JP2013197531A5 - - Google Patents

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Publication number
JP2013197531A5
JP2013197531A5 JP2012066194A JP2012066194A JP2013197531A5 JP 2013197531 A5 JP2013197531 A5 JP 2013197531A5 JP 2012066194 A JP2012066194 A JP 2012066194A JP 2012066194 A JP2012066194 A JP 2012066194A JP 2013197531 A5 JP2013197531 A5 JP 2013197531A5
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JP
Japan
Prior art keywords
semiconductor chip
resin
protective resin
bonding wire
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012066194A
Other languages
English (en)
Japanese (ja)
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JP2013197531A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2012066194A priority Critical patent/JP2013197531A/ja
Priority claimed from JP2012066194A external-priority patent/JP2013197531A/ja
Publication of JP2013197531A publication Critical patent/JP2013197531A/ja
Publication of JP2013197531A5 publication Critical patent/JP2013197531A5/ja
Pending legal-status Critical Current

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JP2012066194A 2012-03-22 2012-03-22 半導体装置およびその製造方法 Pending JP2013197531A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012066194A JP2013197531A (ja) 2012-03-22 2012-03-22 半導体装置およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012066194A JP2013197531A (ja) 2012-03-22 2012-03-22 半導体装置およびその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2016165026A Division JP2016195292A (ja) 2016-08-25 2016-08-25 半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
JP2013197531A JP2013197531A (ja) 2013-09-30
JP2013197531A5 true JP2013197531A5 (zh) 2014-08-28

Family

ID=49396066

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012066194A Pending JP2013197531A (ja) 2012-03-22 2012-03-22 半導体装置およびその製造方法

Country Status (1)

Country Link
JP (1) JP2013197531A (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102063508B1 (ko) * 2013-06-13 2020-01-08 엘지이노텍 주식회사 발광 소자 및 이를 구비한 조명 시스템
US10847488B2 (en) 2015-11-02 2020-11-24 Mediatek Inc. Semiconductor package having multi-tier bonding wires and components directly mounted on the multi-tier bonding wires
US10037936B2 (en) * 2015-11-02 2018-07-31 Mediatek Inc. Semiconductor package with coated bonding wires and fabrication method thereof
DE102016109349A1 (de) * 2016-05-20 2017-11-23 Infineon Technologies Ag Chipgehäuse, verfahren zum bilden eines chipgehäuses und verfahren zum bilden eines elektrischen kontakts
FR3058260A1 (fr) * 2016-11-03 2018-05-04 Stmicroelectronics (Grenoble 2) Sas Procede de realisation d'une connexion electrique entre une puce electronique et une plaque de support et dispositif electronique
US10224306B2 (en) 2016-11-03 2019-03-05 Stmicroelectronics (Grenoble 2) Sas Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic device
JP7096649B2 (ja) * 2017-06-21 2022-07-06 スタンレー電気株式会社 半導体装置
DE102018113190B4 (de) * 2018-06-04 2020-03-12 Epcos Ag Vorrichtung mit einem elektrokeramischem Bauteil

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61111569A (ja) * 1984-11-06 1986-05-29 Shin Etsu Chem Co Ltd 樹脂封止半導体装置
JPH0651407B2 (ja) * 1985-05-23 1994-07-06 京セラ株式会社 サ−マルプリントヘツド
JPS6224650A (ja) * 1985-07-24 1987-02-02 Hitachi Vlsi Eng Corp 半導体装置
JPS6297360A (ja) * 1985-10-24 1987-05-06 Mitsubishi Metal Corp 半導体装置のボンデイングワイヤ用表面被覆高純度銅極細線
JPH0582678A (ja) * 1991-09-24 1993-04-02 Sanyo Electric Co Ltd 混成集積回路
JP2001226565A (ja) * 2000-12-25 2001-08-21 Nitto Denko Corp 半導体装置
JP2003092379A (ja) * 2001-09-18 2003-03-28 Hitachi Ltd 半導体装置
JP2004064033A (ja) * 2001-10-23 2004-02-26 Sumitomo Electric Wintec Inc ボンディングワイヤー
JP4189626B2 (ja) * 2002-03-08 2008-12-03 信越化学工業株式会社 有機ケイ素化合物の精製方法及び硬化性シリコーン組成物
JP2006241411A (ja) * 2005-03-07 2006-09-14 Nitto Denko Corp 半導体封止用エポキシ樹脂組成物およびその製法ならびにそれを用いた半導体装置
JP2009263601A (ja) * 2008-04-30 2009-11-12 Hitachi Chem Co Ltd 封止用エポキシ樹脂成形材料及び電子部品装置
US20100164083A1 (en) * 2008-12-29 2010-07-01 Numonyx B.V. Protective thin film coating in chip packaging
JPWO2010147187A1 (ja) * 2009-06-18 2012-12-06 ローム株式会社 半導体装置
WO2011070739A1 (ja) * 2009-12-07 2011-06-16 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物、その硬化体及び半導体装置

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