JP2013236390A - 超音波探触子及び圧電振動子 - Google Patents
超音波探触子及び圧電振動子 Download PDFInfo
- Publication number
- JP2013236390A JP2013236390A JP2013146378A JP2013146378A JP2013236390A JP 2013236390 A JP2013236390 A JP 2013236390A JP 2013146378 A JP2013146378 A JP 2013146378A JP 2013146378 A JP2013146378 A JP 2013146378A JP 2013236390 A JP2013236390 A JP 2013236390A
- Authority
- JP
- Japan
- Prior art keywords
- ultrasonic probe
- piezoelectric element
- grooves
- thermal expansion
- piezoelectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000523 sample Substances 0.000 title claims abstract description 61
- 229920005989 resin Polymers 0.000 claims abstract description 32
- 239000011347 resin Substances 0.000 claims abstract description 32
- 238000002156 mixing Methods 0.000 claims abstract description 23
- 230000005484 gravity Effects 0.000 claims description 14
- 239000008187 granular material Substances 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 41
- 150000001875 compounds Chemical class 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 239000002131 composite material Substances 0.000 description 45
- 239000011231 conductive filler Substances 0.000 description 19
- 238000004519 manufacturing process Methods 0.000 description 17
- 238000000034 method Methods 0.000 description 14
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 11
- 239000000945 filler Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 9
- 238000000605 extraction Methods 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 5
- 238000009826 distribution Methods 0.000 description 5
- 239000004020 conductor Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/12—Diagnosis using ultrasonic, sonic or infrasonic waves in body cavities or body tracts, e.g. by using catheters
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
Landscapes
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Physics & Mathematics (AREA)
- General Health & Medical Sciences (AREA)
- Pathology (AREA)
- Immunology (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Biochemistry (AREA)
- Analytical Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Heart & Thoracic Surgery (AREA)
- Animal Behavior & Ethology (AREA)
- Molecular Biology (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Medical Informatics (AREA)
- Surgery (AREA)
- Biomedical Technology (AREA)
- Radiology & Medical Imaging (AREA)
- Biophysics (AREA)
- Acoustics & Sound (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
Abstract
【解決手段】平行に形成される複数の溝をそれぞれ有し、前記溝と平行する方向に沿って配列された複数の圧電素子41と、前記複数の溝に充填される、非導電性の樹脂部材に略10−5k−1以下の熱膨張係数を有する非導電性の粒状体が混合されてなる複合材70と、を具備する。
【選択図】 図1
Description
図4A〜図4Kは本実施形態における超音波探触子10の製造工程を説明するための図である。まず図4Aに示すように、圧電体ブロック(圧電材料)43を用意する。次に、図4Bに示すように圧電体ブロック43に対してアレイ方向に沿って平行に複数の溝を形成する。この溝加工は、上述した超音波ビームを重み付けするための加工である。複数の溝は、所望の関数に基づく幅及びピッチ間隔で形成される。複数の溝は、圧電体ブロック43を貫通せず、中途まで形成される。この溝加工された圧電体ブロック43は圧電素子41となる。次に図4Cに示すように、圧電素子41の複数の溝に複合材70を注入する。次に、図4Dに示すように、所望の周波数特性を得られるように圧電素子41の凸部の上表面を露出させる。この露出をする際、結果的に複合剤70は研磨されるわけだが、複合材70は、非導電性フィラーを含むために樹脂材特有の粘りが抑えられ、研磨がしやすい。次に、図4Eに示すように、金等のメッキ又はスパッタを圧電素子41に施すことによって、第1の電極36を圧電素子41の下部全体に、第2の電極37を圧電素子41の上部全体に形成する。その後、第1の電極36と第2の電極37とに所定の電圧を印加する。こうして圧電振動子40が得られる。
