JP2013217856A5 - - Google Patents

Download PDF

Info

Publication number
JP2013217856A5
JP2013217856A5 JP2012090505A JP2012090505A JP2013217856A5 JP 2013217856 A5 JP2013217856 A5 JP 2013217856A5 JP 2012090505 A JP2012090505 A JP 2012090505A JP 2012090505 A JP2012090505 A JP 2012090505A JP 2013217856 A5 JP2013217856 A5 JP 2013217856A5
Authority
JP
Japan
Prior art keywords
terminal
sensor
chip
sensor device
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012090505A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013217856A (ja
JP6167474B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2012090505A priority Critical patent/JP6167474B2/ja
Priority claimed from JP2012090505A external-priority patent/JP6167474B2/ja
Publication of JP2013217856A publication Critical patent/JP2013217856A/ja
Publication of JP2013217856A5 publication Critical patent/JP2013217856A5/ja
Application granted granted Critical
Publication of JP6167474B2 publication Critical patent/JP6167474B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2012090505A 2012-04-11 2012-04-11 センサーデバイスおよび電子機器 Active JP6167474B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012090505A JP6167474B2 (ja) 2012-04-11 2012-04-11 センサーデバイスおよび電子機器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012090505A JP6167474B2 (ja) 2012-04-11 2012-04-11 センサーデバイスおよび電子機器

Publications (3)

Publication Number Publication Date
JP2013217856A JP2013217856A (ja) 2013-10-24
JP2013217856A5 true JP2013217856A5 (enExample) 2015-05-28
JP6167474B2 JP6167474B2 (ja) 2017-07-26

Family

ID=49590101

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012090505A Active JP6167474B2 (ja) 2012-04-11 2012-04-11 センサーデバイスおよび電子機器

Country Status (1)

Country Link
JP (1) JP6167474B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6318556B2 (ja) * 2013-11-11 2018-05-09 セイコーエプソン株式会社 パッケージの製造方法および電子デバイスの製造方法
JP6372361B2 (ja) * 2015-01-16 2018-08-15 株式会社デンソー 複合センサ
JP2016180612A (ja) * 2015-03-23 2016-10-13 セイコーエプソン株式会社 振動デバイス、電子機器および移動体
JP6572603B2 (ja) * 2015-04-13 2019-09-11 セイコーエプソン株式会社 物理量センサー、電子機器および移動体

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09148363A (ja) * 1995-11-22 1997-06-06 Hitachi Ltd 半導体装置
JPH11340405A (ja) * 1998-05-22 1999-12-10 Fujitsu Quantum Devices Kk リードフレーム、半導体装置およびその製造方法
JP4603135B2 (ja) * 2000-08-07 2010-12-22 住友精密工業株式会社 振動型ジャイロセンサ
US20040226373A1 (en) * 2003-05-12 2004-11-18 Hitachi Metals, Ltd. Acceleration sensor device
WO2005098359A1 (ja) * 2004-04-07 2005-10-20 Murata Manufacturing Co., Ltd. 角速度計測装置
JP2007101531A (ja) * 2005-09-06 2007-04-19 Seiko Instruments Inc 力学量センサ
JP2008096244A (ja) * 2006-10-11 2008-04-24 Nippon Dempa Kogyo Co Ltd ２軸検出型の角速度センサ
JP5546132B2 (ja) * 2009-01-16 2014-07-09 セイコーインスツル株式会社 電子部品パッケージおよび電子部品パッケージの製造方法
JP2010256332A (ja) * 2009-04-02 2010-11-11 Seiko Epson Corp 振動片、振動子および物理量検出装置
JP2011082451A (ja) * 2009-10-09 2011-04-21 Elpida Memory Inc 半導体用パッケージ基板及びこれを備える半導体装置

Similar Documents

Publication Publication Date Title
EP2373059A3 (en) Semiconductor device and microphone
JP2013186030A5 (enExample)
DE602007004242D1 (de) Flip-chip-verbindung über chip-durchgangswege
EP2393307A3 (en) Semiconductor device and microphone
GB2411307B (en) Image sensor module and camera module package including the same
TW201614747A (en) Wire bond sensor package and method
WO2008153043A1 (ja) 半導体発光装置
JP2018159674A5 (enExample)
JP2010251662A5 (enExample)
EP2393306A3 (en) Microphone
JP2013066021A5 (enExample)
JP2010251663A5 (enExample)
JP2013131669A5 (enExample)
JP2013217856A5 (enExample)
EP2752873A3 (en) Semiconductor module
JP2013524552A5 (enExample)
TW200504982A (en) Semiconductor device and manufacturing method thereof
JP2014211350A5 (enExample)
TW201614785A (en) Semiconductor stack packages
EP2650917A3 (en) Multilayered semiconductor device, printed circuit board, and method of manufacturing multilayered semiconductor device
EP2618371A3 (en) Semiconductor device
JP2014085233A5 (enExample)
TW201613004A (en) Semiconductor memory device
US10057688B2 (en) Lead frame-based chip carrier used in the fabrication of MEMS transducer packages
WO2006051527A3 (en) Integrated circuit die with logically equivalent bonding pads