JP2013527590A5 - - Google Patents

Download PDF

Info

Publication number
JP2013527590A5
JP2013527590A5 JP2012518063A JP2012518063A JP2013527590A5 JP 2013527590 A5 JP2013527590 A5 JP 2013527590A5 JP 2012518063 A JP2012518063 A JP 2012518063A JP 2012518063 A JP2012518063 A JP 2012518063A JP 2013527590 A5 JP2013527590 A5 JP 2013527590A5
Authority
JP
Japan
Prior art keywords
steps
electrostatic
converting
fixing
electrostatic chuck
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012518063A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013527590A (ja
JP5646618B2 (ja
Filing date
Publication date
Priority claimed from PCT/EP2010/058373 external-priority patent/WO2011000689A1/en
Application filed filed Critical
Publication of JP2013527590A publication Critical patent/JP2013527590A/ja
Publication of JP2013527590A5 publication Critical patent/JP2013527590A5/ja
Application granted granted Critical
Publication of JP5646618B2 publication Critical patent/JP5646618B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2012518063A 2009-06-30 2010-07-19 像補正をするアドレス可能な静電チャックシステム Active JP5646618B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US22185709P 2009-06-30 2009-06-30
PCT/EP2010/058373 WO2011000689A1 (en) 2009-06-30 2010-06-15 Image-compensating addressable electrostatic chuck system

Publications (3)

Publication Number Publication Date
JP2013527590A JP2013527590A (ja) 2013-06-27
JP2013527590A5 true JP2013527590A5 (enExample) 2013-10-31
JP5646618B2 JP5646618B2 (ja) 2014-12-24

Family

ID=42670562

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012518063A Active JP5646618B2 (ja) 2009-06-30 2010-07-19 像補正をするアドレス可能な静電チャックシステム

Country Status (7)

Country Link
US (1) US8477472B2 (enExample)
JP (1) JP5646618B2 (enExample)
KR (1) KR101407477B1 (enExample)
CN (1) CN102473669B (enExample)
NL (1) NL2004890A (enExample)
TW (1) TWI420256B (enExample)
WO (1) WO2011000689A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2490143B (en) * 2011-04-20 2013-03-13 Rolls Royce Plc Method of manufacturing a component
JP2014167963A (ja) * 2013-02-28 2014-09-11 Toshiba Corp 静電チャック、レチクル、および静電チャック方法
US9472410B2 (en) * 2014-03-05 2016-10-18 Applied Materials, Inc. Pixelated capacitance controlled ESC
US11532497B2 (en) * 2016-06-07 2022-12-20 Applied Materials, Inc. High power electrostatic chuck design with radio frequency coupling
JP2018046179A (ja) * 2016-09-15 2018-03-22 株式会社東芝 静電チャック及び半導体製造装置
KR102584518B1 (ko) * 2018-07-04 2023-10-05 삼성디스플레이 주식회사 정전척 유닛 및 그것을 이용한 박막 증착 장치
TR201905624A2 (tr) * 2019-04-16 2019-07-22 Hidropar Hareket Kontrol Teknolojileri Merkezi Sanayi Ve Ticaret Anonim Sirketi İki cisim arasında kontrol edilebilir elektrostatik çekim kuvveti oluşturulması ve bu çekim kuvveti yardımı ile yapışma sağlanması yöntemi.
EP3809204A1 (en) 2019-10-18 2021-04-21 ASML Netherlands B.V. Patterning device conditioning system and method
TW202243107A (zh) * 2021-03-18 2022-11-01 荷蘭商Ａｓｍｌ荷蘭公司 用於經改良疊對之夾具電極修改
WO2024156457A1 (en) * 2023-01-27 2024-08-02 Asml Netherlands B.V. Progressively energized electrostatic clamp for a lithography apparatus

