JP2013141735A5 - - Google Patents

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Publication number
JP2013141735A5
JP2013141735A5 JP2012003870A JP2012003870A JP2013141735A5 JP 2013141735 A5 JP2013141735 A5 JP 2013141735A5 JP 2012003870 A JP2012003870 A JP 2012003870A JP 2012003870 A JP2012003870 A JP 2012003870A JP 2013141735 A5 JP2013141735 A5 JP 2013141735A5
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JP
Japan
Prior art keywords
head cover
polishing
top ring
head
dresser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012003870A
Other languages
English (en)
Japanese (ja)
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JP2013141735A (ja
JP5844163B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2012003870A priority Critical patent/JP5844163B2/ja
Priority claimed from JP2012003870A external-priority patent/JP5844163B2/ja
Priority to TW101149798A priority patent/TWI535528B/zh
Priority to US13/736,180 priority patent/US9028297B2/en
Priority to KR1020130003284A priority patent/KR101617493B1/ko
Publication of JP2013141735A publication Critical patent/JP2013141735A/ja
Publication of JP2013141735A5 publication Critical patent/JP2013141735A5/ja
Application granted granted Critical
Publication of JP5844163B2 publication Critical patent/JP5844163B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2012003870A 2012-01-12 2012-01-12 研磨装置 Active JP5844163B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012003870A JP5844163B2 (ja) 2012-01-12 2012-01-12 研磨装置
TW101149798A TWI535528B (zh) 2012-01-12 2012-12-25 Grinding device
US13/736,180 US9028297B2 (en) 2012-01-12 2013-01-08 Polishing apparatus
KR1020130003284A KR101617493B1 (ko) 2012-01-12 2013-01-11 연마 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012003870A JP5844163B2 (ja) 2012-01-12 2012-01-12 研磨装置

Publications (3)

Publication Number Publication Date
JP2013141735A JP2013141735A (ja) 2013-07-22
JP2013141735A5 true JP2013141735A5 (https=) 2015-07-16
JP5844163B2 JP5844163B2 (ja) 2016-01-13

Family

ID=48945959

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012003870A Active JP5844163B2 (ja) 2012-01-12 2012-01-12 研磨装置

Country Status (4)

Country Link
US (1) US9028297B2 (https=)
JP (1) JP5844163B2 (https=)
KR (1) KR101617493B1 (https=)
TW (1) TWI535528B (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3740982A1 (de) 1987-12-03 1989-06-15 Babcock Werke Ag Vorrichtung zum reinigen von rohren
CN104742008B (zh) * 2013-12-27 2017-03-22 中芯国际集成电路制造(上海)有限公司 化学机械研磨方法及化学机械研磨装置
JP6342198B2 (ja) * 2014-03-31 2018-06-13 株式会社荏原製作所 研磨装置の構成部品用のカバー、研磨装置の構成部品、および、研磨装置
US10576604B2 (en) * 2014-04-30 2020-03-03 Ebara Corporation Substrate polishing apparatus
CN104117898B (zh) * 2014-07-02 2016-08-17 吴志坚 艺术抛光工具
KR102177123B1 (ko) * 2014-08-28 2020-11-11 삼성전자주식회사 화학적 기계적 연마 장치
CN106272038A (zh) * 2015-06-04 2017-01-04 有研半导体材料有限公司 一种硅片抛光机边缘导轮
JP7220648B2 (ja) * 2019-12-20 2023-02-10 株式会社荏原製作所 基板処理装置および基板処理方法
CN112720247B (zh) * 2020-12-30 2022-04-19 合肥晶合集成电路股份有限公司 一种化学机械平坦化设备及其应用
CN117067101A (zh) * 2023-08-22 2023-11-17 西可装备制造(衡阳)有限公司 一种研磨摆动机构及研磨抛光机

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2649439B1 (fr) 1989-07-07 1991-09-20 Ferco Int Usine Ferrures Palier intermediaire pour fenetre, porte ou analogue
JP3043578B2 (ja) 1993-10-25 2000-05-22 東芝機械株式会社 研磨装置
JPH09195640A (ja) * 1996-01-19 1997-07-29 Tostem Corp 換気框を備えたサッシまたは戸
JPH1075507A (ja) * 1996-08-29 1998-03-17 Energy Support Corp 開閉装置の防塵方法
JP3722591B2 (ja) * 1997-05-30 2005-11-30 株式会社日立製作所 研磨装置
JPH11129132A (ja) * 1997-10-28 1999-05-18 Amada Eng Center Co Ltd 板材加工複合機における防塵装置
JP3013302B2 (ja) * 1998-03-20 2000-02-28 ユキワ精工株式会社 回転テーブル装置
JPH11320385A (ja) * 1998-05-14 1999-11-24 Matsushita Electric Ind Co Ltd 研磨方法及びその装置
JP2000082859A (ja) * 1998-07-13 2000-03-21 Hitachi Metals Ltd 固体レ―ザ装置
US6033290A (en) * 1998-09-29 2000-03-07 Applied Materials, Inc. Chemical mechanical polishing conditioner
JP2007313644A (ja) * 1999-05-17 2007-12-06 Ebara Corp ドレッシング装置
US6419559B1 (en) * 2000-07-10 2002-07-16 Applied Materials, Inc. Using a purge gas in a chemical mechanical polishing apparatus with an incrementally advanceable polishing sheet
JP2003306259A (ja) * 2002-04-12 2003-10-28 Shinko Electric Ind Co Ltd 長尺帯状体の送り異常検知装置
US7288165B2 (en) * 2003-10-24 2007-10-30 Applied Materials, Inc. Pad conditioning head for CMP process
JP2008166709A (ja) 2006-12-05 2008-07-17 Ebara Corp 基板研磨装置、及び基板研磨設備
JP2009026569A (ja) * 2007-07-19 2009-02-05 Toyota Motor Corp 密閉型電池の気密検査方法及び密閉型電池

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