description 8
- 239000002904 solvent Substances 0.000 claims description 8
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical group CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 6
- 239000007864 aqueous solution Substances 0.000 claims description 6
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 claims description 6
- 150000003254 radicals Chemical class 0.000 claims description 6
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims description 4
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 4
- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 claims description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims description 4
- 239000003085 diluting agent Substances 0.000 claims description 4
- 229920000642 polymer Polymers 0.000 claims description 4
- 230000005855 radiation Effects 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- 230000000694 effects Effects 0.000 claims description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 2
- 125000002843 carboxylic acid group Chemical group 0.000 claims description 2
- 229910052731 fluorine Inorganic materials 0.000 claims description 2
- 239000011737 fluorine Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 230000001678 irradiating effect Effects 0.000 claims description 2
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 claims description 2
- 229920003986 novolac Polymers 0.000 claims description 2
- 150000001451 organic peroxides Chemical class 0.000 claims description 2
- 229920000058 polyacrylate Polymers 0.000 claims description 2
- 229920005749 polyurethane resin Polymers 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 239000004094 surface-active agent Substances 0.000 claims description 2
- 206010037660 Pyrexia Diseases 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 230000035515 penetration Effects 0.000 claims 1
- 150000007513 acids Chemical class 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012134189A JP6031264B2 (ja) | 2012-06-13 | 2012-06-13 | 半導体装置製造用仮接着剤、並びに、それを用いた接着性支持体、及び、半導体装置の製造方法 |
| KR1020147034543A KR20150006480A (ko) | 2012-06-13 | 2013-05-30 | 반도체 장치 제조용 가접착제, 그것을 사용한 접착성 지지체, 및 반도체 장치의 제조 방법 |
| PCT/JP2013/065102 WO2013187244A1 (ja) | 2012-06-13 | 2013-05-30 | 半導体装置製造用仮接着剤、並びに、それを用いた接着性支持体、及び、半導体装置の製造方法 |
| TW102120935A TW201406894A (zh) | 2012-06-13 | 2013-06-13 | 半導體裝置製造用暫時接著劑以及使用其的接著性支持體及半導體裝置的製造方法 |
| US14/567,471 US20150093879A1 (en) | 2012-06-13 | 2014-12-11 | Temporary adhesive for production of semiconductor device, and adhesive support and production method of semiconductor device using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012134189A JP6031264B2 (ja) | 2012-06-13 | 2012-06-13 | 半導体装置製造用仮接着剤、並びに、それを用いた接着性支持体、及び、半導体装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013256610A JP2013256610A (ja) | 2013-12-26 |
| JP2013256610A5 true JP2013256610A5 (enExample) | 2014-12-11 |
| JP6031264B2 JP6031264B2 (ja) | 2016-11-24 |
Family
ID=49758073
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012134189A Expired - Fee Related JP6031264B2 (ja) | 2012-06-13 | 2012-06-13 | 半導体装置製造用仮接着剤、並びに、それを用いた接着性支持体、及び、半導体装置の製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20150093879A1 (enExample) |
| JP (1) | JP6031264B2 (enExample) |
| KR (1) | KR20150006480A (enExample) |
| TW (1) | TW201406894A (enExample) |
| WO (1) | WO2013187244A1 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102012223387A1 (de) * | 2012-12-17 | 2014-06-18 | Evonik Industries Ag | Verwendung von substituierten Benzylalkoholen in reaktiven Epoxy-Systemen |
| JP6546378B2 (ja) * | 2013-11-19 | 2019-07-17 | 日東電工株式会社 | 樹脂シート |
| JP6156443B2 (ja) * | 2014-08-13 | 2017-07-05 | Jsr株式会社 | 積層体および基材の処理方法 |
| CN104804682B (zh) * | 2015-04-16 | 2017-05-24 | 深圳市化讯半导体材料有限公司 | 晶圆减薄的临时键合胶、其制备方法、键合及解键合方法 |
| JP6523052B2 (ja) * | 2015-06-03 | 2019-05-29 | 株式会社ニッペコ | 非引火性溶剤型粘着剤及びその使用方法 |
| JP7221046B2 (ja) * | 2018-12-26 | 2023-02-13 | 東京応化工業株式会社 | 接着剤組成物、積層体、積層体の製造方法、及び電子部品の製造方法 |
| EP4011996A1 (en) * | 2020-12-11 | 2022-06-15 | Henkel AG & Co. KGaA | Method for detaching adhesively bonded substrates |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5747573A (en) * | 1994-02-07 | 1998-05-05 | H. B. Fuller Licensing & Financing, Inc. | High heat resistant hot melt adhesive |
| US5985043A (en) * | 1997-07-21 | 1999-11-16 | Miguel Albert Capote | Polymerizable fluxing agents and fluxing adhesive compositions therefrom |
| JP2000345131A (ja) * | 1999-06-03 | 2000-12-12 | Nippon Synthetic Chem Ind Co Ltd:The | 再剥離型粘着剤組成物 |
| DE10256511A1 (de) * | 2002-12-04 | 2004-06-24 | Tesa Ag | Haftklebemasse |
| JP2006111651A (ja) * | 2004-10-12 | 2006-04-27 | Nippon Synthetic Chem Ind Co Ltd:The | 粘着シート |
| US8252138B2 (en) * | 2004-12-27 | 2012-08-28 | Oji Paper Co., Ltd. | Thermosensitive multiple recording sheet and method for producing the same |
| JP5002139B2 (ja) * | 2005-08-22 | 2012-08-15 | 電気化学工業株式会社 | 組成物及びそれを用いる部材の仮固定方法 |
| RU2536553C2 (ru) * | 2009-04-27 | 2014-12-27 | Авери Деннисон Корпорейшн | Системы, способы и материалы для доставки и отсоединяющиеся при необходимости |
| US9263314B2 (en) * | 2010-08-06 | 2016-02-16 | Brewer Science Inc. | Multiple bonding layers for thin-wafer handling |
| US20130288052A1 (en) * | 2010-11-05 | 2013-10-31 | 3M Innovative Properties Company | Silicone-modified adhesives with anti-slip properties |
| WO2012092447A1 (en) * | 2010-12-29 | 2012-07-05 | Promerus, Llc | Polymer compositions for temporary bonding |
| CN103998549B (zh) * | 2011-07-19 | 2016-10-12 | 3M创新有限公司 | 可热脱粘的粘合剂制品以及制备和使用此类制品的方法 |
| JP5592330B2 (ja) * | 2011-10-07 | 2014-09-17 | 信越化学工業株式会社 | 仮接着剤組成物、及びそれを用いた薄型ウエハの製造方法 |
| US20130224425A1 (en) * | 2012-02-23 | 2013-08-29 | Hitachi Chemical Company, Ltd. | Pressure-sensitive adhesive sheet for image display device, method for producing image display device and image display device |
| US8999817B2 (en) * | 2012-02-28 | 2015-04-07 | Shin-Etsu Chemical Co., Ltd. | Wafer process body, wafer processing member, wafer processing temporary adhesive material, and method for manufacturing thin wafer |
-
2012
- 2012-06-13 JP JP2012134189A patent/JP6031264B2/ja not_active Expired - Fee Related
-
2013
- 2013-05-30 WO PCT/JP2013/065102 patent/WO2013187244A1/ja not_active Ceased
- 2013-05-30 KR KR1020147034543A patent/KR20150006480A/ko not_active Ceased
- 2013-06-13 TW TW102120935A patent/TW201406894A/zh unknown
-
2014
- 2014-12-11 US US14/567,471 patent/US20150093879A1/en not_active Abandoned
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