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04336928A (ja) * 1991-05-14 1992-11-25 Toto Ltd 圧電ステージ
US5880923A (en) * 1997-06-09 1999-03-09 Applied Materials Inc. Method and apparatus for improved retention of a semiconductor wafer within a semiconductor wafer processing system
WO2002011184A1 (de) * 2000-08-02 2002-02-07 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. Mobiler halter für einen wafer
US6493867B1 (en) * 2000-08-08 2002-12-10 Ball Semiconductor, Inc. Digital photolithography system for making smooth diagonal components
WO2002042825A1 (en) * 2000-11-22 2002-05-30 Ball Semiconductor, Inc. Light modulation device and system
US6433917B1 (en) * 2000-11-22 2002-08-13 Ball Semiconductor, Inc. Light modulation device and system
US6897940B2 (en) * 2002-06-21 2005-05-24 Nikon Corporation System for correcting aberrations and distortions in EUV lithography
US7199994B1 (en) * 2004-01-12 2007-04-03 Advanced Micro Devices Inc. Method and system for flattening a reticle within a lithography system
DE102004010002B4 (de) * 2004-03-01 2007-10-31 Infineon Technologies Ag Maskenhalter zum Halten einer lithografischen Reflexionsmaske und Verfahren
JP4684222B2 (ja) * 2004-03-19 2011-05-18 株式会社クリエイティブ テクノロジー 双極型静電チャック
KR100994299B1 (ko) * 2005-12-06 2010-11-12 가부시키가이샤 크리에이티브 테크놀러지 정전척용 전극 시트 및 정전척
US20090068765A1 (en) * 2006-03-08 2009-03-12 Kenichi Murooka Method of manufacturing semiconductor device and apparatus for manufacturing semiconductor device
JP2007242893A (ja) * 2006-03-08 2007-09-20 Toshiba Corp パターン転写方法およびパターン転写装置
US7576832B2 (en) * 2006-05-04 2009-08-18 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2007319958A (ja) * 2006-05-31 2007-12-13 Tomoegawa Paper Co Ltd 静電チャック部材および静電チャック装置
NL1036511A1 (nl) * 2008-02-13 2009-08-14 Asml Netherlands Bv Movable support, position control system, lithographic apparatus and method of controlling a position of an exchangeable object.

Similar Documents

Publication Publication Date Title
JP2013527590A5 (enExample)
EP2741332A3 (en) Array substrate and method of fabricating the same
GB2505600A (en) Micro-electro-mechanical system (MEMS) and related actuator bumps method of manufacture and design structures
JP2010217916A5 (enExample)
EP2911206A3 (en) Solar cell module and method for manufacturing the same
JP2011238942A5 (enExample)
JP2011216780A5 (enExample)
EP2677523A3 (en) Method of manufacturing thick-film electrode
MY162679A (en) Thin silicon solar cell and method of manufacture
EP2437302A3 (en) Photoelectric converter, method of manufacturing photoelectric converter and imaging device
JP2013005803A5 (enExample)
ATE542234T1 (de) Verfahren zur herstellung einer vorrichtung mit mehrstrahlen-ablenkanordnung mit elektroden
WO2010032933A3 (en) Solar cell and texturing method thereof
WO2009023305A3 (en) Method and system for printing aligned nanowires and other electrical devices
JP2010530630A5 (enExample)
EP2403024A3 (en) Adhesion layer between electrode and insulating layer for a semiconductor element and corresponding fabrication method
EP2717137A3 (en) Touch screen panel
FR2928036B1 (fr) Procede de fabrication d'une electrode a base de silicium, electrode a base de silicium et batterie au lithium comprenant une telle electrode
JP2012009414A5 (ja) 電極
EP2704216A3 (en) Flexible semiconductor devices and methods of manufacturing the same
EP2290718A3 (en) Apparatus for generating electrical energy and method for manufacturing the same
EP2348547A3 (en) Light emitting device, method of manufacturing the same, light emitting device package and lighting system
WO2012002769A3 (ko) 섬유상의 구조체들을 포함하는 전극 조립체
EP2613359A3 (en) Thin film solar cell
WO2011119001A3 (ko) 태양광 발전장치 및 이의 제조방법