JP2013254869A5 - - Google Patents

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Publication number
JP2013254869A5
JP2013254869A5 JP2012130099A JP2012130099A JP2013254869A5 JP 2013254869 A5 JP2013254869 A5 JP 2013254869A5 JP 2012130099 A JP2012130099 A JP 2012130099A JP 2012130099 A JP2012130099 A JP 2012130099A JP 2013254869 A5 JP2013254869 A5 JP 2013254869A5
Authority
JP
Japan
Prior art keywords
ground
layer
land
wiring portion
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012130099A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013254869A (ja
JP6202788B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2012130099A priority Critical patent/JP6202788B2/ja
Priority claimed from JP2012130099A external-priority patent/JP6202788B2/ja
Publication of JP2013254869A publication Critical patent/JP2013254869A/ja
Publication of JP2013254869A5 publication Critical patent/JP2013254869A5/ja
Application granted granted Critical
Publication of JP6202788B2 publication Critical patent/JP6202788B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2012130099A 2012-06-07 2012-06-07 電子機器 Expired - Fee Related JP6202788B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012130099A JP6202788B2 (ja) 2012-06-07 2012-06-07 電子機器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012130099A JP6202788B2 (ja) 2012-06-07 2012-06-07 電子機器

Publications (3)

Publication Number Publication Date
JP2013254869A JP2013254869A (ja) 2013-12-19
JP2013254869A5 true JP2013254869A5 (cg-RX-API-DMAC7.html) 2015-07-23
JP6202788B2 JP6202788B2 (ja) 2017-09-27

Family

ID=49952144

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012130099A Expired - Fee Related JP6202788B2 (ja) 2012-06-07 2012-06-07 電子機器

Country Status (1)

Country Link
JP (1) JP6202788B2 (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6729044B2 (ja) * 2016-06-20 2020-07-22 大日本印刷株式会社 配線基板およびその製造方法、ならびに半導体装置の製造方法
JP7308999B1 (ja) 2022-02-10 2023-07-14 三菱電機株式会社 電力変換装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH065994A (ja) * 1992-06-18 1994-01-14 Mitsubishi Electric Corp 多層プリント配線板
JP3193142B2 (ja) * 1992-08-28 2001-07-30 株式会社東芝 基 板
JPH0799396A (ja) * 1993-09-29 1995-04-11 Fujitsu Ltd ヒートシンク
JP4306000B2 (ja) * 1999-03-24 2009-07-29 パナソニック株式会社 電気回路部の放熱装置
JP2005150454A (ja) * 2003-11-17 2005-06-09 Yaskawa Electric Corp 電力変換装置の冷却構造

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