JP2013153144A - Ｌｅｄリフレクター用不飽和ポリエステル樹脂組成物とそれを用いた粒状物、タブレット、ｌｅｄリフレクター、表面実装型ｌｅｄ発光装置、ｌｅｄ照明器具 - Google Patents

Ｌｅｄリフレクター用不飽和ポリエステル樹脂組成物とそれを用いた粒状物、タブレット、ｌｅｄリフレクター、表面実装型ｌｅｄ発光装置、ｌｅｄ照明器具 Download PDF

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Publication number
JP2013153144A
JP2013153144A JP2012271786A JP2012271786A JP2013153144A JP 2013153144 A JP2013153144 A JP 2013153144A JP 2012271786 A JP2012271786 A JP 2012271786A JP 2012271786 A JP2012271786 A JP 2012271786A JP 2013153144 A JP2013153144 A JP 2013153144A
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Japan
Prior art keywords
led
polyester resin
unsaturated polyester
resin composition
inorganic filler
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Pending
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JP2012271786A
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English (en)
Japanese (ja)
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JP2013153144A5 (enExample
Inventor
Hiroyuki Hasegawa
弘幸 長谷川
Atsushi Nagaoka
淳 長岡
Toshio Kubo
利夫 久保
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Panasonic Corp
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Panasonic Corp
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Publication of JP2013153144A publication Critical patent/JP2013153144A/ja
Publication of JP2013153144A5 publication Critical patent/JP2013153144A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

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  • Led Device Packages (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
JP2012271786A 2011-12-27 2012-12-12 Ｌｅｄリフレクター用不飽和ポリエステル樹脂組成物とそれを用いた粒状物、タブレット、ｌｅｄリフレクター、表面実装型ｌｅｄ発光装置、ｌｅｄ照明器具 Pending JP2013153144A (ja)

Priority Applications (1)

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JP2012271786A JP2013153144A (ja) 2011-12-27 2012-12-12 Ｌｅｄリフレクター用不飽和ポリエステル樹脂組成物とそれを用いた粒状物、タブレット、ｌｅｄリフレクター、表面実装型ｌｅｄ発光装置、ｌｅｄ照明器具

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011286859 2011-12-27
JP2011286859 2011-12-27
JP2012271786A JP2013153144A (ja) 2011-12-27 2012-12-12 Ｌｅｄリフレクター用不飽和ポリエステル樹脂組成物とそれを用いた粒状物、タブレット、ｌｅｄリフレクター、表面実装型ｌｅｄ発光装置、ｌｅｄ照明器具

Publications (2)

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JP2013153144A true JP2013153144A (ja) 2013-08-08
JP2013153144A5 JP2013153144A5 (enExample) 2016-05-12

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JP (1) JP2013153144A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016152276A (ja) * 2015-02-16 2016-08-22 日亜化学工業株式会社 発光装置
JPWO2016009661A1 (ja) * 2014-07-17 2017-04-27 フドー株式会社 光反射体材料、光反射体、及び照明器具
US10141490B2 (en) 2016-08-16 2018-11-27 Nichia Corporation Composite base and method of manufacturing light emitting device
US10243126B2 (en) 2017-01-20 2019-03-26 Nichia Corporation Light emitting device mounting board block, light emitting device, and method of producing the light emitting device
US10790425B2 (en) 2015-04-30 2020-09-29 Nichia Corporation Package and method of manufacturing the same, and light emitting device using the package
JP2021130809A (ja) * 2020-02-19 2021-09-09 住友ベークライト株式会社 成形材料

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55112225A (en) * 1979-02-22 1980-08-29 Toyobo Co Ltd Unsaturated polyester dry injection moldable material with stabilized shot volume
JPS61271638A (ja) * 1985-05-25 1986-12-01 Matsushita Electric Works Ltd 光学式デイスク基板の製法
JPH09132702A (ja) * 1995-11-07 1997-05-20 Showa Highpolymer Co Ltd 淡色透明成形品の製造が可能な樹脂組成物
JP2008144127A (ja) * 2006-11-15 2008-06-26 Hitachi Chem Co Ltd 熱硬化性光反射用樹脂組成物、ならびにこれを用いた光半導体素子搭載用基板、光半導体装置およびこれらの製造方法
JP2010121102A (ja) * 2008-10-20 2010-06-03 Kaneka Corp 高耐光性高熱伝導性樹脂成形体及び照明器具部材
JP2010235756A (ja) * 2009-03-31 2010-10-21 Hitachi Chem Co Ltd 光反射用熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
JP2011074355A (ja) * 2009-09-07 2011-04-14 Nitto Denko Corp 光半導体装置用樹脂組成物およびそれを用いて得られる光半導体装置用リードフレーム、ならびに光半導体装置
JP2011074137A (ja) * 2009-09-29 2011-04-14 Jx Nippon Oil & Energy Corp 液晶ポリエステル樹脂組成物、その成形体、及び光学装置
JP2011219634A (ja) * 2010-04-09 2011-11-04 Hitachi Chem Co Ltd 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55112225A (en) * 1979-02-22 1980-08-29 Toyobo Co Ltd Unsaturated polyester dry injection moldable material with stabilized shot volume
JPS61271638A (ja) * 1985-05-25 1986-12-01 Matsushita Electric Works Ltd 光学式デイスク基板の製法
JPH09132702A (ja) * 1995-11-07 1997-05-20 Showa Highpolymer Co Ltd 淡色透明成形品の製造が可能な樹脂組成物
JP2008144127A (ja) * 2006-11-15 2008-06-26 Hitachi Chem Co Ltd 熱硬化性光反射用樹脂組成物、ならびにこれを用いた光半導体素子搭載用基板、光半導体装置およびこれらの製造方法
JP2010121102A (ja) * 2008-10-20 2010-06-03 Kaneka Corp 高耐光性高熱伝導性樹脂成形体及び照明器具部材
JP2010235756A (ja) * 2009-03-31 2010-10-21 Hitachi Chem Co Ltd 光反射用熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
JP2011074355A (ja) * 2009-09-07 2011-04-14 Nitto Denko Corp 光半導体装置用樹脂組成物およびそれを用いて得られる光半導体装置用リードフレーム、ならびに光半導体装置
JP2011074137A (ja) * 2009-09-29 2011-04-14 Jx Nippon Oil & Energy Corp 液晶ポリエステル樹脂組成物、その成形体、及び光学装置
JP2011219634A (ja) * 2010-04-09 2011-11-04 Hitachi Chem Co Ltd 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2016009661A1 (ja) * 2014-07-17 2017-04-27 フドー株式会社 光反射体材料、光反射体、及び照明器具
JP2016152276A (ja) * 2015-02-16 2016-08-22 日亜化学工業株式会社 発光装置
US10790425B2 (en) 2015-04-30 2020-09-29 Nichia Corporation Package and method of manufacturing the same, and light emitting device using the package
US10141490B2 (en) 2016-08-16 2018-11-27 Nichia Corporation Composite base and method of manufacturing light emitting device
US10243126B2 (en) 2017-01-20 2019-03-26 Nichia Corporation Light emitting device mounting board block, light emitting device, and method of producing the light emitting device
JP2021130809A (ja) * 2020-02-19 2021-09-09 住友ベークライト株式会社 成形材料
JP7651852B2 (ja) 2020-02-19 2025-03-27 住友ベークライト株式会社 成形材料

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