JP2013140947A - 剥離装置、剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体 - Google Patents
剥離装置、剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体 Download PDFInfo
- Publication number
- JP2013140947A JP2013140947A JP2012245474A JP2012245474A JP2013140947A JP 2013140947 A JP2013140947 A JP 2013140947A JP 2012245474 A JP2012245474 A JP 2012245474A JP 2012245474 A JP2012245474 A JP 2012245474A JP 2013140947 A JP2013140947 A JP 2013140947A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- load
- processed
- substrate
- peeling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003860 storage Methods 0.000 title claims description 6
- 238000000926 separation method Methods 0.000 title abstract description 14
- 238000012545 processing Methods 0.000 claims abstract description 124
- 239000000758 substrate Substances 0.000 claims abstract description 109
- 230000007246 mechanism Effects 0.000 claims abstract description 35
- 238000004140 cleaning Methods 0.000 claims description 107
- 238000000034 method Methods 0.000 claims description 42
- 238000012546 transfer Methods 0.000 claims description 34
- 239000000853 adhesive Substances 0.000 claims description 26
- 230000001070 adhesive effect Effects 0.000 claims description 26
- 238000005259 measurement Methods 0.000 claims description 14
- 238000006116 polymerization reaction Methods 0.000 claims description 6
- 235000012431 wafers Nutrition 0.000 description 382
- 206010040844 Skin exfoliation Diseases 0.000 description 92
- 239000007788 liquid Substances 0.000 description 37
- 238000007689 inspection Methods 0.000 description 26
- 238000012423 maintenance Methods 0.000 description 16
- 238000012805 post-processing Methods 0.000 description 14
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 9
- 239000011261 inert gas Substances 0.000 description 9
- 238000005406 washing Methods 0.000 description 8
- 238000005286 illumination Methods 0.000 description 7
- 238000003384 imaging method Methods 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 230000003028 elevating effect Effects 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- 230000005856 abnormality Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/14—Semiconductor wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
- B32B43/006—Delaminating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1168—Gripping and pulling work apart during delaminating
- Y10T156/1189—Gripping and pulling work apart during delaminating with shearing during delaminating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1961—Severing delaminating means [e.g., chisel, etc.]
- Y10T156/1967—Cutting delaminating means
- Y10T156/1972—Shearing delaminating means
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
【解決手段】剥離装置30は、被処理ウェハWを保持する第1の保持部110と、支持ウェハSを保持する第2の保持部111と、少なくとも第1の保持部110又は第2の保持部111を相対的に水平方向に移動させる移動機構150と、被処理ウェハWと支持ウェハSを剥離する際に、被処理ウェハWと支持ウェハSに作用する荷重を測定するロードセル180と、ロードセル180で測定される荷重が一定になるように移動機構150の水平移動部152における駆動部173を制御する制御部350と、を有している。