Claims (8)
- 平行に形成される複数の溝をそれぞれ有し、前記溝と略平行する方向に沿って配列された複数の圧電素子と、
前記複数の溝に充填される、非導電性の樹脂部材に略10−5k−1以下の熱膨張係数を有する非導電性の粒状体が混合されてなる混合部材と、
を具備することを特徴とする超音波探触子。 - 前記樹脂部材と前記粒状体との混合比率は、前記圧電素子の温度、前記圧電素子が耐えうる応力値、前記混合部材の比重、前記混合部材の熱膨張係数の少なくとも1つに基づいて決定される、
ことを特徴とする請求項1記載の超音波探触子。 - 前記混合部材の比重は、前記圧電素子の比重の略1/3以下である、
ことを特徴とする請求項1記載の超音波探触子。 - 前記混合部材の熱膨張係数は、使用時における前記混合部材の温度に基づいて決定される、
ことを特徴する請求項1記載の超音波探触子。 - 前記混合部材は、前記混合部材が熱膨張した場合でも前記圧電素子を破壊できない程度の応力を発生する熱膨張係数を有する、
ことを特徴とする請求項1記載の超音波探触子。 - 前記粒状体の粒径は、前記圧電素子が送受信する超音波の波長の略1/8以下である、
ことを特徴とする請求項1記載の超音波探触子。 - 前記複数の溝は、前記溝の配列方向の中央部から端部へいくに従って送受信される超音波強度が弱くなるように前記圧電素子各々に形成される、
ことを特徴とする請求項1記載の超音波探触子。 - 複数の溝を有する圧電素子と、
前記複数の溝に充填される、非導電性の樹脂部材に略10−5k−1以下の熱膨張係数を有する非導電性の粒状体が混合されてなる混合部材と、
を具備する圧電振動子。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013146378A JP5865873B2 (ja) | 2006-09-26 | 2013-07-12 | 超音波探触子 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006261119 | 2006-09-26 | ||
JP2006261119 | 2006-09-26 | ||
JP2013146378A JP5865873B2 (ja) | 2006-09-26 | 2013-07-12 | 超音波探触子 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007245083A Division JP5322419B2 (ja) | 2006-09-26 | 2007-09-21 | 超音波探触子及び圧電振動子 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013236390A true JP2013236390A (ja) | 2013-11-21 |
JP5865873B2 JP5865873B2 (ja) | 2016-02-17 |
Family
ID=39414852
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013146378A Expired - Fee Related JP5865873B2 (ja) | 2006-09-26 | 2013-07-12 | 超音波探触子 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7598658B2 (ja) |
JP (1) | JP5865873B2 (ja) |
KR (1) | KR100966194B1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016117636A1 (ja) * | 2015-01-22 | 2016-07-28 | ユニチカ株式会社 | 積層体およびその製造方法および使用方法ならびにガラス基板積層用ポリイミド前駆体溶液 |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5065763B2 (ja) * | 2007-05-18 | 2012-11-07 | Jfeミネラル株式会社 | 圧電単結晶素子 |
JP5038865B2 (ja) * | 2007-11-22 | 2012-10-03 | 株式会社東芝 | 超音波探触子、超音波診断装置、及び超音波探触子の製造方法 |
JP2009273838A (ja) * | 2008-05-19 | 2009-11-26 | Fujifilm Corp | 超音波探触子、超音波診断装置及び超音波内視鏡装置 |
DE102008055123B3 (de) * | 2008-12-23 | 2010-07-22 | Robert Bosch Gmbh | Ultraschallwandler zum Einsatz in einem fluiden Medium |
US8232705B2 (en) * | 2010-07-09 | 2012-07-31 | General Electric Company | Thermal transfer and acoustic matching layers for ultrasound transducer |
EP2450111A1 (en) * | 2010-11-04 | 2012-05-09 | Samsung Medison Co., Ltd. | Ultrasound probe including ceramic layer formed with ceramic elements having different thickness and ultrasound system using the same |
US9061928B2 (en) * | 2011-02-28 | 2015-06-23 | Corning Incorporated | Ultrasonic transducer assembly for applying ultrasonic acoustic energy to a glass melt |
JP5738671B2 (ja) * | 2011-05-18 | 2015-06-24 | 株式会社東芝 | 超音波トランスデューサ、超音波プローブおよび超音波トランスデューサの製造方法 |
JP6102622B2 (ja) * | 2013-08-07 | 2017-03-29 | コニカミノルタ株式会社 | 超音波探触子 |
EP2894631B1 (en) | 2013-12-20 | 2018-08-22 | Samsung Medison Co., Ltd. | Ultrasonic diagnostic apparatus and manufacturing method thereof |
KR102293575B1 (ko) * | 2014-09-04 | 2021-08-26 | 삼성메디슨 주식회사 | 초음파 영상장치용 프로브 및 그 제조방법 |
KR102373132B1 (ko) * | 2014-12-26 | 2022-03-11 | 삼성메디슨 주식회사 | 초음파 프로브 장치 및 초음파 촬영 장치 |
