JP2016537883A5 - - Google Patents

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Publication number
JP2016537883A5
JP2016537883A5 JP2016528234A JP2016528234A JP2016537883A5 JP 2016537883 A5 JP2016537883 A5 JP 2016537883A5 JP 2016528234 A JP2016528234 A JP 2016528234A JP 2016528234 A JP2016528234 A JP 2016528234A JP 2016537883 A5 JP2016537883 A5 JP 2016537883A5
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JP
Japan
Prior art keywords
interconnect
integrated circuit
layers
array
ultrasonic transducer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016528234A
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English (en)
Japanese (ja)
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JP2016537883A (ja
JP6266106B2 (ja
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Publication date
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Priority claimed from PCT/IB2014/065675 external-priority patent/WO2015068080A1/en
Publication of JP2016537883A publication Critical patent/JP2016537883A/ja
Publication of JP2016537883A5 publication Critical patent/JP2016537883A5/ja
Application granted granted Critical
Publication of JP6266106B2 publication Critical patent/JP6266106B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2016528234A 2013-11-11 2014-10-29 保護された集積回路相互接続を有するロバストな超音波トランスデューサプローブ Active JP6266106B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361902313P 2013-11-11 2013-11-11
US61/902,313 2013-11-11
PCT/IB2014/065675 WO2015068080A1 (en) 2013-11-11 2014-10-29 Robust ultrasound transducer probes having protected integrated circuit interconnects

Publications (3)

Publication Number Publication Date
JP2016537883A JP2016537883A (ja) 2016-12-01
JP2016537883A5 true JP2016537883A5 (enExample) 2017-12-07
JP6266106B2 JP6266106B2 (ja) 2018-01-24

Family

ID=52023564

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016528234A Active JP6266106B2 (ja) 2013-11-11 2014-10-29 保護された集積回路相互接続を有するロバストな超音波トランスデューサプローブ

Country Status (5)

Country Link
US (1) US11231491B2 (enExample)
EP (1) EP3069391B1 (enExample)
JP (1) JP6266106B2 (enExample)
CN (1) CN105723532B (enExample)
WO (1) WO2015068080A1 (enExample)

Families Citing this family (8)

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Publication number Priority date Publication date Assignee Title
KR102373132B1 (ko) * 2014-12-26 2022-03-11 삼성메디슨 주식회사 초음파 프로브 장치 및 초음파 촬영 장치
WO2017045646A1 (en) * 2015-09-20 2017-03-23 Chen Chieh Hsiao Surgical cannula
WO2017143307A1 (en) * 2016-02-18 2017-08-24 University Of Southern California Modular piezoelectric sensor array with co-integrated electronics and beamforming channels
KR102803133B1 (ko) * 2017-02-23 2025-05-07 삼성메디슨 주식회사 초음파 프로브
EP4042709A4 (en) 2020-01-17 2022-11-30 Shenzhen Shokz Co., Ltd. MICROPHONE AND ELECTRONIC DEVICE WITH IT
US11656355B2 (en) * 2020-07-15 2023-05-23 Siemens Medical Solutions Usa, Inc. Direct chip-on-array for a multidimensional transducer array
KR102866289B1 (ko) * 2023-03-20 2025-10-01 (주)클래시스 윈도우 형성이 없는 초음파 카트리지 및 이를 이용한 치료용 초음파 발생 장치
CN120714883A (zh) * 2024-03-29 2025-09-30 深圳半岛医疗集团股份有限公司 一种超声换能器及其的制备方法

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US7309948B2 (en) 2001-12-05 2007-12-18 Fujifilm Corporation Ultrasonic transducer and method of manufacturing the same
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EP1789816A1 (en) 2004-08-18 2007-05-30 Koninklijke Philips Electronics N.V. Two-dimensional ultrasound transducer arrays
JP4969456B2 (ja) * 2005-01-11 2012-07-04 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ マイクロビームフォーマ及び医用超音波システム用再配布相互接続
JP2009505468A (ja) * 2005-08-08 2009-02-05 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ ポリエチレン第三整合層を備える広帯域マトリックストランスデューサ
US7622848B2 (en) * 2006-01-06 2009-11-24 General Electric Company Transducer assembly with z-axis interconnect
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US7451651B2 (en) 2006-12-11 2008-11-18 General Electric Company Modular sensor assembly and methods of fabricating the same
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WO2012085724A1 (en) 2010-12-21 2012-06-28 Koninklijke Philips Electronics N.V. Method of fabricating a flip chip electrical coupling, a flip chip electrical coupling, and a device comprising a flip chip electrical coupling
US9237880B2 (en) * 2011-03-17 2016-01-19 Koninklijke Philips N.V. Composite acoustic backing with high thermal conductivity for ultrasound transducer array
JP6388536B2 (ja) * 2011-06-27 2018-09-12 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 超音波振動子アセンブリ及びその製造方法
US8742646B2 (en) 2012-03-29 2014-06-03 General Electric Company Ultrasound acoustic assemblies and methods of manufacture
JP5907780B2 (ja) * 2012-04-02 2016-04-26 富士フイルム株式会社 超音波診断装置
CN104620128B (zh) * 2012-08-10 2017-06-23 毛伊图像公司 多孔径超声探头的校准
EP2938265B1 (en) * 2012-12-28 2023-02-15 Philips Image Guided Therapy Corporation Intravascular ultrasound imaging apparatus
WO2014160291A1 (en) * 2013-03-13 2014-10-02 Maui Imaging, Inc. Alignment of ultrasound transducer arrays and multiple aperture probe assembly
US9883848B2 (en) * 2013-09-13 2018-02-06 Maui Imaging, Inc. Ultrasound imaging using apparent point-source transmit transducer
JP6722656B2 (ja) * 2014-08-18 2020-07-15 マウイ イマギング，インコーポレーテッド ネットワークベース超音波イメージングシステム

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