JP2013232561A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP2013232561A JP2013232561A JP2012104229A JP2012104229A JP2013232561A JP 2013232561 A JP2013232561 A JP 2013232561A JP 2012104229 A JP2012104229 A JP 2012104229A JP 2012104229 A JP2012104229 A JP 2012104229A JP 2013232561 A JP2013232561 A JP 2013232561A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 16
- 239000012535 impurity Substances 0.000 claims abstract description 29
- 239000000758 substrate Substances 0.000 claims abstract description 21
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 76
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 76
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 230000015556 catabolic process Effects 0.000 abstract description 28
- 230000005684 electric field Effects 0.000 abstract description 11
- 238000009413 insulation Methods 0.000 abstract 5
- 239000010410 layer Substances 0.000 description 51
- 238000010586 diagram Methods 0.000 description 5
- 239000000969 carrier Substances 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000003574 free electron Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System
- H01L29/1608—Silicon carbide
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- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/0843—Source or drain regions of field-effect devices
- H01L29/0847—Source or drain regions of field-effect devices of field-effect transistors with insulated gate
- H01L29/0852—Source or drain regions of field-effect devices of field-effect transistors with insulated gate of DMOS transistors
- H01L29/0873—Drain regions
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- H—ELECTRICITY
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- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/0843—Source or drain regions of field-effect devices
- H01L29/0847—Source or drain regions of field-effect devices of field-effect transistors with insulated gate
- H01L29/0852—Source or drain regions of field-effect devices of field-effect transistors with insulated gate of DMOS transistors
- H01L29/0873—Drain regions
- H01L29/0878—Impurity concentration or distribution
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/36—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the concentration or distribution of impurities in the bulk material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
Abstract
【解決手段】n+型SiC基板のおもて面にn型SiC層が形成され、n型SiC層の内部に選択的に複数のp型領域が形成される。n型SiC層およびp型領域の表面にわたってp型SiC層が形成される。p型SiC層の内部にn型SiC層につながるようにn型領域が形成される。p型SiC層の内部に、n型領域と離れて、かつ互いに接するn+型ソース領域とp+型コンタクト領域とが形成される。p型SiC層内部のn型領域の幅LJFETが0.8μm〜3.0μmの範囲内となり、n型領域の不純物濃度が1.0×1016cm-3〜5.0×1016cm-3の範囲内となるようにn型領域を形成する。これにより、ゲート酸化膜に大きな電界がかかることがなくなるため、ゲート絶縁膜の破壊耐量が向上し、ゲート絶縁膜の信頼性が向上する。
【選択図】図4
Description
図1は、本発明の実施の形態にかかるMOSFETの構成を示す断面図である。図1に示すように、本発明の実施の形態にかかるMOSFETにおいて、n+型SiC基板(第1導電型の炭化珪素基板)1のおもて面にはn型SiC層(第1導電型炭化珪素層)2が形成される。n型SiC層2の不純物濃度は、n+型SiC基板1の不純物濃度よりも低い。n型SiC層2の内部には、複数のp型領域(第2導電型領域)10が選択的に形成される。
2 n型炭化珪素層
4 n+型ソース領域
5 p+型コンタクト領域
6 ゲート絶縁膜
7 ゲート電極
8 ソース電極
9 ドレイン電極
10 p型領域
11 p型炭化珪素層
12 n型領域
Claims (2)
- 第1導電型炭化珪素基板と、
前記第1導電型炭化珪素基板の表面に形成された、前記第1導電型炭化珪素基板よりも低不純物濃度の第1導電型炭化珪素層と、
前記第1導電型炭化珪素層の内部に選択的に形成された第2導電型領域と、
前記第1導電型炭化珪素層および前記第2導電型領域の表面に形成された第2導電型炭化珪素層と、
前記第2導電型炭化珪素層の内部に選択的に形成され、深さ方向に前記第2導電型炭化珪素層を貫通し前記第1導電型炭化珪素層に接する第1導電型領域と、
前記第2導電型炭化珪素層の内部に形成された第1導電型ソース領域と、
前記第2導電型炭化珪素層の内部に形成され、かつ前記第1導電型ソース領域の第1導電型領域側に対して反対側に配置された第2導電型高濃度領域と、
