JP2013110278A - 液処理装置及び液処理方法 - Google Patents
液処理装置及び液処理方法 Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
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- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
【解決手段】基板を保持する基板保持部と、前記基板保持部を回転させる回転駆動部と、前記基板保持部を上昇及び下降させる基板保持部昇降部材と、前記基板に処理液を供給する処理液供給部と、前記基板に前記処理液を供給するときに、前記基板を囲う液受けカップと、前記基板に前記処理液を供給するときに、前記基板と前記液受けカップの上方に位置し、前記基板を乾燥するときに、前記基板を囲い、かつ前記液受けカップの上方に位置する乾燥カップとを備えることを特徴とする液処理装置により上記の課題が達成される。
【選択図】図1
Description
始めに、図1を参照しながら、本発明の実施形態による液処理装置について説明する。本実施形態においては、処理する基板として、半導体ウエハ(以下、ウエハという。)を用いる。
次に、図1〜図6を参照しながら、上記の液処理装置100において実施される液処理方法の一例について説明する。図3は、液処理方法を説明するフローチャートの例である。図4〜図6は、実施される液処理の各工程を説明する説明図である。図1及び図4〜図6を参照しながら、図3の液処理方法について説明する。
10:基板支持部、10a:トッププレート部材、10s:爪部、10n:トッププレートノズル、10L:加熱部
20:貯留槽、20b:底部、20d:堰部、20s:供給部、20n:ベースプレートノズル、20m:吐出口、20s:超音波振動板、23:Oリング
30:駆動部、30M:モータ、30a:基板駆動部、30b:底部駆動部
40:液受けカップ部、40a:第1の収容部、40b:第2の収容部、40g:仕切りガイド、41c:排液口、41d:排液口
50:液体供給源、51:配管(CDIW)、51a:三方弁(CDIW)、56:集合弁、57:供給管
W :ウエハ(基板)
L :液層
Claims (16)
- 基板を保持する基板保持部と、
前記基板保持部を回転させる回転駆動部と、
前記基板保持部を上昇及び下降させる基板保持部昇降部材と、
前記基板に処理液を供給する処理液供給部と、
前記基板に前記処理液を供給するときに、前記基板を囲う液受けカップと、
前記基板に前記処理液を供給するときに、前記基板と前記液受けカップの上方に位置し、前記基板を乾燥するときに、前記基板を囲い、かつ前記液受けカップの上方に位置する乾燥カップと
を備えることを特徴とする液処理装置。 - 前記乾燥カップは、前記基板を乾燥するときに、前記処理液を供給するときの位置よりも高い位置にあることを特徴とする、請求項1に記載の液処理装置。
- 前記乾燥カップは、上部プレートと下部プレートからなる環状形状を有し、前記基板中心に向かって開口する開口部を有していることを特徴とする、請求項1又は2に記載の液処理装置。
- 前記基板保持部と前記乾燥カップは、同期して上昇することを特徴とする、請求項1から3のいずれか一項に記載の液処理装置。
- 前記乾燥カップを上昇及び下降させる乾燥カップ昇降部材を更に有することを特徴とする、請求項1から4のいずれか一項に液処理装置。
- 前記基板を乾燥するときに、前記基板の下面に気体を供給することを特徴とする請求項1から5のいずれか一項に記載の液処理装置。
- 前記乾燥カップと前記液受けカップとの間に、前記乾燥カップの外側の気体を取り込む気流路を有することを特徴とする、請求項1から6のいずれか一項に液処理装置。
- 前記基板保持部は、上昇するときに回転しながら上昇することを特徴とする、請求項1から7のいずれか一項に記載の液処理装置。
- 液体を貯留し、貯留された液体中に前記基板を浸漬可能な液体貯留部を更に有し、前記基板を乾燥するときに前記液体貯留部に純水を貯留することを特徴とする、請求項1から8のいずれか一項に記載の液処理装置。
- 基板を保持して液処理位置において液処理を行う液処理工程と、
前記液処理工程において前記液処理が行われた前記基板を前記液処理位置より上方の乾燥位置にて乾燥する乾燥処理工程と
を含むことを特徴とする液処理方法。 - 前記液処理工程において、前記液処理位置における前記基板が、前記液処理に用いられる処理液を受ける液受けカップに囲まれ、
前記乾燥工程において、前記乾燥位置における前記基板が、当該基板を囲み当該基板に向かって開口する開口部を有する乾燥カップに囲まれて回転されることを特徴とする、請求項10に記載の液処理方法。 - 前記液受けカップと前記乾燥カップの間の空間に気体が供給されることを特徴とする、請求項11に記載の液処理方法。
- 前記液処理位置から前記乾燥位置に前記基板を上昇させる基板上昇工程を更に含むことを特徴とする、請求項10から12のいずれか一項に記載の液処理方法。
- 前記液処理位置から前記乾燥位置に前記基板を上昇させる基板上昇工程を更に含み、
前記基板上昇工程において、前記基板とともに前記乾燥カップが同期して上昇されることを特徴とする、請求項11又は12に記載の液処理方法。 - 前記基板上昇工程において、前記基板が回転しながら上昇することを特徴とする、請求項13又は14に記載の液処理方法。
- 前記乾燥処理工程において、前記乾燥位置より下方に配置される貯留槽に純水を貯留することを特徴とする、請求項10から15のいずれか一項に記載の液処理方法。
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JP2011254269A JP5645796B2 (ja) | 2011-11-21 | 2011-11-21 | 液処理装置及び液処理方法 |
TW101140368A TWI525687B (zh) | 2011-11-21 | 2012-10-31 | 液體處理裝置及液體處理方法 |