US10447236B2 (en) * | 2015-12-11 | 2019-10-15 | Canon Medical Systems Corporation | Ultrasonic probe |
EP3685308A4 (en) * | 2017-09-22 | 2020-11-18 | Fingerprint Cards AB | ULTRASONIC TRANSDUCER DEVICE, ACOUSTIC BIOMETRIC IMAGING SYSTEM AND MANUFACTURING PROCESS |
US11813640B2 (en) * | 2019-11-18 | 2023-11-14 | Fujifilm Sonosite, Inc. | Planar phased ultrasound transducer array |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03296250A (ja) * | 1990-04-16 | 1991-12-26 | Toshiba Corp | 樹脂封止型半導体装置 |
JPH05309096A (ja) * | 1992-05-12 | 1993-11-22 | Toshiba Ceramics Co Ltd | 衝撃波発生源 |
JPH08255307A (ja) * | 1995-03-17 | 1996-10-01 | Mitsubishi Electric Corp | 磁気ヘッド装置およびその製造方法 |
JP2002112394A (ja) * | 2000-10-03 | 2002-04-12 | Matsushita Electric Ind Co Ltd | 熱膨張率の異なる物体の結合体とそれを用いた超音波送受信器及びその製造方法 |
JP2003009288A (ja) * | 2001-06-11 | 2003-01-10 | Ge Medical Systems Global Technology Co Llc | 圧電装置、超音波プローブおよび超音波撮像装置 |
JP2004079825A (ja) * | 2002-08-20 | 2004-03-11 | Nec Tokin Corp | 積層型圧電セラミックス素子およびその製造方法 |
JP2005086458A (ja) * | 2003-09-08 | 2005-03-31 | Olympus Corp | アレイ型超音波振動子 |
JP2005110171A (ja) * | 2003-10-02 | 2005-04-21 | Matsushita Electric Ind Co Ltd | 超音波探触子 |
WO2006033232A1 (ja) * | 2004-09-21 | 2006-03-30 | Olympus Corporation | 超音波振動子、超音波振動子アレイ、及び超音波内視鏡装置 |
JP2006121327A (ja) * | 2004-10-20 | 2006-05-11 | Toshiba Corp | 超音波プローブ及び超音波診断装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6266800A (ja) | 1985-09-18 | 1987-03-26 | Olympus Optical Co Ltd | 超音波探触子 |
JPH04171990A (ja) * | 1990-11-06 | 1992-06-19 | Toto Ltd | 圧電セラミック焼結体 |
JPH05229117A (ja) * | 1992-02-19 | 1993-09-07 | Seiko Epson Corp | インクジェット式印字ヘッドとその製造方法 |
US5550408A (en) * | 1992-11-18 | 1996-08-27 | Matsushita Electronics Corporation | Semiconductor device |
US6183578B1 (en) | 1998-04-21 | 2001-02-06 | Penn State Research Foundation | Method for manufacture of high frequency ultrasound transducers |
JP2001339011A (ja) * | 2000-03-24 | 2001-12-07 | Shinko Electric Ind Co Ltd | 半導体装置およびその製造方法 |
US6936336B2 (en) * | 2002-03-15 | 2005-08-30 | Kyocera Corporation | Transfer sheet and production method of the same and wiring board and production method of the same |
US7348712B2 (en) * | 2004-04-16 | 2008-03-25 | Kabushiki Kaisha Toshiba | Ultrasonic probe and ultrasonic diagnostic apparatus |
JP4776247B2 (ja) * | 2005-02-09 | 2011-09-21 | 富士通株式会社 | 配線基板及びその製造方法 |
JP2009082612A (ja) * | 2007-10-02 | 2009-04-23 | Toshiba Corp | 超音波探触子及び圧電振動子 |
-
2007
- 2007-09-21 KR KR1020070096548A patent/KR100966194B1/ko not_active IP Right Cessation
- 2007-09-25 US US11/860,799 patent/US7598658B2/en not_active Expired - Fee Related
-
2013
- 2013-07-12 JP JP2013146378A patent/JP5865873B2/ja not_active Expired - Fee Related
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03296250A (ja) * | 1990-04-16 | 1991-12-26 | Toshiba Corp | 樹脂封止型半導体装置 |
JPH05309096A (ja) * | 1992-05-12 | 1993-11-22 | Toshiba Ceramics Co Ltd | 衝撃波発生源 |
JPH08255307A (ja) * | 1995-03-17 | 1996-10-01 | Mitsubishi Electric Corp | 磁気ヘッド装置およびその製造方法 |
JP2002112394A (ja) * | 2000-10-03 | 2002-04-12 | Matsushita Electric Ind Co Ltd | 熱膨張率の異なる物体の結合体とそれを用いた超音波送受信器及びその製造方法 |