【選択図】図3
Description
2 搬入出ステーション
3 処理ステーション
20 第1の搬送装置
30 剥離装置
31 第1の洗浄装置
32 第2の搬送装置
33 第2の洗浄装置
110 第1の保持部
111 第2の保持部
150 移動機構
151 鉛直移動部
152 水平移動部
170 レール
171 支持体
172 ボールネジ
173 駆動部
180 ロードセル
350 制御部
400 マスターロードセル
G 接着剤
S 支持ウェハ
T 重合ウェハ
W 被処理ウェハ
Claims (15)
- 被処理基板と支持基板が接着剤で接合された重合基板を、被処理基板と支持基板に剥離する剥離装置であって、
被処理基板を保持する第1の保持部と、
支持基板を保持する第2の保持部と、
前記第1の保持部又は前記第2の保持部を相対的に水平方向に移動させる移動機構と、
被処理基板と支持基板を剥離する際に、被処理基板と支持基板に作用する荷重を測定する荷重測定部と、
前記荷重測定部で測定される荷重に基づいて前記移動機構を制御する制御部と、を有することを特徴とする、剥離装置。 - 前記制御部は、前記荷重測定部で測定される荷重が一定になるように前記移動機構を制御することを特徴とする、請求項1に記載の剥離装置。
- 前記制御部は、前記荷重測定部で測定される荷重が許容荷重を超えた場合に、前記第1の保持部又は前記第2の保持部の相対的な移動の速度を低下させるように前記移動機構を制御することを特徴とする、請求項1又は2に記載の剥離装置。
- 前記荷重測定部はロードセルであることを特徴とする、請求項1〜3のいずれかに記載の剥離装置。
- 前記荷重測定部よりも荷重の測定精度が良く、前記荷重測定部の校正を行うための荷重校正部を有することを特徴とする、請求項1〜4のいずれかに記載の剥離装置。
- 前記荷重校正部はロードセルであることを特徴とする、請求項5に記載の剥離装置。
- 請求項1〜6のいずれかに記載の剥離装置を備えた剥離システムであって、
前記剥離装置と、前記剥離装置で剥離された被処理基板を洗浄する第1の洗浄装置と、前記剥離装置で剥離された支持基板を洗浄する第2の洗浄装置と、を備えた処理ステーションと、
前記処理ステーションに対して、被処理基板、支持基板又は重合基板を搬入出する搬入出ステーションと、
前記処理ステーションと前記搬入出ステーションとの間で、被処理基板、支持基板又は重合基板を搬送する搬送装置と、を有することを特徴とする、剥離システム。 - 被処理基板と支持基板が接着剤で接合された重合基板を、被処理基板と支持基板に剥離する剥離方法であって、
被処理基板を保持する第1の保持部又は支持基板を保持する第2の保持部を移動機構によって相対的に水平方向に移動させ、被処理基板と支持基板を剥離し、
被処理基板と支持基板を剥離する際に、荷重測定部によって被処理基板と支持基板に作用する荷重を測定し、
前記荷重測定部で測定される荷重に基づいて前記移動機構を制御することを特徴とする、剥離方法。 - 前記荷重測定部で測定される荷重が一定になるように前記移動機構を制御することを特徴とする、請求項8に記載の剥離方法。
- 前記荷重測定部で測定される荷重が許容荷重を超えた場合に、前記第1の保持部又は前記第2の保持部の相対的な移動の速度を低下させるように前記移動機構を制御することを特徴とする、請求項8又は9に記載の剥離方法。
- 前記荷重測定部はロードセルであることを特徴とする、請求項8〜10のいずれかに記載の剥離方法。
- 前記荷重測定部よりも荷重の測定精度が良い荷重校正部を用いて、前記荷重測定部の校正を行うことを特徴とする、請求項8〜11のいずれかに記載の剥離方法。
- 前記荷重校正部はロードセルであることを特徴とする、請求項12に記載の剥離方法。
- 請求項8〜13のいずかに記載の剥離方法を剥離装置によって実行させるために、当該剥離装置を制御する制御部のコンピュータ上で動作するプログラム。
- 請求項14に記載のプログラムを格納した読み取り可能なコンピュータ記憶媒体。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012245474A JP5913053B2 (ja) | 2011-12-08 | 2012-11-07 | 剥離装置、剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体 |
KR1020120131164A KR101864900B1 (ko) | 2011-12-08 | 2012-11-19 | 박리 장치, 박리 시스템, 박리 방법 및 컴퓨터 판독 가능한 기억 매체 |
US13/693,151 US10071544B2 (en) | 2011-12-08 | 2012-12-04 | Separation apparatus, separation system, and separation method |
SG2012090189A SG191505A1 (en) | 2011-12-08 | 2012-12-05 | Separation apparatus, separation system, separation method, program, and computer storage medium |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011269258 | 2011-12-08 | ||
JP2011269258 | 2011-12-08 | ||
JP2012245474A JP5913053B2 (ja) | 2011-12-08 | 2012-11-07 | 剥離装置、剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013140947A true JP2013140947A (ja) | 2013-07-18 |
JP5913053B2 JP5913053B2 (ja) | 2016-04-27 |
Family
ID=48570916
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012245474A Active JP5913053B2 (ja) | 2011-12-08 | 2012-11-07 | 剥離装置、剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体 |
Country Status (4)
Country | Link |
---|---|
US (1) | US10071544B2 (ja) |
JP (1) | JP5913053B2 (ja) |
KR (1) | KR101864900B1 (ja) |