US13/680,426 US9346084B2 (en) | 2011-11-21 | 2012-11-19 | Liquid processing apparatus and liquid processing method |
KR1020120131424A KR101678253B1 (ko) | 2011-11-21 | 2012-11-20 | 액처리 장치 및 액처리 방법 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014189152A1 (en) | 2013-05-24 | 2014-11-27 | Otsuka Pharmaceutical Co., Ltd. | Pharmaceutical combination comprising metformin and dihydroquercetin and its use for the treatment of cancer |
CN110137107A (zh) * | 2015-02-12 | 2019-08-16 | 株式会社思可林集团 | 基板处理装置、基板处理系统以及基板处理方法 |
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JP5977727B2 (ja) * | 2013-11-13 | 2016-08-24 | 東京エレクトロン株式会社 | 基板洗浄方法、基板洗浄システムおよび記憶媒体 |
CN107851572B (zh) * | 2015-07-29 | 2022-02-18 | 东京毅力科创株式会社 | 基板处理装置、基板处理方法以及存储介质 |
TWM547751U (zh) * | 2016-03-08 | 2017-08-21 | 應用材料股份有限公司 | 晶圓處理器 |
JP6778548B2 (ja) * | 2016-08-24 | 2020-11-04 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
CN107008690B (zh) * | 2017-04-26 | 2019-05-24 | 朱黎雨 | 一种用于电子产品制造的晶圆清洗设备 |
TWI743391B (zh) * | 2018-09-05 | 2021-10-21 | 大陸商盛美半導體設備(上海)股份有限公司 | 半導體基板清洗裝置 |
KR20220059638A (ko) * | 2020-11-03 | 2022-05-10 | 삼성전자주식회사 | 기판 처리 장치 및 이를 이용한 기판 처리 방법 |
GB202018030D0 (en) * | 2020-11-17 | 2020-12-30 | Spts Technologies Ltd | Spin rinse dryer with improved drying characteristics |
TWI793539B (zh) * | 2021-03-03 | 2023-02-21 | 奇勗科技股份有限公司 | 用於半導體製程的晶圓清潔設備 |
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JP3555724B2 (ja) | 1997-09-04 | 2004-08-18 | 大日本スクリーン製造株式会社 | 基板処理装置 |
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KR101019445B1 (ko) * | 2006-04-18 | 2011-03-07 | 도쿄엘렉트론가부시키가이샤 | 액 처리 장치 |
JP5349944B2 (ja) | 2008-12-24 | 2013-11-20 | 株式会社荏原製作所 | 基板処理装置の液飛散防止カップ、基板処理装置、及びその運転方法 |
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JP2002299213A (ja) * | 2001-03-30 | 2002-10-11 | Tokyo Electron Ltd | 基板処理装置 |
JP2006073753A (ja) * | 2004-09-01 | 2006-03-16 | Renesas Technology Corp | 基板洗浄装置 |
JP2010040818A (ja) * | 2008-08-06 | 2010-02-18 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014189152A1 (en) | 2013-05-24 | 2014-11-27 | Otsuka Pharmaceutical Co., Ltd. | Pharmaceutical combination comprising metformin and dihydroquercetin and its use for the treatment of cancer |
CN110137107A (zh) * | 2015-02-12 | 2019-08-16 | 株式会社思可林集团 | 基板处理装置、基板处理系统以及基板处理方法 |
CN110137107B (zh) * | 2015-02-12 | 2024-04-02 | 株式会社思可林集团 | 基板处理装置、基板处理系统以及基板处理方法 |
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US9346084B2 (en) | 2016-05-24 |
US20130125931A1 (en) | 2013-05-23 |
KR20130056185A (ko) | 2013-05-29 |
TW201335988A (zh) | 2013-09-01 |
TWI525687B (zh) | 2016-03-11 |
KR101678253B1 (ko) | 2016-11-21 |
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