JP2003009288A (ja) * | 2001-06-11 | 2003-01-10 | Ge Medical Systems Global Technology Co Llc | 圧電装置、超音波プローブおよび超音波撮像装置 |
JP2004079825A (ja) * | 2002-08-20 | 2004-03-11 | Nec Tokin Corp | 積層型圧電セラミックス素子およびその製造方法 |
JP2005086458A (ja) * | 2003-09-08 | 2005-03-31 | Olympus Corp | アレイ型超音波振動子 |
JP2005110171A (ja) * | 2003-10-02 | 2005-04-21 | Matsushita Electric Ind Co Ltd | 超音波探触子 |
WO2006033232A1 (ja) * | 2004-09-21 | 2006-03-30 | Olympus Corporation | 超音波振動子、超音波振動子アレイ、及び超音波内視鏡装置 |
JP2006121327A (ja) * | 2004-10-20 | 2006-05-11 | Toshiba Corp | 超音波プローブ及び超音波診断装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016117636A1 (ja) * | 2015-01-22 | 2016-07-28 | ユニチカ株式会社 | 積層体およびその製造方法および使用方法ならびにガラス基板積層用ポリイミド前駆体溶液 |
JPWO2016117636A1 (ja) * | 2015-01-22 | 2017-11-02 | ユニチカ株式会社 | 積層体およびその製造方法および使用方法ならびにガラス基板積層用ポリイミド前駆体溶液 |
Also Published As
Publication number | Publication date |
---|---|
US20080238262A1 (en) | 2008-10-02 |
KR20080028319A (ko) | 2008-03-31 |
JP5865873B2 (ja) | 2016-02-17 |
US7598658B2 (en) | 2009-10-06 |
KR100966194B1 (ko) | 2010-06-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5865873B2 (ja) | 超音波探触子 | |
US9812634B2 (en) | Method of making thick film transducer arrays | |
JP5415274B2 (ja) | 超音波探触子 | |
CN107920797B (zh) | 超声波换能器组件 | |
JP4171038B2 (ja) | 超音波プローブおよび超音波診断装置 | |
US20050194865A1 (en) | High frequency ultrasound transducers based on ceramic films | |
US5559388A (en) | High density interconnect for an ultrasonic phased array and method for making | |
JP7376008B2 (ja) | 高周波超音波トランスデューサ | |
JPH09238399A (ja) | 超音波探触子及びその製造方法 | |
JP2009082612A (ja) | 超音波探触子及び圧電振動子 | |
JP4941998B2 (ja) | 超音波プローブの圧電振動子、超音波プローブ、超音波診断装置及び超音波プローブにおける圧電振動子の製造方法 | |
JP5322419B2 (ja) | 超音波探触子及び圧電振動子 | |
JP3954543B2 (ja) | 複合圧電体 | |
JPH04218765A (ja) | 超音波プローブ | |
US9566612B2 (en) | Ultrasonic probe | |
JP2000131298A (ja) | 超音波探触子 | |
JP3455431B2 (ja) | 超音波プローブ | |
JP4468599B2 (ja) | 超音波探触子 | |
JPH07136164A (ja) | 超音波探触子 | |
JP2009072349A (ja) | 超音波トランスデューサ及びその製造方法、並びに、超音波探触子 | |
JP2005086458A (ja) | アレイ型超音波振動子 | |
JPH07194517A (ja) | 超音波探触子 | |
JP3559497B2 (ja) | 超音波探触子 | |
US11938514B2 (en) | Curved shape piezoelectric transducer and method for manufacturing the same | |
JPWO2020137966A1 (ja) | 超音波デバイス |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20140314 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140401 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140508 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20150106 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150303 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20150804 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150819 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20150908 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20151030 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20151201 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20151228 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5865873 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313117 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
LAPS | Cancellation because of no payment of annual fees |