前記第2導電型高濃度領域および第1導電型ソース領域に電気的に接続されたソース電極と、
前記第1導電型ソース領域から前記第1導電型領域に跨って、第2導電型炭化珪素層の前記第1導電型ソース領域と前記第1導電型領域とに挟まれた部分の表面にゲート絶縁膜を介して形成されたゲート電極と、
前記第1導電型炭化珪素基板の裏面に形成されたドレイン電極と、
を備え、
前記第1導電型領域の不純物濃度は、1.0×1016cm-3〜5.0×1016cm-3の範囲内にあり、
前記第1導電型領域の幅は、0.8μm〜3.0μmの範囲内にあることを特徴とする半導体装置。 - 前記第1導電型領域の不純物濃度は、2.0×1016cm-3〜4.0×1016cm-3の範囲内にあり、
前記第1導電型領域の幅は、1.0μm〜2.0μmの範囲内にあることを特徴とする請求項1に記載の半導体装置。
Priority Applications (3)
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JP2012104229A JP2013232561A (ja) | 2012-04-27 | 2012-04-27 | 半導体装置 |
US14/397,106 US9356100B2 (en) | 2012-04-27 | 2013-03-18 | Semiconductor device |
PCT/JP2013/057742 WO2013161448A1 (ja) | 2012-04-27 | 2013-03-18 | 半導体装置 |
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JP2012104229A JP2013232561A (ja) | 2012-04-27 | 2012-04-27 | 半導体装置 |
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JP2012104229A Pending JP2013232561A (ja) | 2012-04-27 | 2012-04-27 | 半導体装置 |
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US (1) | US9356100B2 (ja) |
JP (1) | JP2013232561A (ja) |
WO (1) | WO2013161448A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015115375A (ja) * | 2013-12-09 | 2015-06-22 | 国立研究開発法人産業技術総合研究所 | 炭化珪素半導体装置 |
JP2016058656A (ja) * | 2014-09-11 | 2016-04-21 | 富士電機株式会社 | 半導体装置および半導体装置の製造方法 |
JP2016058660A (ja) * | 2014-09-11 | 2016-04-21 | 富士電機株式会社 | 半導体装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001094097A (ja) * | 1999-09-21 | 2001-04-06 | Denso Corp | 炭化珪素半導体装置及びその製造方法 |
JP2006332401A (ja) * | 2005-05-27 | 2006-12-07 | National Institute Of Advanced Industrial & Technology | 炭化ケイ素半導体装置 |
JP2008098536A (ja) * | 2006-10-16 | 2008-04-24 | National Institute Of Advanced Industrial & Technology | 炭化ケイ素半導体装置およびその製造方法 |
JP2011165861A (ja) * | 2010-02-09 | 2011-08-25 | Mitsubishi Electric Corp | 炭化珪素半導体素子 |
Family Cites Families (2)
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WO2004036655A1 (ja) | 2002-10-18 | 2004-04-29 | National Institute Of Advanced Industrial Science And Technology | 炭化ケイ素半導体装置及びその製造方法 |
JP4858791B2 (ja) * | 2009-05-22 | 2012-01-18 | 住友電気工業株式会社 | 半導体装置およびその製造方法 |
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2012
- 2012-04-27 JP JP2012104229A patent/JP2013232561A/ja active Pending
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2013
- 2013-03-18 US US14/397,106 patent/US9356100B2/en active Active
- 2013-03-18 WO PCT/JP2013/057742 patent/WO2013161448A1/ja active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001094097A (ja) * | 1999-09-21 | 2001-04-06 | Denso Corp | 炭化珪素半導体装置及びその製造方法 |
JP2006332401A (ja) * | 2005-05-27 | 2006-12-07 | National Institute Of Advanced Industrial & Technology | 炭化ケイ素半導体装置 |
JP2008098536A (ja) * | 2006-10-16 | 2008-04-24 | National Institute Of Advanced Industrial & Technology | 炭化ケイ素半導体装置およびその製造方法 |
JP2011165861A (ja) * | 2010-02-09 | 2011-08-25 | Mitsubishi Electric Corp | 炭化珪素半導体素子 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015115375A (ja) * | 2013-12-09 | 2015-06-22 | 国立研究開発法人産業技術総合研究所 | 炭化珪素半導体装置 |
JP2016058656A (ja) * | 2014-09-11 | 2016-04-21 | 富士電機株式会社 | 半導体装置および半導体装置の製造方法 |
JP2016058660A (ja) * | 2014-09-11 | 2016-04-21 | 富士電機株式会社 | 半導体装置 |
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US9356100B2 (en) | 2016-05-31 |
US20150069415A1 (en) | 2015-03-12 |
WO2013161448A1 (ja) | 2013-10-31 |
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