JP2013177948A - 流体制御装置 - Google Patents
流体制御装置 Download PDFInfo
- Publication number
- JP2013177948A JP2013177948A JP2012043124A JP2012043124A JP2013177948A JP 2013177948 A JP2013177948 A JP 2013177948A JP 2012043124 A JP2012043124 A JP 2012043124A JP 2012043124 A JP2012043124 A JP 2012043124A JP 2013177948 A JP2013177948 A JP 2013177948A
- Authority
- JP
- Japan
- Prior art keywords
- passage
- gas inlet
- way valve
- inlet passage
- purge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012530 fluid Substances 0.000 title claims abstract description 48
- 238000010926 purge Methods 0.000 claims abstract description 110
- 238000000034 method Methods 0.000 claims abstract description 51
- 230000008569 process Effects 0.000 claims abstract description 50
- 230000008859 change Effects 0.000 claims abstract description 13
- 239000007789 gas Substances 0.000 claims description 143
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 238000011144 upstream manufacturing Methods 0.000 description 6
- 229910052786 argon Inorganic materials 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000007634 remodeling Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K27/00—Construction of housing; Use of materials therefor
- F16K27/003—Housing formed from a plurality of the same valve elements
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45561—Gas plumbing upstream of the reaction chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/4238—With cleaner, lubrication added to fluid or liquid sealing at valve interface
- Y10T137/4245—Cleaning or steam sterilizing
- Y10T137/4259—With separate material addition
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/8593—Systems
- Y10T137/877—With flow control means for branched passages
- Y10T137/87885—Sectional block structure
Abstract
【解決手段】 複数のラインのうちの少なくとも1つQにおいて、三方弁用通路部の上側にパージライン変更用ブロック継手5が接続されている。パージライン変更用ブロック継手5は、三方弁用通路部のプロセスガス用入口通路7aに連通するプロセスガス用入口通路5aと、プロセスガス用入口通路5aと三方弁用通路部の出口通路8aとを連通する出口通路5bと、三方弁用通路部のパージガス用入口通路9aに連通しないでこれを閉止する通路閉止部5cと、出口通路5bに連通し上面に開口する新規パージガス用入口通路5dとを有している。
【選択図】 図2
Description
Claims (2)
- 上面にそれぞれ開口するプロセスガス用入口通路、パージガス用入口通路および両ガス共用の出口通路を形成する下段継手部材の上側に接続されるパージライン変更用ブロック継手であって、下段継手部材のプロセスガス用入口通路に連通するプロセスガス用入口通路と、プロセスガス用入口通路と下段継手部材の出口通路とを連通する出口通路と、下段継手部材のパージガス用入口通路に連通しないでこれを閉止する通路閉止部と、出口通路に連通する新規パージガス用入口通路とを有していることを特徴とするパージライン変更用ブロック継手。
- 1つのラインが、上段に配された流量制御器、二方弁および三方弁と、下段に配された複数の継手部材とを有し、複数のラインが並列状に配置されるとともに、下段に配されて複数のラインのうちの少なくとも2つを接続する継手部材としてのマニホールドブロック継手が設けられており、三方弁の下側に配置された複数の継手部材は、各ラインごとに設けられたブロック継手またはマニホールドブロック継手の一部によって、上面にそれぞれ開口するプロセスガス用入口通路、パージガス用入口通路および両ガス共用の出口通路からなる三方弁用通路部を形成しており、三方弁は、下面にそれぞれ開口するプロセスガス用ガス入口通路、パージガス用入口通路および両ガス共用の出口通路を有し、三方弁によって、パージガスが流量制御器に送られるようになされている流体制御装置において、
複数のラインのうちの少なくとも1つにおいては、三方弁用通路部の上側に三方弁が接続されており、複数のラインのうちの少なくとも1つにおいては、三方弁用通路部の上側にパージライン変更用ブロック継手が接続されており、パージライン変更用ブロック継手は、三方弁用通路部のプロセスガス用入口通路に連通するプロセスガス用入口通路と、プロセスガス用入口通路と三方弁用通路部の出口通路とを連通する出口通路と、三方弁用通路部のパージガス用入口通路に連通しないでこれを閉止する通路閉止部と、出口通路に連通する新規パージガス用入口通路とを有していることを特徴とする流体制御装置。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012043124A JP5868219B2 (ja) | 2012-02-29 | 2012-02-29 | 流体制御装置 |