SG (1) | SG191505A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20150101939A (ko) * | 2014-02-27 | 2015-09-04 | 도쿄엘렉트론가부시키가이샤 | 박리 방법, 컴퓨터 기억 매체, 박리 장치 및 박리 시스템 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5870000B2 (ja) * | 2012-09-19 | 2016-02-24 | 東京エレクトロン株式会社 | 剥離装置、剥離システムおよび剥離方法 |
JP6120748B2 (ja) * | 2013-10-11 | 2017-04-26 | 東京エレクトロン株式会社 | 剥離装置、剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体 |
KR20150092398A (ko) * | 2014-02-03 | 2015-08-13 | 삼성디스플레이 주식회사 | 기판 박리 장치, 및 기판 박리 방법 |
TWI662630B (zh) * | 2015-01-27 | 2019-06-11 | 精材科技股份有限公司 | 一種剝離裝置及利用該裝置剝離晶片封裝體表面蓋層的方法 |
JP6283573B2 (ja) | 2014-06-03 | 2018-02-21 | 東京エレクトロン株式会社 | 剥離装置、剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体 |
KR102494032B1 (ko) * | 2018-06-25 | 2023-02-01 | 에이피시스템 주식회사 | 기판 박리장치 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05136016A (ja) * | 1991-04-26 | 1993-06-01 | Sumitomo Electric Ind Ltd | 半導体基板の剥離装置 |
JPH08273992A (ja) * | 1995-03-30 | 1996-10-18 | Hitachi Ltd | 接合装置 |
JP2002100595A (ja) * | 2000-07-21 | 2002-04-05 | Enya Systems Ltd | ウエ−ハ剥離装置及び方法並びにこれを用いたウエ−ハ処理装置 |
US20110253315A1 (en) * | 2010-04-15 | 2011-10-20 | Suss Microtec Lithography, Gmbh | debonding equipment and methods for debonding temporary bonded wafers |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4632718A (en) * | 1984-06-18 | 1986-12-30 | Seiei Kohsan Co., Ltd. | Frame separator with positioning pin |
US5240546A (en) * | 1991-04-26 | 1993-08-31 | Sumitomo Electric Industries, Ltd. | Apparatus for peeling semiconductor substrate |
JP2707189B2 (ja) * | 1992-08-26 | 1998-01-28 | 株式会社日立製作所 | 電子部品の基板からの取外し方法及び装置 |
KR0165467B1 (ko) | 1995-10-31 | 1999-02-01 | 김광호 | 웨이퍼 디본더 및 이를 이용한 웨이퍼 디본딩법 |
US6360940B1 (en) * | 2000-11-08 | 2002-03-26 | International Business Machines Corporation | Method and apparatus for removing known good die |
US6869498B1 (en) * | 2002-02-04 | 2005-03-22 | Applied Materials, Inc. | Chemical mechanical polishing with shear force measurement |
JP4254957B2 (ja) * | 2004-05-25 | 2009-04-15 | 大日本スクリーン製造株式会社 | 基板取出装置およびその方法 |
US20060213537A1 (en) * | 2005-03-23 | 2006-09-28 | Thu Anh To | Vertical wafer platform systems and methods for fast wafer cleaning and measurement |
US20090056424A1 (en) * | 2007-08-29 | 2009-03-05 | Cornell Research Foundation, Inc. | Microscope Rheometer for Measuring Shear and Compression Properties of Biological Samples |
EP2225542A2 (en) * | 2007-12-04 | 2010-09-08 | Techlusion Corporation | Dynamometer |
PT2238618E (pt) * | 2008-01-24 | 2015-09-03 | Brewer Science Inc | Método para montagem reversível de uma bolacha de dispositivo num substrato de suporte |
-
2012
- 2012-11-07 JP JP2012245474A patent/JP5913053B2/ja active Active
- 2012-11-19 KR KR1020120131164A patent/KR101864900B1/ko active IP Right Grant
- 2012-12-04 US US13/693,151 patent/US10071544B2/en active Active
- 2012-12-05 SG SG2012090189A patent/SG191505A1/en unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05136016A (ja) * | 1991-04-26 | 1993-06-01 | Sumitomo Electric Ind Ltd | 半導体基板の剥離装置 |
