KR101378012B1 - 멀티 어레이형 초음파 프로브 장치 및 멀티 어레이형 초음파 프로브 장치의 제조 방법 - Google Patents

멀티 어레이형 초음파 프로브 장치 및 멀티 어레이형 초음파 프로브 장치의 제조 방법 Download PDF

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KR101378012B1
KR101378012B1 KR1020120026098A KR20120026098A KR101378012B1 KR 101378012 B1 KR101378012 B1 KR 101378012B1 KR 1020120026098 A KR1020120026098 A KR 1020120026098A KR 20120026098 A KR20120026098 A KR 20120026098A KR 101378012 B1 KR101378012 B1 KR 101378012B1
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South Korea
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substrate
ultrasonic probe
probe device
tile
seating
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Korean (ko)
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KR20130104531A (ko
Inventor
김영일
김동욱
김배형
송종근
이승헌
조경일
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삼성전자주식회사
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Priority to KR1020120026098A priority Critical patent/KR101378012B1/ko
Priority to US13/741,907 priority patent/US9071893B2/en
Priority to CN201310077389.5A priority patent/CN103300882B/zh
Priority to JP2013049912A priority patent/JP5666640B2/ja
Priority to EP13159231.3A priority patent/EP2639789B1/en
Publication of KR20130104531A publication Critical patent/KR20130104531A/ko
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22Details, e.g. general constructional or apparatus details
    • G01N29/24Probes
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00Diagnosis using ultrasonic, sonic or infrasonic waves
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B06GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06BMETHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0292Electrostatic transducers, e.g. electret-type
    • GPHYSICS
    • G10MUSICAL INSTRUMENTS; ACOUSTICS
    • G10KSOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K11/00Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/004Mounting transducers, e.g. provided with mechanical moving or orienting device
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49005Acoustic transducer

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Mechanical Engineering (AREA)
  • Pathology (AREA)
  • General Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Biomedical Technology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Immunology (AREA)
  • Chemical & Material Sciences (AREA)
  • Biochemistry (AREA)
  • Biophysics (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Radiology & Medical Imaging (AREA)
  • Analytical Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Medical Informatics (AREA)
  • Molecular Biology (AREA)
  • Surgery (AREA)
  • Animal Behavior & Ethology (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
KR1020120026098A 2012-03-14 2012-03-14 멀티 어레이형 초음파 프로브 장치 및 멀티 어레이형 초음파 프로브 장치의 제조 방법 Active KR101378012B1 (ko)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020120026098A KR101378012B1 (ko) 2012-03-14 2012-03-14 멀티 어레이형 초음파 프로브 장치 및 멀티 어레이형 초음파 프로브 장치의 제조 방법
US13/741,907 US9071893B2 (en) 2012-03-14 2013-01-15 Multi-array ultrasonic probe apparatus and method for manufacturing multi-array probe apparatus
CN201310077389.5A CN103300882B (zh) 2012-03-14 2013-03-12 多阵列超声波探头设备及其制造方法和装置
JP2013049912A JP5666640B2 (ja) 2012-03-14 2013-03-13 マルチアレイ超音波プローブ装置及びその製造方法
EP13159231.3A EP2639789B1 (en) 2012-03-14 2013-03-14 Multi-array ultrasonic probe apparatus and method for manufacturing multi-array probe apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020120026098A KR101378012B1 (ko) 2012-03-14 2012-03-14 멀티 어레이형 초음파 프로브 장치 및 멀티 어레이형 초음파 프로브 장치의 제조 방법

Publications (2)

Publication Number Publication Date
KR20130104531A KR20130104531A (ko) 2013-09-25
KR101378012B1 true KR101378012B1 (ko) 2014-03-24

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KR1020120026098A Active KR101378012B1 (ko) 2012-03-14 2012-03-14 멀티 어레이형 초음파 프로브 장치 및 멀티 어레이형 초음파 프로브 장치의 제조 방법

Country Status (5)

Country Link
US (1) US9071893B2 (enExample)
EP (1) EP2639789B1 (enExample)
JP (1) JP5666640B2 (enExample)
KR (1) KR101378012B1 (enExample)
CN (1) CN103300882B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220135909A (ko) * 2021-03-31 2022-10-07 국방과학연구소 압전단결정 복합체 음향센서 및 이를 포함하는 배열 음향센서

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108348217B (zh) * 2015-11-02 2021-07-20 皇家飞利浦有限公司 超声换能器阵列、探头和系统
CN109310882B (zh) * 2016-06-09 2021-02-26 皇家飞利浦有限公司 超声探头、超声系统和用于产生超声图像的方法
JP6712917B2 (ja) * 2016-07-14 2020-06-24 株式会社日立製作所 半導体センサチップアレイ、および超音波診断装置
US11744553B2 (en) * 2016-09-29 2023-09-05 Koninklijke Philips N.V. Ultrasound system, method and computer program product
KR101915255B1 (ko) * 2017-01-11 2018-11-05 삼성메디슨 주식회사 초음파 프로브의 제조 방법 및 그 초음파 프로브
WO2021142554A1 (en) * 2020-01-17 2021-07-22 The University Of British Columbia Flexible capacitive micromachined ultrasonic transducer arrays

