NL2004890A - Image-compensating addressable electrostatic chuck system. - Google Patents
Image-compensating addressable electrostatic chuck system. Download PDFInfo
- Publication number
- NL2004890A NL2004890A NL2004890A NL2004890A NL2004890A NL 2004890 A NL2004890 A NL 2004890A NL 2004890 A NL2004890 A NL 2004890A NL 2004890 A NL2004890 A NL 2004890A NL 2004890 A NL2004890 A NL 2004890A
- Authority
- NL
- Netherlands
- Prior art keywords
- electrostatic
- electrodes
- image
- substrate
- chuck
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims description 110
- 230000005855 radiation Effects 0.000 claims description 84
- 238000000059 patterning Methods 0.000 claims description 38
- 238000001459 lithography Methods 0.000 claims description 8
- 239000011159 matrix material Substances 0.000 description 57
- 238000000034 method Methods 0.000 description 47
- 230000003287 optical effect Effects 0.000 description 35
- 239000010410 layer Substances 0.000 description 27
- 230000005686 electrostatic field Effects 0.000 description 25
- 238000005286 illumination Methods 0.000 description 17
- 238000004519 manufacturing process Methods 0.000 description 16
- 238000003384 imaging method Methods 0.000 description 15
- 238000013441 quality evaluation Methods 0.000 description 15
- 235000012431 wafers Nutrition 0.000 description 14
- 201000009310 astigmatism Diseases 0.000 description 8
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- 239000000356 contaminant Substances 0.000 description 2
- 230000001186 cumulative effect Effects 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 238000001900 extreme ultraviolet lithography Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000000670 limiting effect Effects 0.000 description 2
- 230000015654 memory Effects 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 238000012634 optical imaging Methods 0.000 description 2
- 230000010363 phase shift Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- -1 Li vapor Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
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- 239000003989 dielectric material Substances 0.000 description 1
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/703—Non-planar pattern areas or non-planar masks, e.g. curved masks or substrates
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
- G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Jigs For Machine Tools (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US22185709P | 2009-06-30 | 2009-06-30 | |
| US22185709 | 2009-06-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL2004890A true NL2004890A (en) | 2011-01-04 |
Family
ID=42670562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL2004890A NL2004890A (en) | 2009-06-30 | 2010-06-15 | Image-compensating addressable electrostatic chuck system. |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8477472B2 (enExample) |
| JP (1) | JP5646618B2 (enExample) |
| KR (1) | KR101407477B1 (enExample) |
| CN (1) | CN102473669B (enExample) |
| NL (1) | NL2004890A (enExample) |
| TW (1) | TWI420256B (enExample) |
| WO (1) | WO2011000689A1 (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2490143B (en) * | 2011-04-20 | 2013-03-13 | Rolls Royce Plc | Method of manufacturing a component |
| JP2014167963A (ja) * | 2013-02-28 | 2014-09-11 | Toshiba Corp | 静電チャック、レチクル、および静電チャック方法 |
| US9472410B2 (en) * | 2014-03-05 | 2016-10-18 | Applied Materials, Inc. | Pixelated capacitance controlled ESC |
| US11532497B2 (en) * | 2016-06-07 | 2022-12-20 | Applied Materials, Inc. | High power electrostatic chuck design with radio frequency coupling |
| JP2018046179A (ja) * | 2016-09-15 | 2018-03-22 | 株式会社東芝 | 静電チャック及び半導体製造装置 |
| KR102584518B1 (ko) * | 2018-07-04 | 2023-10-05 | 삼성디스플레이 주식회사 | 정전척 유닛 및 그것을 이용한 박막 증착 장치 |