PCT/JP2013/054170 WO2013129205A1 (ja) | 2012-02-29 | 2013-02-20 | パージライン変更用ブロック継手および流体制御装置 |
US14/130,077 US9169940B2 (en) | 2012-02-29 | 2013-02-20 | Purge line changing block joint and fluid control apparatus |
CN201380001709.7A CN103732972B (zh) | 2012-02-29 | 2013-02-20 | 清洗管线变更用通路块接头以及流体控制装置 |
SG2013086160A SG195084A1 (en) | 2012-02-29 | 2013-02-20 | Purge line change block joint and fluid control device |
KR1020137032568A KR101560962B1 (ko) | 2012-02-29 | 2013-02-20 | 퍼지 라인 변경용 블록 조인트 및 유체 제어 장치 |
TW102106814A TWI610039B (zh) | 2012-02-29 | 2013-02-27 | 沖洗線路變更用塊接頭及流體控制裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012043124A JP5868219B2 (ja) | 2012-02-29 | 2012-02-29 | 流体制御装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013177948A true JP2013177948A (ja) | 2013-09-09 |
JP5868219B2 JP5868219B2 (ja) | 2016-02-24 |
Family
ID=49082405
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012043124A Active JP5868219B2 (ja) | 2012-02-29 | 2012-02-29 | 流体制御装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9169940B2 (ja) |
JP (1) | JP5868219B2 (ja) |
KR (1) | KR101560962B1 (ja) |
CN (1) | CN103732972B (ja) |
SG (1) | SG195084A1 (ja) |
TW (1) | TWI610039B (ja) |
WO (1) | WO2013129205A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016048110A (ja) * | 2014-08-28 | 2016-04-07 | 株式会社フジキン | マニホールドバルブおよび流体制御装置 |
WO2018168559A1 (ja) * | 2017-03-15 | 2018-09-20 | 株式会社フジキン | 継手および流体制御装置 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9454158B2 (en) | 2013-03-15 | 2016-09-27 | Bhushan Somani | Real time diagnostics for flow controller systems and methods |
JP6147113B2 (ja) * | 2013-06-27 | 2017-06-14 | 株式会社フジキン | 流体制御装置用継手および流体制御装置 |
JP6186275B2 (ja) * | 2013-12-27 | 2017-08-23 | 株式会社フジキン | 流体制御装置 |
CN104962880B (zh) * | 2015-07-31 | 2017-12-01 | 合肥京东方光电科技有限公司 | 一种气相沉积设备 |
US10983537B2 (en) | 2017-02-27 | 2021-04-20 | Flow Devices And Systems Inc. | Systems and methods for flow sensor back pressure adjustment for mass flow controller |
KR102411152B1 (ko) * | 2017-05-02 | 2022-06-21 | 피코순 오와이 | Ald 장치, 방법 및 밸브 |
JP7065531B2 (ja) | 2017-05-31 | 2022-05-12 | 株式会社フジキン | バルブ装置および流体制御装置 |
CN113994460A (zh) * | 2019-04-15 | 2022-01-28 | 朗姆研究公司 | 用于气体输送的模块部件系统 |
JP2024512898A (ja) | 2021-03-03 | 2024-03-21 | アイコール・システムズ・インク | マニホールドアセンブリを備える流体流れ制御システム |
Citations (6)
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JPH11311355A (ja) * | 1998-04-27 | 1999-11-09 | Ckd Corp | プロセスガス供給ユニット |
JP2000254900A (ja) * | 1999-01-06 | 2000-09-19 | Canon Inc | 細孔を有する構造体の製造方法、該製造方法により製造された構造体 |
JP2000320697A (ja) * | 1999-05-12 | 2000-11-24 | Benkan Corp | ガス供給制御ライン用弁 |
JP2002515107A (ja) * | 1996-12-03 | 2002-05-21 | キネティック・フルーイド・システムズ | 一体型ガスパネル用組立ブロック |
WO2007032147A1 (ja) * | 2005-09-12 | 2007-03-22 | Fujikin Incorporated | 流体制御装置 |
US7806143B2 (en) * | 2007-06-11 | 2010-10-05 | Lam Research Corporation | Flexible manifold for integrated gas system gas panels |
Family Cites Families (10)
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US5992463A (en) * | 1996-10-30 | 1999-11-30 | Unit Instruments, Inc. | Gas panel |
