JP2013197531A5 - - Google Patents
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- Publication number
- JP2013197531A5 JP2013197531A5 JP2012066194A JP2012066194A JP2013197531A5 JP 2013197531 A5 JP2013197531 A5 JP 2013197531A5 JP 2012066194 A JP2012066194 A JP 2012066194A JP 2012066194 A JP2012066194 A JP 2012066194A JP 2013197531 A5 JP2013197531 A5 JP 2013197531A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- resin
- protective resin
- bonding wire
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012066194A JP2013197531A (ja) | 2012-03-22 | 2012-03-22 | 半導体装置およびその製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012066194A JP2013197531A (ja) | 2012-03-22 | 2012-03-22 | 半導体装置およびその製造方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016165026A Division JP2016195292A (ja) | 2016-08-25 | 2016-08-25 | 半導体装置およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013197531A JP2013197531A (ja) | 2013-09-30 |
JP2013197531A5 true JP2013197531A5 (zh) | 2014-08-28 |
Family
ID=49396066
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012066194A Pending JP2013197531A (ja) | 2012-03-22 | 2012-03-22 | 半導体装置およびその製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2013197531A (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102063508B1 (ko) * | 2013-06-13 | 2020-01-08 | 엘지이노텍 주식회사 | 발광 소자 및 이를 구비한 조명 시스템 |
US10847488B2 (en) | 2015-11-02 | 2020-11-24 | Mediatek Inc. | Semiconductor package having multi-tier bonding wires and components directly mounted on the multi-tier bonding wires |
US10037936B2 (en) * | 2015-11-02 | 2018-07-31 | Mediatek Inc. | Semiconductor package with coated bonding wires and fabrication method thereof |
DE102016109349A1 (de) * | 2016-05-20 | 2017-11-23 | Infineon Technologies Ag | Chipgehäuse, verfahren zum bilden eines chipgehäuses und verfahren zum bilden eines elektrischen kontakts |
FR3058260A1 (fr) * | 2016-11-03 | 2018-05-04 | Stmicroelectronics (Grenoble 2) Sas | Procede de realisation d'une connexion electrique entre une puce electronique et une plaque de support et dispositif electronique |
US10224306B2 (en) | 2016-11-03 | 2019-03-05 | Stmicroelectronics (Grenoble 2) Sas | Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic device |
JP7096649B2 (ja) * | 2017-06-21 | 2022-07-06 | スタンレー電気株式会社 | 半導体装置 |
DE102018113190B4 (de) * | 2018-06-04 | 2020-03-12 | Epcos Ag | Vorrichtung mit einem elektrokeramischem Bauteil |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61111569A (ja) * | 1984-11-06 | 1986-05-29 | Shin Etsu Chem Co Ltd | 樹脂封止半導体装置 |
JPH0651407B2 (ja) * | 1985-05-23 | 1994-07-06 | 京セラ株式会社 | サ−マルプリントヘツド |
JPS6224650A (ja) * | 1985-07-24 | 1987-02-02 | Hitachi Vlsi Eng Corp | 半導体装置 |
JPS6297360A (ja) * | 1985-10-24 | 1987-05-06 | Mitsubishi Metal Corp | 半導体装置のボンデイングワイヤ用表面被覆高純度銅極細線 |
JPH0582678A (ja) * | 1991-09-24 | 1993-04-02 | Sanyo Electric Co Ltd | 混成集積回路 |
JP2001226565A (ja) * | 2000-12-25 | 2001-08-21 | Nitto Denko Corp | 半導体装置 |
JP2003092379A (ja) * | 2001-09-18 | 2003-03-28 | Hitachi Ltd | 半導体装置 |
JP2004064033A (ja) * | 2001-10-23 | 2004-02-26 | Sumitomo Electric Wintec Inc | ボンディングワイヤー |
JP4189626B2 (ja) * | 2002-03-08 | 2008-12-03 | 信越化学工業株式会社 | 有機ケイ素化合物の精製方法及び硬化性シリコーン組成物 |
JP2006241411A (ja) * | 2005-03-07 | 2006-09-14 | Nitto Denko Corp | 半導体封止用エポキシ樹脂組成物およびその製法ならびにそれを用いた半導体装置 |
JP2009263601A (ja) * | 2008-04-30 | 2009-11-12 | Hitachi Chem Co Ltd | 封止用エポキシ樹脂成形材料及び電子部品装置 |
US20100164083A1 (en) * | 2008-12-29 | 2010-07-01 | Numonyx B.V. | Protective thin film coating in chip packaging |
JPWO2010147187A1 (ja) * | 2009-06-18 | 2012-12-06 | ローム株式会社 | 半導体装置 |
WO2011070739A1 (ja) * | 2009-12-07 | 2011-06-16 | 住友ベークライト株式会社 | 半導体封止用エポキシ樹脂組成物、その硬化体及び半導体装置 |
-
2012
- 2012-03-22 JP JP2012066194A patent/JP2013197531A/ja active Pending
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