KR101407477B1 - 이미지-보상 어드레서블 정전 척 시스템 - Google Patents

이미지-보상 어드레서블 정전 척 시스템 Download PDF

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KR101407477B1
KR101407477B1 KR1020127002327A KR20127002327A KR101407477B1 KR 101407477 B1 KR101407477 B1 KR 101407477B1 KR 1020127002327 A KR1020127002327 A KR 1020127002327A KR 20127002327 A KR20127002327 A KR 20127002327A KR 101407477 B1 KR101407477 B1 KR 101407477B1
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South Korea
Prior art keywords
electrodes
electrostatic
substrate
compensating
chuck
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English (en)
Korean (ko)
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KR20120108960A (ko
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매튜 한센
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에이에스엠엘 홀딩 엔.브이.
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/703—Non-planar pattern areas or non-planar masks, e.g. curved masks or substrates
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020127002327A 2009-06-30 2010-07-19 이미지-보상 어드레서블 정전 척 시스템 Active KR101407477B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US22185709P 2009-06-30 2009-06-30
PCT/EP2010/058373 WO2011000689A1 (en) 2009-06-30 2010-06-15 Image-compensating addressable electrostatic chuck system

Publications (2)

Publication Number Publication Date
KR20120108960A KR20120108960A (ko) 2012-10-05
KR101407477B1 true KR101407477B1 (ko) 2014-06-16

Family

ID=42670562

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127002327A Active KR101407477B1 (ko) 2009-06-30 2010-07-19 이미지-보상 어드레서블 정전 척 시스템

Country Status (7)

Country Link
US (1) US8477472B2 (enExample)
JP (1) JP5646618B2 (enExample)
KR (1) KR101407477B1 (enExample)
CN (1) CN102473669B (enExample)
NL (1) NL2004890A (enExample)
TW (1) TWI420256B (enExample)
WO (1) WO2011000689A1 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2490143B (en) * 2011-04-20 2013-03-13 Rolls Royce Plc Method of manufacturing a component
JP2014167963A (ja) * 2013-02-28 2014-09-11 Toshiba Corp 静電チャック、レチクル、および静電チャック方法
US9472410B2 (en) * 2014-03-05 2016-10-18 Applied Materials, Inc. Pixelated capacitance controlled ESC
US11532497B2 (en) * 2016-06-07 2022-12-20 Applied Materials, Inc. High power electrostatic chuck design with radio frequency coupling
JP2018046179A (ja) * 2016-09-15 2018-03-22 株式会社東芝 静電チャック及び半導体製造装置
KR102584518B1 (ko) * 2018-07-04 2023-10-05 삼성디스플레이 주식회사 정전척 유닛 및 그것을 이용한 박막 증착 장치
TR201905624A2 (tr) * 2019-04-16 2019-07-22 Hidropar Hareket Kontrol Teknolojileri Merkezi Sanayi Ve Ticaret Anonim Sirketi İki cisim arasında kontrol edilebilir elektrostatik çekim kuvveti oluşturulması ve bu çekim kuvveti yardımı ile yapışma sağlanması yöntemi.
EP3809204A1 (en) 2019-10-18 2021-04-21 ASML Netherlands B.V. Patterning device conditioning system and method
TW202243107A (zh) * 2021-03-18 2022-11-01 荷蘭商Ａｓｍｌ荷蘭公司 用於經改良疊對之夾具電極修改
WO2024156457A1 (en) * 2023-01-27 2024-08-02 Asml Netherlands B.V. Progressively energized electrostatic clamp for a lithography apparatus

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1376238A2 (en) * 2002-06-21 2004-01-02 Nikon Corporation A system for correcting aberration and distortion in EUV litography
DE102004010002A1 (de) * 2004-03-01 2005-09-29 Infineon Technologies Ag Maskenhalter zum Halten einer lithografischen Maske und Verfahren
JP2007319958A (ja) * 2006-05-31 2007-12-13 Tomoegawa Paper Co Ltd 静電チャック部材および静電チャック装置
KR20090087834A (ko) * 2008-02-13 2009-08-18 에이에스엠엘 네델란즈 비.브이. 이동가능한 지지체, 위치 제어 시스템, 리소그래피 장치 및교환가능한 대상물의 위치를 제어하는 방법

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JPH04336928A (ja) * 1991-05-14 1992-11-25 Toto Ltd 圧電ステージ
US5880923A (en) * 1997-06-09 1999-03-09 Applied Materials Inc. Method and apparatus for improved retention of a semiconductor wafer within a semiconductor wafer processing system
WO2002011184A1 (de) * 2000-08-02 2002-02-07 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. Mobiler halter für einen wafer
US6493867B1 (en) * 2000-08-08 2002-12-10 Ball Semiconductor, Inc. Digital photolithography system for making smooth diagonal components
WO2002042825A1 (en) * 2000-11-22 2002-05-30 Ball Semiconductor, Inc. Light modulation device and system
US6433917B1 (en) * 2000-11-22 2002-08-13 Ball Semiconductor, Inc. Light modulation device and system
US7199994B1 (en) * 2004-01-12 2007-04-03 Advanced Micro Devices Inc. Method and system for flattening a reticle within a lithography system
JP4684222B2 (ja) * 2004-03-19 2011-05-18 株式会社クリエイティブ テクノロジー 双極型静電チャック
KR100994299B1 (ko) * 2005-12-06 2010-11-12 가부시키가이샤 크리에이티브 테크놀러지 정전척용 전극 시트 및 정전척
US20090068765A1 (en) * 2006-03-08 2009-03-12 Kenichi Murooka Method of manufacturing semiconductor device and apparatus for manufacturing semiconductor device
JP2007242893A (ja) * 2006-03-08 2007-09-20 Toshiba Corp パターン転写方法およびパターン転写装置
US7576832B2 (en) * 2006-05-04 2009-08-18 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1376238A2 (en) * 2002-06-21 2004-01-02 Nikon Corporation A system for correcting aberration and distortion in EUV litography
DE102004010002A1 (de) * 2004-03-01 2005-09-29 Infineon Technologies Ag Maskenhalter zum Halten einer lithografischen Maske und Verfahren
JP2007319958A (ja) * 2006-05-31 2007-12-13 Tomoegawa Paper Co Ltd 静電チャック部材および静電チャック装置
KR20090087834A (ko) * 2008-02-13 2009-08-18 에이에스엠엘 네델란즈 비.브이. 이동가능한 지지체, 위치 제어 시스템, 리소그래피 장치 및교환가능한 대상물의 위치를 제어하는 방법

Also Published As

Publication number Publication date
CN102473669A (zh) 2012-05-23
US8477472B2 (en) 2013-07-02
WO2011000689A1 (en) 2011-01-06
KR20120108960A (ko) 2012-10-05
US20120087058A1 (en) 2012-04-12
JP2013527590A (ja) 2013-06-27
TW201120582A (en) 2011-06-16
TWI420256B (zh) 2013-12-21
CN102473669B (zh) 2015-07-15
JP5646618B2 (ja) 2014-12-24
NL2004890A (en) 2011-01-04

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