US6152175A (en) | 1997-06-06 | 2000-11-28 | Ckd Corporation | Process gas supply unit |
JP3871438B2 (ja) | 1997-06-06 | 2007-01-24 | シーケーディ株式会社 | プロセスガス供給ユニット |
JP4238453B2 (ja) | 2000-03-10 | 2009-03-18 | 株式会社東芝 | 流体制御装置 |
EP1132669B1 (en) | 2000-03-10 | 2004-10-13 | Tokyo Electron Limited | Fluid control apparatus |
DE10393800B3 (de) * | 2002-11-26 | 2013-05-23 | Swagelok Company | Modulares Oberflächenmontage-Fluidsystem |
JP2004183771A (ja) * | 2002-12-03 | 2004-07-02 | Fujikin Inc | 流体制御装置 |
WO2007084493A2 (en) * | 2006-01-19 | 2007-07-26 | Asm America, Inc. | High temperature ald inlet manifold |
KR20100024925A (ko) * | 2007-05-31 | 2010-03-08 | 도쿄엘렉트론가부시키가이샤 | 유체 제어 장치 |
US8307854B1 (en) * | 2009-05-14 | 2012-11-13 | Vistadeltek, Inc. | Fluid delivery substrates for building removable standard fluid delivery sticks |
-
2012
- 2012-02-29 JP JP2012043124A patent/JP5868219B2/ja active Active
-
2013
- 2013-02-20 US US14/130,077 patent/US9169940B2/en not_active Expired - Fee Related
- 2013-02-20 KR KR1020137032568A patent/KR101560962B1/ko active IP Right Grant
- 2013-02-20 WO PCT/JP2013/054170 patent/WO2013129205A1/ja active Application Filing
- 2013-02-20 SG SG2013086160A patent/SG195084A1/en unknown
- 2013-02-20 CN CN201380001709.7A patent/CN103732972B/zh not_active Expired - Fee Related
- 2013-02-27 TW TW102106814A patent/TWI610039B/zh not_active IP Right Cessation
Patent Citations (6)
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JP2002515107A (ja) * | 1996-12-03 | 2002-05-21 | キネティック・フルーイド・システムズ | 一体型ガスパネル用組立ブロック |
JPH11311355A (ja) * | 1998-04-27 | 1999-11-09 | Ckd Corp | プロセスガス供給ユニット |
JP2000254900A (ja) * | 1999-01-06 | 2000-09-19 | Canon Inc | 細孔を有する構造体の製造方法、該製造方法により製造された構造体 |
JP2000320697A (ja) * | 1999-05-12 | 2000-11-24 | Benkan Corp | ガス供給制御ライン用弁 |
WO2007032147A1 (ja) * | 2005-09-12 | 2007-03-22 | Fujikin Incorporated | 流体制御装置 |
US7806143B2 (en) * | 2007-06-11 | 2010-10-05 | Lam Research Corporation | Flexible manifold for integrated gas system gas panels |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016048110A (ja) * | 2014-08-28 | 2016-04-07 | 株式会社フジキン | マニホールドバルブおよび流体制御装置 |
WO2018168559A1 (ja) * | 2017-03-15 | 2018-09-20 | 株式会社フジキン | 継手および流体制御装置 |
TWI669460B (zh) * | 2017-03-15 | 2019-08-21 | 日商富士金股份有限公司 | 接頭及流體控制裝置 |
JPWO2018168559A1 (ja) * | 2017-03-15 | 2020-01-16 | 株式会社フジキン | 継手および流体制御装置 |
JP7061808B2 (ja) | 2017-03-15 | 2022-05-02 | 株式会社フジキン | 継手および流体制御装置 |
US11493162B2 (en) | 2017-03-15 | 2022-11-08 | Fujikin Incorporated | Joint and fluid control device |
Also Published As
Publication number | Publication date |
---|---|
US20150152969A1 (en) | 2015-06-04 |
KR20140007007A (ko) | 2014-01-16 |
TW201350717A (zh) | 2013-12-16 |
CN103732972A (zh) | 2014-04-16 |
WO2013129205A1 (ja) | 2013-09-06 |
JP5868219B2 (ja) | 2016-02-24 |
SG195084A1 (en) | 2013-12-30 |
KR101560962B1 (ko) | 2015-10-15 |
US9169940B2 (en) | 2015-10-27 |
TWI610039B (zh) | 2018-01-01 |
CN103732972B (zh) | 2015-12-30 |
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