JP2013235087A - ペリクルの製造方法 - Google Patents
ペリクルの製造方法 Download PDFInfo
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- JP2013235087A JP2013235087A JP2012106550A JP2012106550A JP2013235087A JP 2013235087 A JP2013235087 A JP 2013235087A JP 2012106550 A JP2012106550 A JP 2012106550A JP 2012106550 A JP2012106550 A JP 2012106550A JP 2013235087 A JP2013235087 A JP 2013235087A
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- Prior art keywords
- frame
- pellicle
- pellicle film
- film
- manufacturing
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
- B29C63/02—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using sheet or web-like material
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
- G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
【解決手段】仮枠21に仮付された1枚のペリクル膜3に、結合された分割枠41を貼り付けた後にペリクル膜3を切断して分割枠41を分離し、フレームに貼り付けた後に分割枠41を取り去るペリクルの製造方法。
【選択図】図3
Description
Claims (5)
- ペリクル膜をフレームに緊締して貼り付けるペリクルの製造方法において、
1枚のペリクル膜を仮枠上に貼り付け、
該仮枠の内寸よりも小さい外寸の、複数並べて結合された分割枠を、仮枠上のペリクル膜に接着してから、
ペリクル膜を分割枠の外辺に沿って仮枠から切離すとともに、結合された分割枠を分離し、
個々の分割枠上に接着したペリクル膜を、フレームに貼り付けてから、分割枠を取り去ることを特徴とするペリクルの製造方法。 - ペリクル膜をフレームに緊締して貼り付けるペリクルの製造方法において、
成膜基板上の1枚のペリクル膜を、複数並べて結合された分割枠に貼り付け、
ペリクル膜を分割枠の外辺に沿って成膜基板から切離すとともに、結合された分割枠を分離し、
個々の分割枠上に接着したペリクル膜を、フレームに貼り付けてから、分割枠を取り去ることを特徴とするペリクルの製造方法。 - 分割枠上に接着したペリクル膜をフレームに貼り付ける際、分割枠に圧縮または引張の力を加えて、ペリクル膜を貼り付けてから、該力を解放することを特徴とする請求項1または2に記載のペリクルの製造方法。
- 分割枠上に接着したペリクル膜をフレームに貼り付ける際、フレームに圧縮または引張の力を加えて、ペリクル膜を貼り付けてから、該力を解放することを特徴とする請求項1または2に記載のペリクルの製造方法。
- 請求項1〜4のいずれか一項に記載された方法により製造されたことを特徴とするペリクル。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012106550A JP5746661B2 (ja) | 2012-05-08 | 2012-05-08 | ペリクルの製造方法 |
KR1020130034297A KR102020248B1 (ko) | 2012-05-08 | 2013-03-29 | 펠리클의 제조 방법 |
TW102116131A TWI491977B (zh) | 2012-05-08 | 2013-05-07 | 防塵薄膜組件的製造方法及由多個分割框並列結合而成的分割框組合體 |
CN201310167125.9A CN103389617B (zh) | 2012-05-08 | 2013-05-08 | 防尘薄膜组件的制造方法 |
HK14101592.4A HK1188487A1 (zh) | 2012-05-08 | 2014-02-19 | 防塵薄膜組件的製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012106550A JP5746661B2 (ja) | 2012-05-08 | 2012-05-08 | ペリクルの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013235087A true JP2013235087A (ja) | 2013-11-21 |
JP5746661B2 JP5746661B2 (ja) | 2015-07-08 |
Family
ID=49533924
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012106550A Active JP5746661B2 (ja) | 2012-05-08 | 2012-05-08 | ペリクルの製造方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5746661B2 (ja) |
KR (1) | KR102020248B1 (ja) |
CN (1) | CN103389617B (ja) |
HK (1) | HK1188487A1 (ja) |
TW (1) | TWI491977B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI566033B (zh) * | 2015-04-17 | 2017-01-11 | Micro Lithography Inc | Mask dustproof frame structure |
CN108123671A (zh) * | 2017-11-29 | 2018-06-05 | 北京创昱科技有限公司 | 一种框架压缩装置及薄膜拉伸方法 |
KR20230054032A (ko) | 2021-10-15 | 2023-04-24 | 주식회사 이솔 | Euv 리소그래피용 펠리클 구조 및 제조방법 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06230561A (ja) * | 1993-01-29 | 1994-08-19 | Shin Etsu Chem Co Ltd | リソグラフィー用ペリクル膜の製造方法 |
JPH09258433A (ja) * | 1996-03-19 | 1997-10-03 | Nikon Corp | マスク |
JPH10339944A (ja) * | 1997-06-09 | 1998-12-22 | Shin Etsu Chem Co Ltd | ペリクルの製造方法 |
US20050157288A1 (en) * | 2003-11-26 | 2005-07-21 | Sematech, Inc. | Zero-force pellicle mount and method for manufacturing the same |
JP2010145264A (ja) * | 2008-12-19 | 2010-07-01 | Pioneer Electronic Corp | Memsデバイスの製造方法、memsデバイスおよび接合マザー基板 |
JP2011158585A (ja) * | 2010-01-29 | 2011-08-18 | Shin-Etsu Chemical Co Ltd | ペリクルおよびペリクルの製造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004157229A (ja) | 2002-11-05 | 2004-06-03 | Shin Etsu Chem Co Ltd | リソグラフィ用ペリクル及びその製造方法 |
JP5481106B2 (ja) * | 2009-06-24 | 2014-04-23 | 信越化学工業株式会社 | ペリクルフレーム及びリソグラフィ用ペリクル |
JP2011107230A (ja) * | 2009-11-13 | 2011-06-02 | Shin-Etsu Chemical Co Ltd | ペリクルおよびその製造方法 |
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2012
- 2012-05-08 JP JP2012106550A patent/JP5746661B2/ja active Active
-
2013
- 2013-03-29 KR KR1020130034297A patent/KR102020248B1/ko active IP Right Grant
- 2013-05-07 TW TW102116131A patent/TWI491977B/zh active
- 2013-05-08 CN CN201310167125.9A patent/CN103389617B/zh active Active
-
2014
- 2014-02-19 HK HK14101592.4A patent/HK1188487A1/zh not_active IP Right Cessation
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06230561A (ja) * | 1993-01-29 | 1994-08-19 | Shin Etsu Chem Co Ltd | リソグラフィー用ペリクル膜の製造方法 |
JPH09258433A (ja) * | 1996-03-19 | 1997-10-03 | Nikon Corp | マスク |
JPH10339944A (ja) * | 1997-06-09 | 1998-12-22 | Shin Etsu Chem Co Ltd | ペリクルの製造方法 |
US20050157288A1 (en) * | 2003-11-26 | 2005-07-21 | Sematech, Inc. | Zero-force pellicle mount and method for manufacturing the same |
JP2010145264A (ja) * | 2008-12-19 | 2010-07-01 | Pioneer Electronic Corp | Memsデバイスの製造方法、memsデバイスおよび接合マザー基板 |
JP2011158585A (ja) * | 2010-01-29 | 2011-08-18 | Shin-Etsu Chemical Co Ltd | ペリクルおよびペリクルの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN103389617A (zh) | 2013-11-13 |
TW201404577A (zh) | 2014-02-01 |
JP5746661B2 (ja) | 2015-07-08 |
CN103389617B (zh) | 2016-03-02 |
KR20130125295A (ko) | 2013-11-18 |
KR102020248B1 (ko) | 2019-09-10 |
HK1188487A1 (zh) | 2014-05-02 |
TWI491977B (zh) | 2015-07-11 |
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