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002058098A (ja) 2000-08-11 2002-02-22 Murata Mfg Co Ltd センサアレイおよび送受信装置
JP2008518553A (ja) 2004-10-29 2008-05-29 ゼネラル・エレクトリック・カンパニイ センサ素子の再構成可能なアレイのためのスイッチング回路
JP2012015851A (ja) 2010-07-01 2012-01-19 Hitachi Aloka Medical Ltd 超音波探触子の製造方法、および、超音波探触子

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE87767T1 (de) * 1989-11-09 1993-04-15 Contraves Ag Verfahren zur herstellung von hybridschaltungen mit einem array aus gleichen elektronischen elementen.
JP3131485B2 (ja) 1992-02-04 2001-01-31 オリンパス光学工業株式会社 超音波プローブ
JP3535204B2 (ja) 1994-02-28 2004-06-07 株式会社東芝 超音波プローブ及びその製造方法
US5655276A (en) 1995-02-06 1997-08-12 General Electric Company Method of manufacturing two-dimensional array ultrasonic transducers
US6043590A (en) 1997-04-18 2000-03-28 Atl Ultrasound Composite transducer with connective backing block
JP4723732B2 (ja) * 2000-07-12 2011-07-13 セイコーインスツル株式会社 脈検出装置及び超音波診断装置
JP4562106B2 (ja) * 2000-11-27 2010-10-13 セイコーインスツル株式会社 超音波診断装置
KR100684677B1 (ko) 2002-06-05 2007-02-23 야마이치덴키 가부시키가이샤 프로브 유닛 및 그 제조 방법
JP4261298B2 (ja) 2003-09-19 2009-04-30 富士フイルム株式会社 積層構造体アレイ及びその製造方法、並びに、超音波トランスデューサアレイの製造方法
GB2430259B (en) 2004-01-08 2007-07-25 Schlumberger Holdings Integrated Acoustic Transducer Assembly
JP2005342337A (ja) * 2004-06-04 2005-12-15 Matsushita Electric Ind Co Ltd 超音波探触子
KR20070083514A (ko) 2004-07-28 2007-08-24 에스브이 프로브 피티이 엘티디 동일 평면상에 있는 접착 패드를 기판에 형성하는 방법과장치
US7459795B2 (en) 2004-08-19 2008-12-02 Formfactor, Inc. Method to build a wirebond probe card in a many at a time fashion
US20070152685A1 (en) 2006-01-03 2007-07-05 Formfactor, Inc. A probe array structure and a method of making a probe array structure
JP5038808B2 (ja) * 2007-08-02 2012-10-03 株式会社東芝 超音波トランスデューサおよび超音波トランスデューサを備えた超音波プローブ
US8815653B2 (en) * 2007-12-03 2014-08-26 Kolo Technologies, Inc. Packaging and connecting electrostatic transducer arrays
KR100967024B1 (ko) 2008-04-14 2010-06-30 삼성전기주식회사 프로브 기판 제조 방법
KR100996150B1 (ko) 2008-05-23 2010-11-24 주식회사 엠아이티 프로브핀의 정열판과 통전판 및 그의 기판 제조방법
JP2010022931A (ja) 2008-07-18 2010-02-04 Fujifilm Corp 接着剤はみ出し防止構造を有する超音波探触子
KR101137262B1 (ko) 2009-03-18 2012-04-20 삼성메디슨 주식회사 초음파 진단장치용 프로브 및 그 제조방법
US8345508B2 (en) 2009-09-20 2013-01-01 General Electric Company Large area modular sensor array assembly and method for making the same
US20120029393A1 (en) * 2010-07-30 2012-02-02 General Electric Company Compact ultrasound transducer assembly and methods of making and using the same
US8776335B2 (en) 2010-11-17 2014-07-15 General Electric Company Methods of fabricating ultrasonic transducer assemblies
KR101354603B1 (ko) 2012-01-02 2014-01-23 삼성메디슨 주식회사 초음파 프로브 및 그 제조방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002058098A (ja) 2000-08-11 2002-02-22 Murata Mfg Co Ltd センサアレイおよび送受信装置
JP2008518553A (ja) 2004-10-29 2008-05-29 ゼネラル・エレクトリック・カンパニイ センサ素子の再構成可能なアレイのためのスイッチング回路
JP2012015851A (ja) 2010-07-01 2012-01-19 Hitachi Aloka Medical Ltd 超音波探触子の製造方法、および、超音波探触子

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220135909A (ko) * 2021-03-31 2022-10-07 국방과학연구소 압전단결정 복합체 음향센서 및 이를 포함하는 배열 음향센서
KR102492901B1 (ko) 2021-03-31 2023-01-30 국방과학연구소 압전단결정 복합체 음향센서 및 이를 포함하는 배열 음향센서

Also Published As

Publication number Publication date
US9071893B2 (en) 2015-06-30
KR20130104531A (ko) 2013-09-25
US20130242705A1 (en) 2013-09-19
EP2639789A2 (en) 2013-09-18
JP2013192228A (ja) 2013-09-26
JP5666640B2 (ja) 2015-02-12
EP2639789A3 (en) 2014-02-26
CN103300882B (zh) 2016-03-30
CN103300882A (zh) 2013-09-18
EP2639789B1 (en) 2016-06-08

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