| TR201905624A2 (tr) * | 2019-04-16 | 2019-07-22 | Hidropar Hareket Kontrol Teknolojileri Merkezi Sanayi Ve Ticaret Anonim Sirketi | İki cisim arasında kontrol edilebilir elektrostatik çekim kuvveti oluşturulması ve bu çekim kuvveti yardımı ile yapışma sağlanması yöntemi. |
| EP3809204A1 (en) | 2019-10-18 | 2021-04-21 | ASML Netherlands B.V. | Patterning device conditioning system and method |
| TW202243107A (zh) * | 2021-03-18 | 2022-11-01 | 荷蘭商Ａｓｍｌ荷蘭公司 | 用於經改良疊對之夾具電極修改 |
| WO2024156457A1 (en) * | 2023-01-27 | 2024-08-02 | Asml Netherlands B.V. | Progressively energized electrostatic clamp for a lithography apparatus |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04336928A (ja) * | 1991-05-14 | 1992-11-25 | Toto Ltd | 圧電ステージ |
| US5880923A (en) * | 1997-06-09 | 1999-03-09 | Applied Materials Inc. | Method and apparatus for improved retention of a semiconductor wafer within a semiconductor wafer processing system |
| WO2002011184A1 (de) * | 2000-08-02 | 2002-02-07 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. | Mobiler halter für einen wafer |
| US6493867B1 (en) * | 2000-08-08 | 2002-12-10 | Ball Semiconductor, Inc. | Digital photolithography system for making smooth diagonal components |
| WO2002042825A1 (en) * | 2000-11-22 | 2002-05-30 | Ball Semiconductor, Inc. | Light modulation device and system |
| US6433917B1 (en) * | 2000-11-22 | 2002-08-13 | Ball Semiconductor, Inc. | Light modulation device and system |
| US6897940B2 (en) * | 2002-06-21 | 2005-05-24 | Nikon Corporation | System for correcting aberrations and distortions in EUV lithography |
| US7199994B1 (en) * | 2004-01-12 | 2007-04-03 | Advanced Micro Devices Inc. | Method and system for flattening a reticle within a lithography system |
| DE102004010002B4 (de) * | 2004-03-01 | 2007-10-31 | Infineon Technologies Ag | Maskenhalter zum Halten einer lithografischen Reflexionsmaske und Verfahren |
| JP4684222B2 (ja) * | 2004-03-19 | 2011-05-18 | 株式会社クリエイティブ テクノロジー | 双極型静電チャック |
| KR100994299B1 (ko) * | 2005-12-06 | 2010-11-12 | 가부시키가이샤 크리에이티브 테크놀러지 | 정전척용 전극 시트 및 정전척 |
| US20090068765A1 (en) * | 2006-03-08 | 2009-03-12 | Kenichi Murooka | Method of manufacturing semiconductor device and apparatus for manufacturing semiconductor device |
| JP2007242893A (ja) * | 2006-03-08 | 2007-09-20 | Toshiba Corp | パターン転写方法およびパターン転写装置 |
| US7576832B2 (en) * | 2006-05-04 | 2009-08-18 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| JP2007319958A (ja) * | 2006-05-31 | 2007-12-13 | Tomoegawa Paper Co Ltd | 静電チャック部材および静電チャック装置 |
| NL1036511A1 (nl) * | 2008-02-13 | 2009-08-14 | Asml Netherlands Bv | Movable support, position control system, lithographic apparatus and method of controlling a position of an exchangeable object. |
-
2010
- 2010-06-15 NL NL2004890A patent/NL2004890A/en not_active Application Discontinuation
- 2010-06-15 CN CN201080029054.0A patent/CN102473669B/zh active Active
- 2010-06-15 WO PCT/EP2010/058373 patent/WO2011000689A1/en not_active Ceased
- 2010-06-15 US US13/321,751 patent/US8477472B2/en active Active
- 2010-06-28 TW TW099121111A patent/TWI420256B/zh active
- 2010-07-19 JP JP2012518063A patent/JP5646618B2/ja active Active
- 2010-07-19 KR KR1020127002327A patent/KR101407477B1/ko active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN102473669A (zh) | 2012-05-23 |
| US8477472B2 (en) | 2013-07-02 |
| WO2011000689A1 (en) | 2011-01-06 |
| KR20120108960A (ko) | 2012-10-05 |
| US20120087058A1 (en) | 2012-04-12 |
| JP2013527590A (ja) | 2013-06-27 |
| TW201120582A (en) | 2011-06-16 |
| TWI420256B (zh) | 2013-12-21 |
| CN102473669B (zh) | 2015-07-15 |
| KR101407477B1 (ko) | 2014-06-16 |
| JP5646618B2 (ja) | 2014-12-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WDAP | Patent application withdrawn |
Effective date: 20110221 |