JP2016537883A5 - - Google Patents

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Publication number
JP2016537883A5
JP2016537883A5 JP2016528234A JP2016528234A JP2016537883A5 JP 2016537883 A5 JP2016537883 A5 JP 2016537883A5 JP 2016528234 A JP2016528234 A JP 2016528234A JP 2016528234 A JP2016528234 A JP 2016528234A JP 2016537883 A5 JP2016537883 A5 JP 2016537883A5
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JP
Japan
Prior art keywords
interconnect
integrated circuit
layers
array
ultrasonic transducer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016528234A
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English (en)
Japanese (ja)
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JP6266106B2 (ja
JP2016537883A (ja
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Publication date
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Priority claimed from PCT/IB2014/065675 external-priority patent/WO2015068080A1/en
Publication of JP2016537883A publication Critical patent/JP2016537883A/ja
Publication of JP2016537883A5 publication Critical patent/JP2016537883A5/ja
Application granted granted Critical
Publication of JP6266106B2 publication Critical patent/JP6266106B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2016528234A 2013-11-11 2014-10-29 保護された集積回路相互接続を有するロバストな超音波トランスデューサプローブ Active JP6266106B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361902313P 2013-11-11 2013-11-11
US61/902,313 2013-11-11
PCT/IB2014/065675 WO2015068080A1 (en) 2013-11-11 2014-10-29 Robust ultrasound transducer probes having protected integrated circuit interconnects

Publications (3)

Publication Number Publication Date
JP2016537883A JP2016537883A (ja) 2016-12-01
JP2016537883A5 true JP2016537883A5 (enExample) 2017-12-07
JP6266106B2 JP6266106B2 (ja) 2018-01-24

Family

ID=52023564

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016528234A Active JP6266106B2 (ja) 2013-11-11 2014-10-29 保護された集積回路相互接続を有するロバストな超音波トランスデューサプローブ

Country Status (5)

Country Link
US (1) US11231491B2 (enExample)
EP (1) EP3069391B1 (enExample)
JP (1) JP6266106B2 (enExample)
CN (1) CN105723532B (enExample)
WO (1) WO2015068080A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102373132B1 (ko) * 2014-12-26 2022-03-11 삼성메디슨 주식회사 초음파 프로브 장치 및 초음파 촬영 장치
WO2017045646A1 (en) * 2015-09-20 2017-03-23 Chen Chieh Hsiao Surgical cannula
WO2017143307A1 (en) * 2016-02-18 2017-08-24 University Of Southern California Modular piezoelectric sensor array with co-integrated electronics and beamforming channels
KR102803133B1 (ko) * 2017-02-23 2025-05-07 삼성메디슨 주식회사 초음파 프로브
KR20220128355A (ko) 2020-01-17 2022-09-20 썬전 샥 컴퍼니 리미티드 마이크로폰 및 그 마이크로폰을 구비하는 전자 디바이스
US11656355B2 (en) * 2020-07-15 2023-05-23 Siemens Medical Solutions Usa, Inc. Direct chip-on-array for a multidimensional transducer array
KR102866289B1 (ko) * 2023-03-20 2025-10-01 (주)클래시스 윈도우 형성이 없는 초음파 카트리지 및 이를 이용한 치료용 초음파 발생 장치
CN120714883A (zh) * 2024-03-29 2025-09-30 深圳半岛医疗集团股份有限公司 一种超声换能器及其的制备方法

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US5493541A (en) * 1994-12-30 1996-02-20 General Electric Company Ultrasonic transducer array having laser-drilled vias for electrical connection of electrodes
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US6558323B2 (en) * 2000-11-29 2003-05-06 Olympus Optical Co., Ltd. Ultrasound transducer array
US6589180B2 (en) 2001-06-20 2003-07-08 Bae Systems Information And Electronic Systems Integration, Inc Acoustical array with multilayer substrate integrated circuits
US7309948B2 (en) 2001-12-05 2007-12-18 Fujifilm Corporation Ultrasonic transducer and method of manufacturing the same
US6955941B2 (en) * 2002-03-07 2005-10-18 Micron Technology, Inc. Methods and apparatus for packaging semiconductor devices
JP4128821B2 (ja) * 2002-07-29 2008-07-30 アロカ株式会社 超音波診断装置
WO2005055195A1 (en) 2003-12-04 2005-06-16 Koninklijke Philips Electronics, N.V. Implementing ic mounted sensor with high attenuation backing
EP1789816A1 (en) 2004-08-18 2007-05-30 Koninklijke Philips Electronics N.V. Two-dimensional ultrasound transducer arrays
WO2006075283A2 (en) * 2005-01-11 2006-07-20 Koninklijke Philips Electronics, N.V. Redistribution interconnect for microbeamformer(s) and a medical ultrasound system
CN101238506A (zh) * 2005-08-08 2008-08-06 皇家飞利浦电子股份有限公司 具有聚乙烯第三匹配层的宽带矩阵换能器
US7622848B2 (en) * 2006-01-06 2009-11-24 General Electric Company Transducer assembly with z-axis interconnect
JP2008048276A (ja) * 2006-08-18 2008-02-28 Fujifilm Corp 超音波トランスデューサ及び超音波トランスデューサアレイ
US7451651B2 (en) 2006-12-11 2008-11-18 General Electric Company Modular sensor assembly and methods of fabricating the same
WO2008146205A1 (en) * 2007-06-01 2008-12-04 Koninklijke Philips Electronics, N.V. Wireless ultrasound probe cable
US9291104B2 (en) * 2007-11-21 2016-03-22 Mitsubishi Hitachi Power Systems, Ltd. Damping device and gas turbine combustor
JP5291790B2 (ja) * 2009-02-27 2013-09-18 三菱重工業株式会社 燃焼器およびこれを備えたガスタービン
US20120081994A1 (en) * 2010-10-01 2012-04-05 Vidar Anders Husom Seismic Streamer Connection Unit
WO2012085724A1 (en) 2010-12-21 2012-06-28 Koninklijke Philips Electronics N.V. Method of fabricating a flip chip electrical coupling, a flip chip electrical coupling, and a device comprising a flip chip electrical coupling
US9237880B2 (en) 2011-03-17 2016-01-19 Koninklijke Philips N.V. Composite acoustic backing with high thermal conductivity for ultrasound transducer array
EP2723506B1 (en) * 2011-06-27 2017-02-15 Koninklijke Philips N.V. Ultrasound transducer assembly and method of manufacturing the same
US8742646B2 (en) 2012-03-29 2014-06-03 General Electric Company Ultrasound acoustic assemblies and methods of manufacture
JP5907780B2 (ja) * 2012-04-02 2016-04-26 富士フイルム株式会社 超音波診断装置
EP2883079B1 (en) * 2012-08-10 2017-09-27 Maui Imaging, Inc. Calibration of multiple aperture ultrasound probes
US10555720B2 (en) * 2012-12-28 2020-02-11 Volcano Corporation Intravascular ultrasound imaging apparatus, interface, architecture, and method of manufacturing
US9510806B2 (en) * 2013-03-13 2016-12-06 Maui Imaging, Inc. Alignment of ultrasound transducer arrays and multiple aperture probe assembly
US9883848B2 (en) * 2013-09-13 2018-02-06 Maui Imaging, Inc. Ultrasound imaging using apparent point-source transmit transducer
WO2016028787A1 (en) * 2014-08-18 2016-02-25 Maui Imaging, Inc. Network-based ultrasound imaging system

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