JP2013138129A5 - - Google Patents
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- Publication number
- JP2013138129A5 JP2013138129A5 JP2011288681A JP2011288681A JP2013138129A5 JP 2013138129 A5 JP2013138129 A5 JP 2013138129A5 JP 2011288681 A JP2011288681 A JP 2011288681A JP 2011288681 A JP2011288681 A JP 2011288681A JP 2013138129 A5 JP2013138129 A5 JP 2013138129A5
- Authority
- JP
- Japan
- Prior art keywords
- components
- sealing resin
- structural module
- semiconductor device
- mother
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 239000000758 substrate Substances 0.000 claims description 19
- 239000011347 resin Substances 0.000 claims description 15
- 229920005989 resin Polymers 0.000 claims description 15
- 238000007789 sealing Methods 0.000 claims description 15
- 239000004065 semiconductor Substances 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 3
- 239000003990 capacitor Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011288681A JP2013138129A (ja) | 2011-12-28 | 2011-12-28 | 半導体装置およびその製造方法 |
| US14/122,452 US20140183722A1 (en) | 2011-12-28 | 2012-12-21 | Semiconductor device and method for manufacturing same |
| PCT/JP2012/008217 WO2013099194A1 (ja) | 2011-12-28 | 2012-12-21 | 半導体装置およびその製造方法 |
| CN201280026734.6A CN103563077A (zh) | 2011-12-28 | 2012-12-21 | 半导体装置及其制造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011288681A JP2013138129A (ja) | 2011-12-28 | 2011-12-28 | 半導体装置およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013138129A JP2013138129A (ja) | 2013-07-11 |
| JP2013138129A5 true JP2013138129A5 (enExample) | 2014-10-16 |
Family
ID=48696736
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011288681A Ceased JP2013138129A (ja) | 2011-12-28 | 2011-12-28 | 半導体装置およびその製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20140183722A1 (enExample) |
| JP (1) | JP2013138129A (enExample) |
| CN (1) | CN103563077A (enExample) |
| WO (1) | WO2013099194A1 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6634316B2 (ja) * | 2016-03-04 | 2020-01-22 | 日立オートモティブシステムズ株式会社 | 樹脂封止型車載制御装置 |
| WO2020049989A1 (ja) * | 2018-09-07 | 2020-03-12 | 株式会社村田製作所 | モジュールおよびモジュールの製造方法 |
| CN113645759B (zh) * | 2021-08-09 | 2024-03-12 | 维沃移动通信有限公司 | 电路板组件、电子设备和电路板组件的加工方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06260226A (ja) * | 1993-03-01 | 1994-09-16 | Hitachi Denshi Ltd | 基板接続方法及び基板接続端子 |
| JP3117377B2 (ja) * | 1994-11-29 | 2000-12-11 | 京セラ株式会社 | 半導体装置 |
| TW373308B (en) * | 1995-02-24 | 1999-11-01 | Agere Systems Inc | Thin packaging of multi-chip modules with enhanced thermal/power management |
| JP4349728B2 (ja) * | 2000-07-27 | 2009-10-21 | 京セラ株式会社 | 半導体装置 |
| US7613010B2 (en) * | 2004-02-02 | 2009-11-03 | Panasonic Corporation | Stereoscopic electronic circuit device, and relay board and relay frame used therein |
| JP4186843B2 (ja) * | 2004-03-03 | 2008-11-26 | 松下電器産業株式会社 | 立体的電子回路装置 |
| EP1818979B1 (en) * | 2004-12-02 | 2012-07-04 | Murata Manufacturing Co., Ltd. | Electronic component and fabrication method thereof |
| JP2007073849A (ja) * | 2005-09-08 | 2007-03-22 | Sharp Corp | 電子回路モジュールとその製造方法 |
| JP2011054806A (ja) * | 2009-09-02 | 2011-03-17 | Renesas Electronics Corp | 半導体装置およびその製造方法 |
-
2011
- 2011-12-28 JP JP2011288681A patent/JP2013138129A/ja not_active Ceased
-
2012
- 2012-12-21 CN CN201280026734.6A patent/CN103563077A/zh active Pending
- 2012-12-21 WO PCT/JP2012/008217 patent/WO2013099194A1/ja not_active Ceased
- 2012-12-21 US US14/122,452 patent/US20140183722A1/en not_active Abandoned