JPH08273992A (ja) * | 1995-03-30 | 1996-10-18 | Hitachi Ltd | 接合装置 |
JP2002100595A (ja) * | 2000-07-21 | 2002-04-05 | Enya Systems Ltd | ウエ−ハ剥離装置及び方法並びにこれを用いたウエ−ハ処理装置 |
US20110253315A1 (en) * | 2010-04-15 | 2011-10-20 | Suss Microtec Lithography, Gmbh | debonding equipment and methods for debonding temporary bonded wafers |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20150101939A (ko) * | 2014-02-27 | 2015-09-04 | 도쿄엘렉트론가부시키가이샤 | 박리 방법, 컴퓨터 기억 매체, 박리 장치 및 박리 시스템 |
KR102341638B1 (ko) | 2014-02-27 | 2021-12-22 | 도쿄엘렉트론가부시키가이샤 | 박리 방법, 컴퓨터 기억 매체, 박리 장치 및 박리 시스템 |
Also Published As
Publication number | Publication date |
---|---|
US20130146228A1 (en) | 2013-06-13 |
JP5913053B2 (ja) | 2016-04-27 |
KR20130064691A (ko) | 2013-06-18 |
KR101864900B1 (ko) | 2018-06-05 |
SG191505A1 (en) | 2013-07-31 |
US10071544B2 (en) | 2018-09-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5323867B2 (ja) | 基板反転装置、基板反転方法、剥離システム、プログラム及びコンピュータ記憶媒体 | |
JP5379171B2 (ja) | 接合システム、基板処理システム、接合方法、プログラム及びコンピュータ記憶媒体 | |
JP5829171B2 (ja) | 剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体 | |
JP5913053B2 (ja) | 剥離装置、剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体 | |
JP5580806B2 (ja) | 剥離装置、剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体 | |
JP5478565B2 (ja) | 接合システム | |
JP5538282B2 (ja) | 接合装置、接合方法、プログラム及びコンピュータ記憶媒体 | |
WO2013136982A1 (ja) | 剥離装置、剥離システム及び剥離方法 | |
JP5740550B2 (ja) | 剥離装置、剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体 | |
JP5314057B2 (ja) | 剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体 | |
JP5374462B2 (ja) | 剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体 | |
JP5830440B2 (ja) | 剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体 | |
WO2012176629A1 (ja) | 剥離システム、剥離方法、及びコンピュータ記憶媒体 | |
JP5617065B2 (ja) | 剥離方法、プログラム、コンピュータ記憶媒体及び剥離システム | |
JP5717614B2 (ja) | 剥離装置、剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体 | |
JP2013120903A (ja) | 剥離装置、剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体 | |
JP5777549B2 (ja) | 剥離装置、剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体 | |
JP2014003237A (ja) | 剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体 | |
JP5717803B2 (ja) | 剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体 | |
TWI520254B (zh) | 剝離裝置、剝離系統、剝離方法及電腦記憶媒體 | |
JP5552559B2 (ja) | 剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20141202 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150319 |
|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20150319 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20150319 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20150526 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20150528 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150811 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20160308 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20160401 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5913053 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |