JP2013086217A - 研磨パッド用ウレタン樹脂組成物、ポリウレタン研磨パッド及びポリウレタン研磨パッドの製造方法 - Google Patents
研磨パッド用ウレタン樹脂組成物、ポリウレタン研磨パッド及びポリウレタン研磨パッドの製造方法 Download PDFInfo
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- polishing pad
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- urethane resin
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- acid
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
- C08L75/04—Polyurethanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
- C08G18/12—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step using two or more compounds having active hydrogen in the first polymerisation step
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/32—Polyhydroxy compounds; Polyamines; Hydroxyamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Polyurethanes Or Polyureas (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011229669A JP2013086217A (ja) | 2011-10-19 | 2011-10-19 | 研磨パッド用ウレタン樹脂組成物、ポリウレタン研磨パッド及びポリウレタン研磨パッドの製造方法 |
| KR1020120103093A KR20130043060A (ko) | 2011-10-19 | 2012-09-18 | 연마 패드용 우레탄 수지 조성물 및 폴리우레탄 연마 패드 |
| TW101134971A TW201323496A (zh) | 2011-10-19 | 2012-09-24 | 拋光墊用胺基甲酸酯樹脂組成物及聚胺基甲酸酯拋光墊 |
| CN201210397917.0A CN103059551B (zh) | 2011-10-19 | 2012-10-18 | 研磨垫用氨基甲酸酯树脂组合物以及聚氨酯研磨垫 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| JP2011229669A JP2013086217A (ja) | 2011-10-19 | 2011-10-19 | 研磨パッド用ウレタン樹脂組成物、ポリウレタン研磨パッド及びポリウレタン研磨パッドの製造方法 |
Publications (2)
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| JP2013086217A true JP2013086217A (ja) | 2013-05-13 |
| JP2013086217A5 JP2013086217A5 (pt) | 2014-10-23 |
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Country Status (4)
| Country | Link |
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| JP (1) | JP2013086217A (pt) |
| KR (1) | KR20130043060A (pt) |
| CN (1) | CN103059551B (pt) |
| TW (1) | TW201323496A (pt) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2013146892A1 (ja) * | 2012-03-29 | 2013-10-03 | 富士紡ホールディングス株式会社 | 研磨パッド及び研磨パッドの製造方法 |
| JP2015059199A (ja) * | 2013-09-20 | 2015-03-30 | Dic株式会社 | ウレタン組成物及び研磨材 |
| CN104742031A (zh) * | 2015-04-07 | 2015-07-01 | 蓝思科技（长沙）有限公司 | 一种调节研磨垫磨削切削力的组合物、方法及模具 |
| JP2015208854A (ja) * | 2014-04-25 | 2015-11-24 | ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド | 化学機械研磨パッド |
| JP2016112640A (ja) * | 2014-12-15 | 2016-06-23 | Dic株式会社 | 研磨パッド |
| WO2017217278A1 (ja) * | 2016-06-16 | 2017-12-21 | Dic株式会社 | 研磨パッド、研磨パッドの製造方法及び研磨方法 |
| KR101949911B1 (ko) * | 2017-09-11 | 2019-02-19 | 에스케이씨 주식회사 | 다공성 폴리우레탄 연마패드 및 이의 제조방법 |
| KR101949905B1 (ko) * | 2017-08-23 | 2019-02-19 | 에스케이씨 주식회사 | 다공성 폴리우레탄 연마패드 및 이의 제조방법 |
| WO2019050365A1 (ko) * | 2017-09-11 | 2019-03-14 | 에스케이씨 주식회사 | 다공성 폴리우레탄 연마패드 및 이의 제조방법 |
| WO2020095832A1 (ja) * | 2018-11-09 | 2020-05-14 | 株式会社クラレ | 研磨層用ポリウレタン、研磨層、研磨パッド及び研磨層の改質方法 |
| WO2021011260A1 (en) * | 2019-07-12 | 2021-01-21 | Cabot Microelectronics Corporation | Polishing pad employing polyamine and cyclohexanedimethanol curatives |
| CN114874409A (zh) * | 2022-04-26 | 2022-08-09 | 江苏利宏科技发展有限公司 | 一种基于聚醚多元醇的聚氨酯树脂及其制备方法 |
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| CN104261726B (zh) * | 2014-09-18 | 2016-02-03 | 蓝思科技股份有限公司 | 一种光学玻璃双面精加工专用研磨垫及其制备方法 |
| CN104772693B (zh) * | 2015-04-20 | 2017-10-17 | 蓝思科技（长沙）有限公司 | 一种用于加工超硬陶瓷的金刚石研磨垫及其制备方法 |
| SG11201704554SA (en) * | 2016-04-06 | 2017-11-29 | Kpx Chemical Co Ltd | Method of manufacturing polishing pad |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2013202775A (ja) * | 2012-03-29 | 2013-10-07 | Fujibo Holdings Inc | 研磨パッド及び研磨パッドの製造方法 |
| WO2013146892A1 (ja) * | 2012-03-29 | 2013-10-03 | 富士紡ホールディングス株式会社 | 研磨パッド及び研磨パッドの製造方法 |
| JP2015059199A (ja) * | 2013-09-20 | 2015-03-30 | Dic株式会社 | ウレタン組成物及び研磨材 |
| US11396081B2 (en) | 2014-04-25 | 2022-07-26 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
| JP2015208854A (ja) * | 2014-04-25 | 2015-11-24 | ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド | 化学機械研磨パッド |
| JP2016112640A (ja) * | 2014-12-15 | 2016-06-23 | Dic株式会社 | 研磨パッド |
| CN104742031A (zh) * | 2015-04-07 | 2015-07-01 | 蓝思科技（长沙）有限公司 | 一种调节研磨垫磨削切削力的组合物、方法及模具 |
| WO2017217278A1 (ja) * | 2016-06-16 | 2017-12-21 | Dic株式会社 | 研磨パッド、研磨パッドの製造方法及び研磨方法 |
| JPWO2017217278A1 (ja) * | 2016-06-16 | 2018-11-08 | Dic株式会社 | 研磨パッド、研磨パッドの製造方法及び研磨方法 |
| KR101949905B1 (ko) * | 2017-08-23 | 2019-02-19 | 에스케이씨 주식회사 | 다공성 폴리우레탄 연마패드 및 이의 제조방법 |
| KR101949911B1 (ko) * | 2017-09-11 | 2019-02-19 | 에스케이씨 주식회사 | 다공성 폴리우레탄 연마패드 및 이의 제조방법 |
| WO2019050365A1 (ko) * | 2017-09-11 | 2019-03-14 | 에스케이씨 주식회사 | 다공성 폴리우레탄 연마패드 및 이의 제조방법 |
| US11642752B2 (en) | 2017-09-11 | 2023-05-09 | Sk Enpulse Co., Ltd. | Porous polyurethane polishing pad and process for preparing the same |
| WO2020095832A1 (ja) * | 2018-11-09 | 2020-05-14 | 株式会社クラレ | 研磨層用ポリウレタン、研磨層、研磨パッド及び研磨層の改質方法 |
| JPWO2020095832A1 (ja) * | 2018-11-09 | 2021-10-07 | 株式会社クラレ | 研磨層用ポリウレタン、研磨層、研磨パッド及び研磨層の改質方法 |
| JP7104174B2 (ja) | 2018-11-09 | 2022-07-20 | 株式会社クラレ | 研磨層用ポリウレタン、研磨層、研磨パッド及び研磨層の改質方法 |
| WO2021011260A1 (en) * | 2019-07-12 | 2021-01-21 | Cabot Microelectronics Corporation | Polishing pad employing polyamine and cyclohexanedimethanol curatives |
| TWI791157B (zh) * | 2019-07-12 | 2023-02-01 | 美商Ｃｍｃ材料股份有限公司 | 採用聚胺及環己烷二甲醇固化劑之研磨墊 |
| CN114874409A (zh) * | 2022-04-26 | 2022-08-09 | 江苏利宏科技发展有限公司 | 一种基于聚醚多元醇的聚氨酯树脂及其制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103059551B (zh) | 2017-06-06 |
| TW201323496A (zh) | 2013-06-16 |
| KR20130043060A (ko) | 2013-04-29 |
| CN103059551A (zh) | 2013-04-24 |
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