JP2013192228A5 - - Google Patents

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Publication number
JP2013192228A5
JP2013192228A5 JP2013049912A JP2013049912A JP2013192228A5 JP 2013192228 A5 JP2013192228 A5 JP 2013192228A5 JP 2013049912 A JP2013049912 A JP 2013049912A JP 2013049912 A JP2013049912 A JP 2013049912A JP 2013192228 A5 JP2013192228 A5 JP 2013192228A5
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JP
Japan
Prior art keywords
ultrasonic probe
substrate
providing
array ultrasonic
placement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2013049912A
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English (en)
Japanese (ja)
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JP2013192228A (ja
JP5666640B2 (ja
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Publication date
Priority claimed from KR1020120026098A external-priority patent/KR101378012B1/ko
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Publication of JP2013192228A publication Critical patent/JP2013192228A/ja
Publication of JP2013192228A5 publication Critical patent/JP2013192228A5/ja
Application granted granted Critical
Publication of JP5666640B2 publication Critical patent/JP5666640B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2013049912A 2012-03-14 2013-03-13 マルチアレイ超音波プローブ装置及びその製造方法 Active JP5666640B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2012-0026098 2012-03-14
KR1020120026098A KR101378012B1 (ko) 2012-03-14 2012-03-14 멀티 어레이형 초음파 프로브 장치 및 멀티 어레이형 초음파 프로브 장치의 제조 방법

Publications (3)

Publication Number Publication Date
JP2013192228A JP2013192228A (ja) 2013-09-26
JP2013192228A5 true JP2013192228A5 (enExample) 2014-04-10
JP5666640B2 JP5666640B2 (ja) 2015-02-12

Family

ID=47913010

Family Applications (1)

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JP2013049912A Active JP5666640B2 (ja) 2012-03-14 2013-03-13 マルチアレイ超音波プローブ装置及びその製造方法

Country Status (5)

Country Link
US (1) US9071893B2 (enExample)
EP (1) EP2639789B1 (enExample)
JP (1) JP5666640B2 (enExample)
KR (1) KR101378012B1 (enExample)
CN (1) CN103300882B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108348217B (zh) * 2015-11-02 2021-07-20 皇家飞利浦有限公司 超声换能器阵列、探头和系统
CN109310882B (zh) * 2016-06-09 2021-02-26 皇家飞利浦有限公司 超声探头、超声系统和用于产生超声图像的方法
JP6712917B2 (ja) * 2016-07-14 2020-06-24 株式会社日立製作所 半導体センサチップアレイ、および超音波診断装置
US11744553B2 (en) * 2016-09-29 2023-09-05 Koninklijke Philips N.V. Ultrasound system, method and computer program product
KR101915255B1 (ko) * 2017-01-11 2018-11-05 삼성메디슨 주식회사 초음파 프로브의 제조 방법 및 그 초음파 프로브
WO2021142554A1 (en) * 2020-01-17 2021-07-22 The University Of British Columbia Flexible capacitive micromachined ultrasonic transducer arrays
KR102492901B1 (ko) * 2021-03-31 2023-01-30 국방과학연구소 압전단결정 복합체 음향센서 및 이를 포함하는 배열 음향센서

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE87767T1 (de) * 1989-11-09 1993-04-15 Contraves Ag Verfahren zur herstellung von hybridschaltungen mit einem array aus gleichen elektronischen elementen.
JP3131485B2 (ja) 1992-02-04 2001-01-31 オリンパス光学工業株式会社 超音波プローブ
JP3535204B2 (ja) 1994-02-28 2004-06-07 株式会社東芝 超音波プローブ及びその製造方法
US5655276A (en) 1995-02-06 1997-08-12 General Electric Company Method of manufacturing two-dimensional array ultrasonic transducers
US6043590A (en) 1997-04-18 2000-03-28 Atl Ultrasound Composite transducer with connective backing block
JP4723732B2 (ja) * 2000-07-12 2011-07-13 セイコーインスツル株式会社 脈検出装置及び超音波診断装置
JP3449345B2 (ja) 2000-08-11 2003-09-22 株式会社村田製作所 センサアレイおよび送受信装置
JP4562106B2 (ja) * 2000-11-27 2010-10-13 セイコーインスツル株式会社 超音波診断装置
KR100684677B1 (ko) 2002-06-05 2007-02-23 야마이치덴키 가부시키가이샤 프로브 유닛 및 그 제조 방법
US7280435B2 (en) 2003-03-06 2007-10-09 General Electric Company Switching circuitry for reconfigurable arrays of sensor elements
JP4261298B2 (ja) 2003-09-19 2009-04-30 富士フイルム株式会社 積層構造体アレイ及びその製造方法、並びに、超音波トランスデューサアレイの製造方法
GB2430259B (en) 2004-01-08 2007-07-25 Schlumberger Holdings Integrated Acoustic Transducer Assembly
JP2005342337A (ja) * 2004-06-04 2005-12-15 Matsushita Electric Ind Co Ltd 超音波探触子
KR20070083514A (ko) 2004-07-28 2007-08-24 에스브이 프로브 피티이 엘티디 동일 평면상에 있는 접착 패드를 기판에 형성하는 방법과장치
US7459795B2 (en) 2004-08-19 2008-12-02 Formfactor, Inc. Method to build a wirebond probe card in a many at a time fashion
US20070152685A1 (en) 2006-01-03 2007-07-05 Formfactor, Inc. A probe array structure and a method of making a probe array structure
JP5038808B2 (ja) * 2007-08-02 2012-10-03 株式会社東芝 超音波トランスデューサおよび超音波トランスデューサを備えた超音波プローブ
US8815653B2 (en) * 2007-12-03 2014-08-26 Kolo Technologies, Inc. Packaging and connecting electrostatic transducer arrays
KR100967024B1 (ko) 2008-04-14 2010-06-30 삼성전기주식회사 프로브 기판 제조 방법
KR100996150B1 (ko) 2008-05-23 2010-11-24 주식회사 엠아이티 프로브핀의 정열판과 통전판 및 그의 기판 제조방법
JP2010022931A (ja) 2008-07-18 2010-02-04 Fujifilm Corp 接着剤はみ出し防止構造を有する超音波探触子
KR101137262B1 (ko) 2009-03-18 2012-04-20 삼성메디슨 주식회사 초음파 진단장치용 프로브 및 그 제조방법
US8345508B2 (en) 2009-09-20 2013-01-01 General Electric Company Large area modular sensor array assembly and method for making the same
JP5462735B2 (ja) 2010-07-01 2014-04-02 日立アロカメディカル株式会社 超音波探触子の製造方法、および、超音波探触子
US20120029393A1 (en) * 2010-07-30 2012-02-02 General Electric Company Compact ultrasound transducer assembly and methods of making and using the same
US8776335B2 (en) 2010-11-17 2014-07-15 General Electric Company Methods of fabricating ultrasonic transducer assemblies
KR101354603B1 (ko) 2012-01-02 2014-01-23 삼성메디슨 주식회사 초음파 프로브 및 그 제조방법

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